Fairchild MOC3163SR2VM 6-pin dip zero-cross phototriac driver optocoupler (600v peak) Datasheet

6-PIN DIP ZERO-CROSS
PHOTOTRIAC DRIVER OPTOCOUPLER
(600V PEAK)
MOC3061-M
MOC3062-M
MOC3063-M
MOC3162-M
PACKAGE
MOC3163-M
SCHEMATIC
ANODE 1
6 MAIN TERM.
6
6
5 NC*
CATHODE 2
1
N/C 3
1
ZERO
CROSSING
CIRCUIT
4 MAIN TERM.
*DO NOT CONNECT
(TRIAC SUBSTRATE)
6
1
DESCRIPTION
The MOC306X-M and MOC316X-M devices consist of a GaAs infrared emitting diode optically coupled to a monolithic silicon
detector performing the function of a zero voltage crossing bilateral triac driver. They are designed for use with a triac in the interface of logic systems to equipment powered from 115/240 VAC lines, such as solid-state relays, industrial controls, motors, solenoids and consumer appliances, etc.
FEATURES
• Simplifies logic control of 115/240 VAC power
• Zero voltage crossing
• dv/dt of 1000 V/µs guaranteed (MOC316X-M),
– 600 V/ms guaranteed (MOC306X-M)
• VDE recognized (File # 94766)
– ordering option V (e.g., MOC3063V-M)
• Underwriters Laboratories (UL) recognized (File #E90700, volume 2)
APPLICATIONS
•
•
•
•
•
•
•
•
Solenoid/valve controls
Static power switches
Temperature controls
AC motor starters
Lighting controls
AC motor drives
E.M. contactors
Solid state relays
© 2003 Fairchild Semiconductor Corporation
Page 1 of 10
5/29/03
6-PIN DIP ZERO-CROSS
PHOTOTRIAC DRIVER OPTOCOUPLER
(600V PEAK)
MOC3061-M
MOC3062-M
MOC3063-M
MOC3162-M
MOC3163-M
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Parameters
Symbol
Device
Value
Units
Storage Temperature
TSTG
All
-40 to +150
°C
Operating Temperature
TOPR
All
-40 to +85
°C
Lead Solder Temperature
TSOL
All
260 for 10 sec
°C
TOTAL DEVICE
TJ
All
-40 to +100
°C
VISO
All
7500
Vac(pk)
PD
All
250
mW
2.94
mW/°C
Continuous Forward Current
IF
All
60
mA
Reverse Voltage
VR
All
6
V
PD
All
120
mW
1.41
mW/°C
Off-State Output Terminal Voltage
VDRM
All
600
V
Peak Repetitive Surge Current (PW = 100 µs, 120 pps)
ITSM
All
1
A
PD
All
Junction Temperature Range
Isolation Surge Voltage(4) (peak AC voltage, 60Hz, 1 sec duration)
Total Device Power Dissipation @ 25°C
Derate above 25°C
EMITTER
Total Power Dissipation 25°C Ambient
Derate above 25°C
DETECTOR
Total Power Dissipation @ 25°C Ambient
Derate above 25°C
© 2003 Fairchild Semiconductor Corporation
Page 2 of 10
150
mW
1.76
mW/°C
5/29/03
6-PIN DIP ZERO-CROSS
PHOTOTRIAC DRIVER OPTOCOUPLER
(600V PEAK)
MOC3061-M
MOC3062-M
MOC3063-M
MOC3162-M
MOC3163-M
ELECTRICAL CHARACTERISTICS (TA = 25°C Unless otherwise specified)
INDIVIDUAL COMPONENT CHARACTERISTICS
Parameters
Test Conditions
Symbol
Device
IF = 30 mA
VR = 6 V
VF
IR
Peak Blocking Current, Either Direction
VDRM = 600V, IF = 0 (note 1)
IDRM1
Critical Rate of Rise of Off-State Voltage
IF = 0 (figure 9, note 3)
dv/dt
EMITTER
Input Forward Voltage
Reverse Leakage Current
DETECTOR
Min
Typ*
Max
Units
All
All
1.3
0.005
1.5
100
V
µA
MOC316X-M
MOC306X-M
MOC306X-M
MOC316X-M
10
10
1500
100
500
nA
600
1000
V/µs
TRANSFER CHARACTERISTICS (TA = 25°C Unless otherwise specified.)
