Panasonic MN1382-R Cmos lsis for voltage detection Datasheet

Microcomputer Peripheral LSIs
MN1380 Series
CMOS LSIs for Voltage Detection
Overview
The MN1380 series are elements that monitor the power
supply voltage supplied to microcomputers and other LSI
systems and issue reset signals for initializing the system
after the power is first applied or for preventing runaway
operation when the supply voltage fluctuates.
There is a choice of three output types: CMOS output,
N-channel open drain output, and inverted CMOS output. There are also three package types: M, TO-92, and a
mini type for surface mounting.
Choose the ideal element for your application from the
series' wide selection of detection ranks (17 ranks between
2.0 and 4.9 volts), output types, and package types.
Pin Assignment
23
MN1380 - R
2
3
1
M type package
Features
Three-pin element requiring no adjustment
Wide selection of detection ranks (17 ranks between
2.0 and 4.9 volts)
Highly precise detection voltage
Detection voltage with hysteresis characteristic
∆VD = 50 mV for ranks C to K
∆VD = 100 mV for ranks L to U
Low current consumption: IDD = 1µA (typ.) for VDD
=5V
Low fluctuation in detection voltage with temperature (typ. 1 mV/˚C)
Wide selection of output types: CMOS output, Nchannel open drain output, and inverted CMOS
output
Wide selection of package types: M, TO-92, and a
mini type for surface mounting.
1381
23R
1
2
3
TO-92 type package
2
LCR
Applications
Battery checkers
1
3
Power outage detectors
Level discriminators
Memory backup systems
Mini type package
1=OUT
2=VDD
3=VSS
Microcomputer reset circuits
Reset circuits for other electronic circuits
1
MN1380 Series
Microcomputer Peripheral LSIs
MN1380 Series Naming Conventions
The MN1380 series offers a wide selection of detection ranks, output types, package types, and packaging. All
combinations use the following naming conventions. When ordering, be sure to give the correct part number using
these naming conventions.
MN13801–R (TA)
Winding direction for tape packaging
(TA) ...... Tape packaging for TO-92 type package
(TX) ...... Embossed tape packing for mini type package
(TW) ..... Embossed tape packing for mini type package
For further details, see the package specifications.
Detection voltage rank (C to U)
Output type:
Blank ········ CMOS output
1 ················ N-channel open drain output
2 ················ inverted CMOS output
Package:
0 ················ M type package
1 ················ TO-92 type package
2 ················ Mini type package
Matsushita Electronics Corporation MN1380 series of voltage detection CMOS
LSIs with low current consumptions
(Example)
MN13821–R (TW)
Embossed tape packaging
R rank (detection voltage of 4.0 to 4.3 V)
N-channel open drain output
Mini type package
MN1380 series of voltage detection CMOS LSIs with low current consumption
Minimum Packaging Unit
Bulk (M and TO-92 types) ·············· 1,000
Magazine (Mini type) ······················ 50
Taping (Mini and TO-92 types) ······· 3,000
2
Microcomputer Peripheral LSIs
MN1380 Series
Series Lineup
Package
Output
CMOS output
M type Package
MN1380
TO-92 type Package
MN1381
Mini type Package
MN1382
N-channel open drain output
MN13801
MN13811
MN13821
Inverted CMOS output
MN13802
MN13812
MN13822
Detection Ranks (on Voltage)
Rank
Detection Voltage for Drop in Power Supply Voltage (VDL)
C
min
2.0
max
2.2
D
2.1
2.3
E
2.2
2.4
F
2.3
2.5
G
2.4
2.6
H
2.5
2.7
J
2.6
2.9
K
2.8
3.1
L
3.0
3.3
M
3.2
3.5
N
3.4
3.7
P
3.6
3.9
Q
3.8
4.1
R
4.0
4.3
S
4.2
4.5
T
4.4
4.7
U
4.6
4.9
Unit
Detection Voltage Hysteresis Width (∆VD)
Unit
min
max
V
50
300
mV
V
50
300
mV
V
100
300
mV
3
MN1380 Series
Microcomputer Peripheral LSIs
Block Diagram
2
Voltage
Reference 1
VDD
+
Comparator
–
*1
Output Circuit
Level Converter
1
OUT
+
Comparator
Voltage
Reference 2
–
3
VSS
Note *1: Circuits vary slightly depending on the output type (CMOS output, N-channel open drain output, or inverted CMOS
output)
Pin Descriptions
4
Pin No.
