Fairchild MOC8112M 6-pin dip optocoupler for power supply applications (no base connection) Datasheet

MOC8111M, MOC8112M, MOC8113M
6-Pin DIP Optocoupler for Power Supply Applications
(No Base Connection)
Features
Description
■ High isolation voltage
The MOC811XM series consists of a Gallium Arsenide
IRED coupled with an NPN phototransistor. The base of
the transistor is not bonded to an external pin for
improved noise immunity.
■
■
■
■
■
7500 VAC Peak—1 second
High BVCEO minimum 70 Volts
Current transfer ratio in selected groups:
MOC8111M: 20% min.
MOC8112M: 50% min.
MOC8113M: 100% min.
Maximum switching time in saturation specified
Underwriters Laboratory (UL) recognized
(File #E90700, Vol. 2)
IEC60747-5-2 approved (ordering option V)
tm
Applications
■ Power supply regulators
■ Digital logic inputs
■ Microprocessor inputs
■ Appliance sensor systems
■ Industrial controls
Packages
Schematic
ANODE 1
6 N/C
6
6
CATHODE 2
1
5 COLLECTOR
1
N/C 3
4 EMITTER
6
1
©2007 Fairchild Semiconductor Corporation
MOC8111M, MOC8112M, MOC8113M Rev. 1.0.0
www.fairchildsemi.com
MOC8111M, MOC8112M, MOC8113M 6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection)
September 2007
Symbol
Parameter
Value
Unit
260
mW
3.5
mW/°C
TOTAL DEVICE
PD
Total Device Power Dissipation @ TA = 25°C
Derate above 25°C
TOPR
Ambient Operating Temperature Range
-40 to +100
°C
TSTG
Storage Temperature Range
-40 to +150
°C
TSOL
Lead Soldering Temperature (Wave Solder)
(1/16" from case, 10 sec. duration)
260
°C
Forward Current – Continuous
90
mA
Forward Current – Peak (PW = 1µs, 300pps)
3
A
VR
Reverse Voltage
6
V
PD
LED Power Dissipation @ TA = 25°C
INPUT LED
IF
IF(pk)
Derate above 25°C
135
mW
1.8
mW/°C
200
mW
2.67
mW/°C
OUTPUT TRANSISTOR
PD
Detector Power Dissipation @ TA = 25°C
Derate above 25°C
©2007 Fairchild Semiconductor Corporation
MOC8111M, MOC8112M, MOC8113M Rev. 1.0.0
www.fairchildsemi.com
2
MOC8111M, MOC8112M, MOC8113M 6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection)
Absolute Maximum Ratings (TA = 25°C Unless otherwise specified.)
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Individual Component Characteristics
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
1.35
1.65
V
1.15
1.50
EMITTER
VF
Input Forward Voltage
IF = 60mA
VR
Reverse Voltage
IR = 10µA
CJ
Capacitance
IF = 10mA
IR
Reverse Leakage Current
6.0
15
V
VF = 0V, f = 1.0MHz
50
pF
VF = 1V, f = 1.0MHz
65
VR = 3.0V
.35
10
µA
DETECTOR
BVCEO
Breakdow Voltage, Collector to Emitter
IC = 1.0mA, IF = 0
70
V
BVECO
Breakdow Voltage, Emitter to Collector
IE = 100µA, IF = 0
7
V
ICEO
Leakage Current, Collector to Emitter
VCE = 10V, IF = 0
5
CCE
Capacitance, Collector to Emitter
VCE = 0 V, f = 1MHz
8
50
V
pF
Isolation Characteristics
Symbol
Characteristic
Test Conditions
VISO
Input-Output Isolation Voltage
f = 60Hz, t = 1 sec.
CISO
Isolation Capacitance
VI-O = 0, f = 1MHz
Min.
Typ.
Max.
7500
Units
VAC(PK)
0.5
pF
Transfer Characteristic
Symbol
Characteristics
Test Conditions
Device
Min.