DC Characteristics
Test Conditions
Symbol
Device
IFT
MOC3061-M
MOC3062-M/
MOC3162-M
MOC3063-M/
MOC3163-M
main terminal
Voltage = 3V (note 2)
LED Trigger Current
(rated IFT)
Peak On-State Voltage, Either Direction
ITM = 100 mA peak,
IF = rated IFT
Holding Current, Either Direction
Min
Typ*
Max
Units
15
10
mA
5
VTM
All
1.8
IH
All
500
3
V
µA
ZERO CROSSING CHARACTERISTICS
Characteristics
Test Conditions
Inhibit Voltage (MT1-MT2 voltage
above which device will not
trigger)
Leakage in Inhibited State
Symbol
IF = Rated IFT
VINH
IF = Rated IFT,
VDRM = 600V, off state
IDRM2
Typ*
Max
MOC3061-M/2M/3M
Device
Min
12
20
MOC3062-M/3M
12
15
All
150
500
Units
V
µA
ISOLATION CHARACTERISTICS
Characteristics
Test Conditions
Symbol
Device
Min
Isolation Voltage
f = 60 Hz, t = 1 sec
VISO
All
7500
Typ*
Max
Units
V
*Typical values at TA = 25°C
Notes
1. Test voltage must be applied within dv/dt rating.
2. All devices are guaranteed to trigger at an IF value less than or equal to max IFT. Therefore, recommended operating IF lies
between max IFT (15 mA for MOC3061-M, 10 mA for MOC3062-M & MOC3162-M, 5 mA for MOC3063-M & MOC3163-M) and
absolute max IF (60 mA).
3. This is static dv/dt. See Figure 9 for test circuit. Commutating dv/dt is a function of the load-driving thyristor(s) only.
4. Isolation surge voltage, VISO, is an internal device dielectric breakdown rating. For this test, Pins 1 and 2 are common,
and Pins 4, 5 and 6 are common.
© 2003 Fairchild Semiconductor Corporation
Page 3 of 10
5/29/03
6-PIN DIP ZERO-CROSS
PHOTOTRIAC DRIVER OPTOCOUPLER
(600V PEAK)
MOC3061-M
MOC3062-M
MOC3063-M
MOC3162-M
Figure 2. Trigger Current Vs. Temperature
Figure 1. LED Forward Voltage vs. Forward Current
1.6
1.7
1.5
VTM = 3V
NORMALIZED TO TA = 25°C
1.5
1.4
1.4
IFT, NORMALIZED
VF, FORWARD VOLTAGE (V)
1.6
1.3
TA = -40°C
1.2
TA = 25°C
1.1
1.0
TA = 85°C
1.3
1.2
1.1
1.0
0.9
0.9
0.8
0.7
0.1
1
10
0.8
-40
100
-20
IF, LED FORWARD CURRENT (mA)
0
20
40
60
80
100
TA, AMBIENT TEMPERATURE (°C)
Figure 3. LED Current Required to Trigger vs.
LED Pulse Width
Figure 4. Leakage Current, IDRM vs. Temperature
16
10000
TA = 25°C
NORMALIZED TO PWIN >> 100µs
14
IDRM, LEAKAGE CURRENT (nA)
IFT, LED TRIGGER CURRENT (NORMALIZED)
MOC3163-M
12
10
8
6
4
1000
100
10
1
2
0
1
10
100
-20
0
20
40
60
80
100
TA, AMBIENT TEMPERATURE (°C)
PWIN, LED TRIGGER PULSE WIDTH (µs)
© 2003 Fairchild Semiconductor Corporation
0.1
-40
Page 4 of 10
5/29/03
6-PIN DIP ZERO-CROSS
PHOTOTRIAC DRIVER OPTOCOUPLER
(600V PEAK)
MOC3061-M
MOC3062-M
MOC3063-M
MOC3162-M
Figure 5. IDRM2, Leakage in Inhibit State vs. Temperature
Figure 6. On-State Characteristics
800
2.4
2.2
ITM, ON-STATE CURRENT (mA)
1.8
IDRM2, NORMALIZED
TA = 25°C
600
IF = RATED IFT
NORMALIZED TO TA = 25°C
2.0
1.6
1.4
1.2
1.0
0.8
0.6
0.4
-40
400
200
0
-200
-400
-600
-20
0
20
40
60
80
-800
100
-4
-3
TA, AMBIENT TEMPERATURE (°C)
-2
-1
0
1
2
3
4
VTM, ON-STATE VOLTAGE (VOLTS)
Figure 7. IH, Holding Current vs. Temperature
Figure 8. Inhibit Voltage vs. Temperature
3.2
1.20
2.8
1.15
NORMALIZED TO TA = 25°C
1.10
2.4
VINH, NORMALIZED
IH, HOLDING CURRENT (NORMALIZED)
MOC3163-M
2.0
1.6
1.2
1.05
1.00
0.95
0.90
0.8
0.85
0.4
0.0
-40
0.80
-40
-20
0
20
40
60
80
100
-20
0
20
40
60
80
100
TA, AMBIENT TEMPERATURE (°C)
TA, AMBIENT TEMPERATURE (°C)
© 2003 Fairchild Semiconductor Corporation
Page 5 of 10
5/29/03
6-PIN DIP ZERO-CROSS
PHOTOTRIAC DRIVER OPTOCOUPLER
(600V PEAK)
MOC3061-M
MOC3062-M
MOC3063-M
MOC3162-M
MOC3163-M
1. 100x scope probes are used, to allow high speeds and voltages.