1
Symbol
OUT
Function Description
Reset signal output pin
2
VDD
Power supply pin
3
VSS
Ground pin
Microcomputer Peripheral LSIs
Absolute Maximum Ratings
MN1380 Series
VSS=0V, Ta=25˚C
Parameter
Power supply voltage
Symbol
VDD
Rating
7.0
Output voltage
VO
– 0.3 to VDD +0.3
V
Operating ambient temperature
Ta
–20 to +70
˚C
Storage temperature
Tstg
–55 to +125
˚C
Recommended Operating Conditions
Parameter
Power supply
voltage
Symbol
VDD
Unit
V
VSS=0V, Ta=25˚C
Conditions
See Figures 1 and 4.
min
1.5
typ
max
6.0
Unit
V
Electrical Characteristics
1) DC Characteristics VSS=0V, Ta=–20˚C to +70˚C
Parameter
Power supply current
Symbol
Conditions
IDD
VDD = 5 V *1
min
typ
max
Unit
1
5
µA
*2
*2
V
*2
*2
mV
0.8VDD
VDD
Load resistance = 10 kW
Detection voltage for drop
in power supply voltage *2
Detection voltage hysteresis
width *2
"H" level output voltage
VDL
Ta=25˚C
∆VD
See Figures 1 and 4.
VOH
CMOS output
IOH=– 40µA
Inverted
VDD=1.8V
CMOS output IOH=– 0.5mA
"L" level output voltage
VOL
N-channel open
VDD=1.8V
drain output
IOL=0.7mA
Inverted
VDD=6.0V
0.8
VDD
V
–1.5
VSS
0.4
VSS
0.6
V
CMOS output IOH=0.3mA
Notes
*1: This includes the output pin's leakage current.
*2: For particulars, see the detection voltage rank table.
5
MN1380 Series
Microcomputer Peripheral LSIs
Electrical Characteristics (continued)
2) AC Characteristics
Parameter
VSS=0V, Ta=25˚C
Symbol
Conditions
Rank
C
MN1380
MN1381
MN1382
Allowable Value (typ)
MN13801
MN13802
MN13811
MN13812
MN13821
MN13822
Unit
D
E
3.0
2.5
230.0
3.0
3.0
100.0
2.0
4.0
30.0
250.0
160.0
3.0
115.0
100.0
3.0
15.0
35.0
3.0
F
G
Reset release time
tOH
See
H
Figures
J
2 and 3.
K
µs
L
M
N
P
Q
R
S
T
C
D
E
F
G
Reset time
tOL
See
H
Figures
J
2 and 3.
K
L
M
N
P
Q
R
S
T
6
µs
Microcomputer Peripheral LSIs
MN1380 Series
Description of Operation
VDD
VDH
VDL
1.5V
0V
t
VOUT
CMOS output, N-channel
open drain output
MN1380/1381/1382
MN13801/13811/13821
tOH
tOH
tOL
tOL
0V
VOUT
t
Inverted CMOS
output Figure
MN13802/13812/13822
tOL
tOL
tOH
0V
tOH
t
Figure 1. Description of Operation
Notes
1: Output cannot be specified for power supply voltages under 1.5 V because operation is not guaranteed for that range.
2: VDL: Detection voltage for drop in power supply voltage
VDH: Detection voltage for rise in power supply voltage
tOL : Time lag between the time that the power supply voltage reaches the detection voltage (VDL or VDH) and the time that the
output pin (OUT) goes to "L" level.
tOH : Time lag between the time that the power supply voltage reaches the detection voltage (VDL or VDH) and the time that
the output pin (OUT) goes to "H" level.
