Foshan MPSA92G Silicon pnp transistor in a to-92 plastic package Datasheet

MPSA92G
Rev.E Mar.-2016
描述
/
DATA SHEET
Descriptions
TO-92 塑封封装 PNP 半导体三极管。Silicon PNP transistor in a TO-92 Plastic Package.
特征
/ Features
耐压高, 饱和压降低,集电极输出电容低, 与 MPSA42G 互补。无卤产品。
High voltage low saturation, low collector output capacitance, complementary pair with MPSA42G. HF
Product.
用途
/
Applications
用于高电压控制电路。
High voltage control circuit.
内部等效电路
引脚排列
12
/ Equivalent Circuit
/ Pinning
3
PIN1:Collector
放大及印章代码
PIN 2:Base
PIN 3:Emitter
/ hFE Classifications & Marking
见印章说明。See Marking Instructions.
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MPSA92G
Rev.E Mar.-2016
极限参数
/
DATA SHEET
Absolute Maximum Ratings(Ta=25℃)
参数
Parameter
符号
Symbol
数值
Rating
单位
Unit
Collector to Base Voltage
VCBO
-300
V
Collector to Emitter Voltage
VCEO
-300
V
Emitter to Base Voltage
VEBO
-5.0
V
Collector Current - Continuous
IC
-500
mA
Base Current - Continuous
IB
-30
mA
Collector Power Dissipation
PC
625
mW
Collector Power Dissipation
PC(TC=25℃)
Tj
1.5
W
150
℃
Tstg
-55~150
℃
Junction Temperature
Storage Temperature Range
电性能参数
/ Electrical Characteristics(Ta=25℃)
参数
Parameter
Collector to Base Breakdown
Voltage
Collector to Emitter Breakdown
Voltage
Emitter to Base Breakdown
Voltage
符号
Symbol
测试条件
Test Conditions
最小值 典型值 最大值 单位
Min
Typ
Max
Unit
VCBO
IC=-100μA
IE=0
-300
V
VCEO
IC=-1.0mA
IB=0
-300
V
VEBO
IE=-100μA
IC=0
-5.0
V
Collector Cut-Off Current
ICBO
VCB=-200V
IE=0
-0.25
μA
Emitter Cut-Off Current
IEBO
VEB=-3.0V
IC=0
-0.1
μA
hFE(1)
VCE=-10V
IC=-10mA
40
hFE(2)
VCE=-10V
IC=-30mA
25
hFE(3)
VCE=-10V
IC=-1.0mA
25
IC=-20mA
IB=-2.0mA
-0.5
V
IC=-20mA
IB=-2.0mA
-0.9
V
VCE=-20V
f=100MHz
VCB=-20V
f=1.0MHz
IC=-10mA
DC Current Gain
Collector to Emitter Saturation
VCE(sat)
Voltage
Base to Emitter Saturation Voltage VBE(sat)
Transition Frequency
Collector Output Capacitance
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fT
Cob
IE=0
50
MHz
6.0
pF
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MPSA92G
Rev.E Mar.-2016
电参数曲线图
DATA SHEET
/ Electrical Characteristic Curve
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MPSA92G
Rev.E Mar.-2016
外形尺寸图
DATA SHEET
/ Package Dimensions
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MPSA92G
Rev.E Mar.-2016
印章说明
/
DATA SHEET
Marking Instructions
BR G
A92
****
说明:
BR:  

为公司代码
A92:

为型号代码
G:
****:
为无卤产品代码

为生产批号代码,随生产批号变化。
Note:
BR:
Company Code.
A92:
Product Type.
G:
Halogen Free Product
****:
Lot No. Code,code change with Lot No.
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MPSA92G
Rev.E Mar.-2016
DATA SHEET
波峰焊温度曲线图(无铅)
/
Temperature Profile for Dip Soldering(Pb-Free)
说明:
Note:
1、预热温度 25~150℃,时间 60~90sec;
1.Preheating:25~150℃, Time:60~90sec.
2、峰值温度 255±5℃,时间持续为 5±0.5sec;
2.Peak Temp.:255±5℃, Duration:5±0.5sec.
3、焊接制程冷却速度为 2~10℃/sec.
3. Cooling Speed: 2~10℃/sec.
耐焊接热试验条件
/
Resistance to Soldering Heat Test Conditions
温度:270±5℃
包装规格
散件包装
Units 包装数量
Units/Bag
只/袋
Bags/Inner Box
袋/盒
Units/Inner Box
只/盒
Dimension
Inner Boxes/Outer Box
盒/箱
Units/Outer Box
只/箱
Bag 袋
包装尺寸
Inner Box 盒
(unit:mm3)
Outer Box 箱
1,000
10
10,000
5
50,000
135×190
237×172×102
560×245×195
1,000
10
10,000
10
100,000
135×190
237×172×102
560×245×375
Units/tape
只/纸带
Tape/Inner Box
纸带/盒
Rows/Inner Box
纸带层/盒
Inner Boxes/Outer Box
盒/箱
Units/Outer Box
只/箱
Inner Box 盒
3,000
1
120
10
30,000
328×230×42
/ AMMO
Package Type
封装形式
使用说明
Time:10±1 sec
/ BULK
TO-92
TO-92
Temp:270±5℃
/ Packaging SPEC.
Package Type
封装形式
编带包装
时间:10±1 sec.
Units 包装数量
Dimension
包装尺寸
(unit:mm3)
Outer Box 箱
小箱 480×346×235,
大箱 547×407×268
/ Notices
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