2. The worst-case condition for static dv/dt is established by triggering the D.U.T. with a normal LED input current, then removing
the current. The variable vernier resistor combined with various capacitor combinations allows the dv/dt to be gradually
increased until the D.U.T. continues to trigger in response to the applied voltage pulse, even after the LED current has been
removed. The dv/dt is then decreased until the D.U.T. stops triggering. τRC is measured at this point and recorded.
27
VDRM/VRRM SELECT
DIFFERENTIAL
PREAMP
2W
1000
10 WATT
WIREWOUND
6
X100 PROBE
1
DUT
2
X100 PROBE
2W
20k
0.33
1000V
0.047
1000V
4
470pF
dV
dt
VERNIER
MOUNT DUT ON
TEMPERATURE CONTROLLED
Cµ PLATE
0.001
100
2W
0.005
1 MEG
82
2W
2W EACH
1.2 MEG
0.01
2W
POWER
TEST
0.047
1N914
0.1
RFP4N100
20V
f = 10 Hz
PW = 100 µs
50 Ω PULSE
GENERATOR
0.47
56
2W
1000
1/4W
0-1000V
10mA
1N967A
18V
ALL COMPONENTS ARE NON-INDUCTIVE UNLESS SHOWN
Figure 9. Circuit for Static
dV
Measurement of Power Thyristors
dt
BASIC APPLICATIONS
Rin
Typical circuit for use when hot line switching is required. In this
circuit the "hot" side of the line is switched and the load connected
to the cold or neutral side. The load may be connected to either the
neutral or hot line.
1
HOT
MOC3061-M
MOC3062-M
MOC3063-M
2
3
FKPF12N60
5
39Ω
4
240 VAC
0.01µF
360
Rin is calculated so that IF is equal to the rated IFT of the part, 15
mA for the MOC3061-M, 10 mA for the MOC3062-M, or 5 mA for
the MOC3063-M. The 39 ohm resistor and 0.01 µF capacitor are
for snubbing of the triac and is often, but not always,
necessary depending upon the particular triac and load
used.
LOAD
NEUTRAL
Figure 10. Hot-Line Switching Application Circuit
115 VAC
R1
Suggested method of firing two, back-to-back SCR’s
with a Fairchild triac driver. Diodes can be 1N4001;
resistors, R1 and R2, are optional 330 ohm.
360 Ω
6
VCC
1
VCC
Rin
6
2 MOC3061-M
MOC3062-M
MOC3063-M
3
Note: This optoisolator should not be used to drive a
load directly. It is intended to be a trigger device only.