3: These characteristics for the N-channel open drain output are when a load resistor is connected between the OUT and VDD
pins.
7
MN1380 Series
Microcomputer Peripheral LSIs
Description for Measuring the Output Characteristics
VDD
6.0V
1.6V
0V
6.0V
t
CMOS output, N-channel
open drain output
MN1380/1381/1382
MN13801/13811/13821
tOH
1.5V
tOL
1.0V
0V
t
Inverted CMOS output
MN13802/13812/13822
6.0V
1.6V
1.5V
1.0V
tOH
tOH
0V
t
Figure 2. Description chart of Measuring the Output Characteristics
100kΩ
VDD
Switch: Connect when measuring
N-channel open drain output
(MN13801/MN13811/MN13821)
MN1380 Series
100pF
VOUT
Figure 3. Circuit for Measuring the Output Characteristics
8
Microcomputer Peripheral LSIs
MN1380 Series
Description for Measuring the I/O Characteristics
VOUT
CMOS output, N-channel
open drain output
MN1380/1381/1382
MN13801/13811/13821
∆VD
Operation indeterminate
0
0
1.5V
VDD
VDL
VDH
VOUT
Inverted CMOS output
MN13802/13812/13822
∆VD
Operation
indeterminate
0
0
1.5V
VDD
VDL
VDH
Figure 4. Description chart for Measuring the I/O Characteristics
Notes
1: Output cannot be specified for power supply voltages under 1.5 V because operation is not guaranteed for that range.
2: VDL: Detection voltage for drop in power supply voltage
VDH: Detection voltage for rise in power supply voltage
3: These characteristics for the N-channel open drain output are when a load resistor is connected between the OUT and VDD pins.
9
MN1380 Series
Microcomputer Peripheral LSIs
Application Circuit Example
Connect resistors, capacitors, and the like only to the output pin on the MN1380 series element. Note that connecting them to the Power source pins changes VDH, VDL, and ∆VD.
Sample Circuit 1
Sample Circuit 2
VDD
VDD
R
OUT
MN1380
Series
C
Select the values of R and C to match the application.
10
OUT
MN1380
Series
C
Microcomputer Peripheral LSIs
MN1380 Series
Package Dimensions (Unit:mm)
M type package
6.9±0.2
1.5
2.5±0.2
1.5
4.5±0.2
0.4
1.0
1.0
4.1±0.2
0.7R
0.55±0.10
0.45±0.10
1.25
1
2
3
1.25
2.5
2.5±0.5 2.5±0.5
1.25
0.85
11
MN1380 Series
Microcomputer Peripheral LSIs
Package Dimensions (continued)(Unit:mm)
TO-92 type package
4.0±0.2
13.5±0.5
5.1±0.2
5.0±0.2
+0.2
0.45 -0.1
2.54
1 2 3
12
2.3±0.2
Microcomputer Peripheral LSIs
MN1380 Series
Package Dimensions (continued)(Unit:mm)
Mini type package
+0.20
2.9 -0.05
+0.10
0.4 -0.05
+0.2
3
0.95
0.3
+0.10
0.16 -0.05
0.8
1.9±0.2
+0.2
0.65±0.15
0.95
1.1 -0.1
1
2.8 -0.3
1.5 -0.05
+0.25
2
0.4±0.2
0.1
13
MN1380 Series
Microcomputer Peripheral LSIs
Reference Characteristics
The following characteristics curves represent results from a specific sample therefore they do not guarantee the
characteristics for the final product.