MOC8111M
20
MOC8112M
50
MOC8113M
100
Typ. Max. Units
DC CHARACTERISTICS
CTR
Output/Input Current
Transfer Ratio
VCE(SAT) Collector-Emitter
Saturation Voltage
IF = 10mA, VCE = 5V
%
IF = 10mA, IC = 2.5mA
All
0.27
0.4
V
RL = 100Ω, IC = 2mA,
VCC = 10V, See Figure 7
All
6.0
10
µs
All
5.5
10
µs
IF = 20mA, VCE = 0.4V
MOC8111M
3.0
5.5
µs
IF = 10mA, VCE = 0.4V
MOC812M/3M
4.2
8.0
AC CHARACTERISTICS
Non-Saturated Switching Times
ton
Turn-On Time
toff
Turn-Off Time
Saturated Switching Times
ton
tr
toff
tf
Turn-On Time
Rise-Time
Turn-Off Time
Fall-Time
©2007 Fairchild Semiconductor Corporation
MOC8111M, MOC8112M, MOC8113M Rev. 1.0.0
IF = 20mA, VCE = 0.4V
MOC8111M
2.0
4.0
IF = 10mA, VCE = 0.4V
MOC812M/3M
3.0
6.0
IF = 20mA, VCE = 0.4V
MOC8111M
18
34
IF = 10mA, VCE = 0.4V
MOC812M/3M
23
39
IF = 20mA, VCE = 0.4V
MOC8111M
11
20
IF = 10mA, VCE = 0.4V
MOC812M/3M
14
24
µs
µs
µs
www.fairchildsemi.com
3
MOC8111M, MOC8112M, MOC8113M 6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection)
Electrical Characteristics (TA = 25°C Unless otherwise specified.)
Fig. 1 LED Forward Voltage vs. Forward Current
Fig. 2 Normalized CTR vs. Forward Current
1.8
1.4
TA = 25°C
VCE = 5.0 V
Normalized to
IF = 10 mA
1.2
1.6
1.0
NORMALIZED CTR
VF - FORWARD VOLTAGE (V)
1.7
1.5
TA = -55°C
1.4
1.3
1.2
0.8
0.6
0.4
TA = 25°C
0.2
1.1
TA = 100°C
1.0
0.0
1
10
100
0
5
IF - LED FORWARD CURRENT (mA)
VCE (sat) - COLLECTOR-EMITTER SATURATION VOLTAGE (V)
1.6
NORMALIZED CTR
IF = 5 mA
1.2
IF = 10 mA
1.0
0.8
IF = 20 mA
0.6
0.4
-75
Normalized to
IF = 10 mA
TA = 25°C
-50
-25
0
25
50
75
100
125
TA - AMBIENT TEMPERATURE (°C)
20
Fig. 4 Collector Emitter Saturation Voltage
vs Collector Current
100
10
1
IF = 2.5 mA
0.1
IF = 20 mA
0.01
IF = 5 mA
IF = 10 mA
TA = 25°C
0.001
0.01
0.1
1
10
IC - COLLECTOR CURRENT (mA)
Fig. 5 Switching Speed vs. Load Resistor
Fig. 6 Dark current vs. Ambient Temperature.
1000
ICEO - COLLECTOR-EMITTER DARK CURRENT (µA)
1e+1
IF = 10 mA
VCC = 10 V
TA = 25°C
SWITCHING SPEED - (µs)
15
IF - FORWARD CURRENT (mA)
Fig. 3 Normalized CTR vs. Ambient Temperature
1.4
10
100
Toff
Tf
10
Ton
1
Tr
0.1
VCE = 10V
1e+0
1e-1
1e-2
1e-3
1e-4
1e-5
1e-6
0.1
1
10
100
0
R-LOAD RESISTOR (kΩ)
©2007 Fairchild Semiconductor Corporation
MOC8111M, MOC8112M, MOC8113M Rev. 1.0.0
25
50
75
100
125
TA - AMBIENT TEMPERATURE (°C)
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4
MOC8111M, MOC8112M, MOC8113M 6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection)
Typical Performance Characteristics
WAVE FORMS
VCC = 10V
INPUT PULSE
IF
IC
INPUT
RL = 100Ω
10%
OUTPUT
OUTPUT PULSE
90%
tr
ton
tf
toff
Adjust IF to produce IC = 2 mA
Figure 7. Switching Time Test Circuit and Waveforms
©2007 Fairchild Semiconductor Corporation
MOC8111M, MOC8112M, MOC8113M Rev. 1.0.0
www.fairchildsemi.com
5
MOC8111M, MOC8112M, MOC8113M 6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection)
TEST CIRCUIT
Through Hole
Surface Mount
0.350 (8.89)
0.320 (8.13)
0.350 (8.89)
0.320 (8.13)
0.260 (6.60)
0.240 (6.10)
0.070 (1.77)
0.040 (1.02)
0.260 (6.60)
0.240 (6.10)
0.070 (1.77)
0.040 (1.02)
0.320 (8.13)
0.014 (0.36)
0.010 (0.25)
0.200 (5.08)
0.115 (2.93)
0.320 (8.13)
0.014 (0.36)
0.010 (0.25)
0.200 (5.08)
0.115 (2.93)
0.100 (2.54)
0.015 (0.38)
0.012 (0.30)
0.008 (0.20)
0.025 (0.63)
0.020 (0.51)
0.020 (0.50)
0.016 (0.41)
0.100 (2.54)
0.390 (9.90)
0.332 (8.43)
0.100 [2.54]
15°
0.035 (0.88)
0.012 (0.30)
0.020 (0.50)
0.016 (0.41)
0.012 (0.30)
Recommend Pad Layout for
Surface Mount Leadform
0.4" Lead Spacing
0.350 (8.89)
0.320 (8.13)
0.070 (1.78)
0.060 (1.52)
0.260 (6.60)
0.240 (6.10)
0.425 (10.79)
0.070 (1.77)
0.040 (1.02)
0.100 (2.54)
0.305 (7.75)
0.030 (0.76)
0.014 (0.36)
0.010 (0.25)
0.200 (5.08)
0.115 (2.93)
0.100 (2.54)
0.015 (0.38)
0.020 (0.50)
0.016 (0.41)
0.012 (0.30)
0.008 (0.21)
0.100 [2.54]
0.425 (10.80)
0.400 (10.16)
Note:
All dimensions are in inches (millimeters).