D1
SCR
5
4
SCR
360 Ω
R2
D2
LOAD
Figure 11. Inverse-Parallel SCR Driver Circuit
© 2003 Fairchild Semiconductor Corporation
Page 6 of 10
5/29/03
6-PIN DIP ZERO-CROSS
PHOTOTRIAC DRIVER OPTOCOUPLER
(600V PEAK)
MOC3061-M
MOC3062-M
MOC3063-M
Package Dimensions (Through Hole)
MOC3162-M
Package Dimensions (Surface Mount)
0.350 (8.89)
0.320 (8.13)
0.350 (8.89)
0.320 (8.13)
0.260 (6.60)
0.240 (6.10)
0.070 (1.77)
0.040 (1.02)
MOC3163-M
0.260 (6.60)
0.240 (6.10)
0.390 (9.90)
0.332 (8.43)
0.070 (1.77)
0.040 (1.02)
0.320 (8.13)
0.014 (0.36)
0.010 (0.25)
0.320 (8.13)
0.014 (0.36)
0.010 (0.25)
0.200 (5.08)
0.115 (2.93)
0.200 (5.08)
0.115 (2.93)
0.100 (2.54)
0.015 (0.38)
0.012 (0.30)
0.008 (0.20)
0.025 (0.63)
0.020 (0.51)
0.020 (0.50)
0.016 (0.41)
0.100 (2.54)
0.100 [2.54]
15°
0.035 (0.88)
0.006 (0.16)
0.020 (0.50)
0.016 (0.41)
0.012 (0.30)
Package Dimensions (0.4” Lead Spacing)
Recommended Pad Layout for
Surface Mount Leadform
0.350 (8.89)
0.320 (8.13)
0.070 (1.78)
0.260 (6.60)
0.240 (6.10)
0.060 (1.52)
0.070 (1.77)
0.040 (1.02)
0.014 (0.36)
0.010 (0.25)
0.425 (10.79)
0.100 (2.54)
0.305 (7.75)
0.200 (5.08)
0.115 (2.93)
0.030 (0.76)
0.100 (2.54)
0.015 (0.38)
0.020 (0.50)
0.016 (0.41)
0.100 [2.54]
0.012 (0.30)
0.008 (0.21)
0.425 (10.80)
0.400 (10.16)
NOTE
All dimensions are in inches (millimeters)
© 2003 Fairchild Semiconductor Corporation
Page 7 of 10
5/29/03
6-PIN DIP ZERO-CROSS
PHOTOTRIAC DRIVER OPTOCOUPLER
(600V PEAK)
MOC3061-M
MOC3062-M
MOC3063-M
MOC3162-M
MOC3163-M
ORDERING INFORMATION
Option
Order Entry Identifier
S
Description
S
SR2
Surface Mount Lead Bend
SR2
Surface Mount; Tape and reel
T
T
0.4" Lead Spacing
V
V
VDE 0884
TV
SV
SR2V
TV
VDE 0884, 0.4" Lead Spacing
SV
VDE 0884, Surface Mount
SR2V
VDE 0884, Surface Mount, Tape & Reel
MARKING INFORMATION
1
MOC3061
2
X YY Q
6
V
3
5
4
Definitions
1
Fairchild logo
2
Device number
3
VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
4
One digit year code, e.g., ‘3’
5
Two digit work week ranging from ‘01’ to ‘53’
6
Assembly package code
*Note – Parts that do not have the ‘V’ option (see definition 3 above) that are marked with
date code ‘325’ or earlier are marked in portrait format.
© 2003 Fairchild Semiconductor Corporation
Page 8 of 10
5/29/03
6-PIN DIP ZERO-CROSS
PHOTOTRIAC DRIVER OPTOCOUPLER
(600V PEAK)
MOC3061-M
MOC3062-M
MOC3063-M
MOC3162-M
MOC3163-M
Carrier Tape Specifications
12.0 ± 0.1
4.5 ± 0.20
2.0 ± 0.05
4.0 ± 0.1
0.30 ± 0.05
Ø1.5 MIN
1.75 ± 0.10
11.5 ± 1.0
21.0 ± 0.1
9.1 ± 0.20
10.1 ± 0.20
0.1 MAX
24.0 ± 0.3
Ø1.5 ± 0.1/-0
User Direction of Feed
NOTE
All dimensions are in inches (millimeters)
Reflow Profile (White Package, -M Suffix)
Temperature (°C)
300
230°C, 10–30 s
250
245°C peak
200
150
Time above 183°C, 120–180 sec
100
Ramp up = 2–10°C/sec
50
• Peak reflow temperature: 245°C (package surface temperature)
• Time of temperature higher than 183°C for 120–180 seconds
• One time soldering reflow is recommended
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
Time (Minute)
© 2003 Fairchild Semiconductor Corporation
Page 9 of 10
5/29/03
6-PIN DIP ZERO-CROSS
PHOTOTRIAC DRIVER OPTOCOUPLER
(600V PEAK)
MOC3061-M
MOC3062-M
MOC3063-M
MOC3162-M
MOC3163-M
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, and (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in a significant injury of the user.
© 2003 Fairchild Semiconductor Corporation
2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
Page 10 of 10
5/29/03
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