1.4
1.2
IDD(µA )
1.0
VSS
OUT
0.8
VDD
A
0.6
0.4
V
0.2
0
0
1.0
2.0
5.0
3.0
4.0
VDD(V)
6.0
Figure 5.a. IDD vs. VDD Characteristic (Rank Q)
7.0
Figure 5.b. Measurement Circuit
2.0
VSS
IDD(µA )
1.5
OUT
VDD
A
1.0
5V
0.5
–40
–20
0
20
40
60
80
Ambient temperature, Ta (˚C)
Figure 6.a. IDD Temperature Characteristic (Rank Q)
14
Figure 6.b. Measurement Circuit
Microcomputer Peripheral LSIs
MN1380 Series
Reference Characteristics (continued)
4.8
4.6
4.4
VSS
VDL,VDH(V)
4.2
VDH
OUT
V
VDD
4.0
VDL
3.8
V
3.6
3.4
–40 –20
0
20
40
60
80
Temperature Ta(˚C)
Figure 7.a. VDL/VDH Temperature Characteristic (Rank Q)
Figure 7.b. Measurement Circuit
0.3
0.25
VSS
OUT
∆VD(V)
0.2
0.15
V
VDD
0.1
V
0.05
0
–40 –20
0
20
40 60
80
Ambient temperature, Ta (˚C)
Figure 8.a. ∆VD Temperature Characteristic (Rank Q)
Figure 8.b. Measurement Circuit
15
MN1380 Series
Microcomputer Peripheral LSIs
Reference Characteristics (continued)
3
–30˚C
Room temperature
80˚C
VSS
2
OUT
IOL(mA)
VDD
A
1
1.8V
V
0
0
0.5
1.0
1.5
2.0
2.5
3.0
VOL(V)
Figure 9.a. IOL vs. VOL Characteristic
20
Figure 9.b. Measurement Circuit
–30˚C
Room temperature
15
VSS
| IOH | (mA)
80˚C
VDD
10
A
5V
V
5
0
0
1
2
3
VOL(V)
4
Figure 10.a. IOH vs. VOH Characteristic
16
OUT
5
Figure 10.b. Measurement Circuit
Microcomputer Peripheral LSIs
MN1380 Series
Reference Characteristics (continued)
2.5
2.0
VSS
OUT
IOL(mA)
1.5
VDD
A
1.0
1.8V
V
0.5
0
–40
–20
0
20
40
60
Ambient temperature, Ta (˚C)
80
Figure 11.a. IOL vs. Temperature Characteristic
Figure 11.b. Measurement Circuit
7.0
6.5
| IOH | (mA)
VSS
6.0
OUT
VDD
A
5.5
5V
V
5.0
4.5
–40
–20
0
20
40
60
80
Ambient temperature, Ta (˚C)
Figure 12.a. IOH vs. Temperature Characteristic
Figure 12.b. Measurement Circuit
17
MN1380 Series
Microcomputer Peripheral LSIs
TO-92 Type Package Taping-Specifications (MN1381/MN13811/MN13812)
∆h1
A1
P
∆h2
t1
t2
W
W0
H0
l1 H1
W2
H
A
P1
0
T
d
F1 F2
Drawing direction
øD0
P0
Figure 13. TO-92 Type Package Taping-Dimensions (Ammunition pack)
TO-92 Type Package Taping Dimensions (Ammunition pack)
Name
Product height*
Symbol
A
Length (mm)
5.3 max
Product width*
A1
Product thickness*
T
Lead width*
d
Taped lead length
l1
2.0 max
Product pitch
P
Name
Adhesive tape width
Symbol
W0
5.2 max
Feed hole position
W1
9.0±0.5
4.2 max
Adhesive tape position
W2
0.5 max
Distance to top of product
H
25.0 max
12.7±1.0
Distance to
bottom of product
H0
19.0±0.5
16.0±0.5
0.45 +0.15
– 0.1
Length (mm)
6.0±0.5
Feed hole pitch
P0
12.7±0.3
Lead clinch height
H1
Feed hole position
P1
6.35±0.5
Feed hole diameter
D0
4.0±0.2
Lead spacing
F1, F2
Tape thickness
t1
0.7±0.2
Product deflection angle
∆h1, ∆h2
Total tape thickness
t2
1.5 max
Tape width
W
2.5 +0.5
– 0.2
2.0 max
18.0 +1.0
– 0.5
Note*1: For further details, see the specifications issued separately.