©2007 Fairchild Semiconductor Corporation
MOC8111M, MOC8112M, MOC8113M Rev. 1.0.0
www.fairchildsemi.com
6
MOC8111M, MOC8112M, MOC8113M 6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection)
Package Dimensions
Option
Example Part Number
Description
No Suffix
MOC8111M
S
MOC8111SM
Through Hole
SR2
MOC8111SR2M
T
MOC8111TM
0.4" Lead Spacing
VDE 0884
Surface Mount Lead Bend
Surface Mount; Tape and Reel
V
MOC8111VM
TV
MOC8111TVM
IEC60747-5-2 (VDE), 0.4" Lead Spacing
SV
MOC8111SVM
IEC60747-5-2 (VDE), Surface Mount
SR2V
MOC8111SR2VM
IEC60747-5-2 (VDE), Surface Mount, Tape and Reel
Marking Information
1
MOC8111M
2
X YY Q
6
V
3
5
4
Definitions
1
Fairchild logo
2
Device number
3
VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
4
One digit year code, e.g., ‘7’
5
Two digit work week ranging from ‘01’ to ‘53’
6
Assembly package code
©2007 Fairchild Semiconductor Corporation
MOC8111M, MOC8112M, MOC8113M Rev. 1.0.0
www.fairchildsemi.com
7
MOC8111M, MOC8112M, MOC8113M 6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection)
Ordering Information
12.0 ± 0.1
4.5 ± 0.20
2.0 ± 0.05
Ø1.5 MIN
4.0 ± 0.1
0.30 ± 0.05
1.75 ± 0.10
11.5 ± 1.0
21.0 ± 0.1
9.1 ± 0.20
Ø1.5 ± 0.1/-0
10.1 ± 0.20
0.1 MAX
24.0 ± 0.3
User Direction of Feed
Note:
All dimensions are in millimeters.
Reflow Profile
300
260°C
280
260
>245°C = 42 Sec
240
220
200
180
°C
Time above
183°C = 90 Sec
160
140
120
1.822°C/Sec Ramp up rate
100
80
60
40
33 Sec
20
0
0
60
120
180
270
360
Time (s)
©2007 Fairchild Semiconductor Corporation
MOC8111M, MOC8112M, MOC8113M Rev. 1.0.0
www.fairchildsemi.com
8
MOC8111M, MOC8112M, MOC8113M 6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection)
Tape Dimensions
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QS™
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SuperSOT™-3
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GTO™
i-Lo™
IntelliMAX™
ISOPLANAR™
MegaBuck™
MICROCOUPLER™
MicroFET™
MicroPak™
MillerDrive™
Motion-SPM™
OPTOLOGIC®
OPTOPLANAR®
®
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SyncFET™
The Power Franchise®
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FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS
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APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS
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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR
SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body or
(b) support or sustain life, and (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in a significant injury of the user.
2. A critical component in any component of a life support,
device, or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Advance Information
Formative or In Design
This datasheet contains the design specifications for product
development. Specifications may change in any manner without notice.
Definition
Preliminary
First Production
This datasheet contains preliminary data; supplementary data will be
published at a later date. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve design.
No Identification Needed
Full Production
This datasheet contains final specifications. Fairchild Semiconductor
reserves the right to make changes at any time without notice to improve
design.
Obsolete
Not In Production
This datasheet contains specifications on a product that has been
discontinued by Fairchild Semiconductor. The datasheet is printed for
reference information only.
Rev. I31
©2007 Fairchild Semiconductor Corporation
MOC8111M, MOC8112M, MOC8113M Rev. 1.0.0
www.fairchildsemi.com
9
MOC8111M, MOC8112M, MOC8113M 6-Pin DIP Optocoupler for Power Supply Applications (No Base Connection)
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