25 elements (example)
Unit: mm
Leave the space for at
least three elements
B
D
41
E
H
250
H
W
330
W
Figure 14. Box Dimensions for TO-92 Type Packages with Ammunition pack
18
D
Microcomputer Peripheral LSIs
MN1380 Series
Embossed Taping Specifications for Mini Type Package (MN1382/MN13821/MN13822)
There is a choice of two orientations, TW and TX, for the product relative to the tape.
TW
TX
Tape feed hole
Tape feed hole
Drawing
direction
(Marking surface on top)
Drawing
direction
(Marking surface on top)
Figure 16. TX Orientation
Unit: mm
+0.1
-0
4.0±0.1
A
t+0.3±0.1
3.3±0.1
1.75±0.1
ø1.5
3.5±0.05
B
3.2±0.1
4.0±0.1
Product orientation A is labeled TW; orientation B, TX.
Figure 17. Embossed Taping Dimensions for Mini Type Package
Unit: mm
ø178±2.0
0.5
2±
ø80±1.0
ø21±0.8
ø13±0.5
8.0±0.3
1.75±0.1
Figure 15. TW Orientation
2±0.5
10±1.5
3,000 packages per reel
Figure 18. Embossed Taping Reel Dimensions for Mini Type Package
19
MN1380 Series
Microcomputer Peripheral LSIs
Reliability Testing Results for MN1380 Series
(1) M type package (MN1380/MN13801/MN13802) and TO-92 type package (MN1381/MN13811/MN13812)
Test Subjects
Test Conditions
Results
Operating lifetime test
VDD=5.5V, Ta=125˚C, t=1000hrs
0/15
High-temperature storage test
Ta=150˚C, t=1000hrs
0/15
Low-temperature storage test
Ta=–65˚C, t=1000hrs
0/15
High-temperature,
Ta=85˚C, RH=85%, t=1000hrs
0/15
VDD=5.5V, Ta=85˚C, RH=85%, t=1000hrs
0/15
Ta=150˚C and –65˚C.
0/15
high-humidity storage test
High-temperature,
high-humidity bias test
Thermal shock test
Five minutes at each temperature for ten cycles
Temperature cycle test
Ta=150˚C and –65˚C.
0/15
Thirty minutes at each temperature for ten cycles
Pressure cooker test
Two atmospheres for 50 hours at ambient temperature (Ta) of 121˚C
0/15
Soldering test
Ambient temperature (Ta) of 230˚C for five seconds
0/15
Solder heat resistance test
Ambient temperature (Ta) of 270˚C for ten seconds
0/15
(2) Mini type package (MN1382/MN13821/MN13822)
Test Subjects
Operating lifetime test
Test Conditions
VDD=5.5V, Ta=125˚C, t=1000hrs
Results
0/15
High-temperature storage test
Ta=150˚C, t=1000hrs
0/15
Low-temperature storage test
Ta=–65˚C, t=1000hrs
0/15
High-temperature,
Ta=85˚C, RH=85%, t=1000hrs
0/15
VDD=5.5V, Ta=85˚C, RH=85%, t=1000hrs
0/15
Thermal shock test
Ta=150˚C and –65˚C.
0/15
Temperature cycle test
Ta=150˚C and –65˚C.
high-humidity storage test
High-temperature,
high-humidity bias test
Five minutes at each temperature for ten cycles
0/15
Thirty minutes at each temperature for ten cycles
Pressure cooker test *1
Two atmospheres for 24 hours at ambient temperature (Ta) of 121˚C
0/15
Soldering test
Ambient temperature (Ta) of 230˚C for five seconds
0/15
Solder heat resistance test *1
Ambient temperature (Ta) of 260˚C for five seconds
0/15
Note*1: Note that the testing conditions for the mini package differ from those for the other two packages.
20
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