Freescale MPVZ5010G6T1 Integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and calibrated Datasheet

Freescale Semiconductor
Technical Data
MPVZ5010G
Rev 0, 09/2005
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
The MPVZ5010G series piezoresistive transducers are state-of-the-art
monolithic silicon pressure sensors designed for the appliance, consumer,
healthcare, industrial and automotive market. The analog output can be read
directly into the A/D input of Freescale microcontrollers. This transducer
combines advanced micromachining techniques, thin-film metallization, and
bipolar processing to provide an accurate, high level analog output signal that is
proportional to the applied pressure. The axial port has been modified to
accommodate industrial grade tubing.
MPVZ5010G
SERIES
INTEGRATED
PRESSURE SENSOR
0 to 10 kPA (0 to 1019.78 mm H2O)
0.2 to 4.7 V OUTPUT
SMALL OUTLINE PACKAGE
SURFACE MOUNT
Features
•
•
•
•
5.0% Maximum Error over 0° to 85°C
Temperature Compensated over -40° to +125°C
Durable Thermoplastic (PPS) Package
Available in Surface Mount (SMT) or Through-hole (DIP) Configurations
Application Examples
• Washing Machine Water Level Measurement (Reference AN1950)
• Ideally Suited for Microprocessor or Microcontroller-Based Systems
• Appliance Liquid Level and Pressure Measurement
• Respiratory Equipment
MPVZ5010GW6U
CASE 1735-01
MPVZ5010G6U/T1
CASE 482-01
SMALL OUTLINE PACKAGE
THROUGH-HOLE
ORDERING INFORMATION
Device
Type
Case
No.
MPVZ Series
Order No.
Packing
Options
Surface Mount
1735-01
MPVZ5010GW6U
Rails
MZ5010GW
Through-Hole
1560-02
MPVZ5010GW7U
Rails
MZ5010GW
Surface Mount
482-01
MPVZ5010G6U
Rails
MZ5010G
Surface Mount
482-01
MPVZ5010G6T1
Tape & Reel
MZ5010G
Through-Hole
482B-03
MPVZ5010G7U
Rails
MZ5010G
J
Device
Marking
MPVZ5010GW7U
CASE 1560-02
MPVZ5010G7U
CASE 482B-03
PIN NUMBERS(1)
1
N/C
5
N/C
2
VS
6
N/C
3
GND
7
N/C
4
VOUT
8
N/C
1. Pins 1, 5, 6, 7, and 8 are internal device
connections. Do not connect to external
circuitry or ground. Pin 1 is noted by the
notch in the lead.
© Freescale Semiconductor, Inc., 2005. All rights reserved.
VS
Thin Film
Temperature
Compensation
and
Gain Stage #1
Sensing
Element
GND
Gain Stage #2
and
Ground
Reference
Shift Circuitry
Vout
Pins 1 and 5 through 8 are NO CONNECTS
for surface mount package
Pins 4, 5, and 6 are NO CONNECTS for
unibody package
Figure 1. Fully Integrated Pressure Sensor Schematic
Table 1. Maximum Ratings(1)
Rating
Symbol
Value
Unit
Maximum Pressure (P1 > P2)
Pmax
40
kPa
Storage Temperature
Tstg
–40 to +125
°C
Operating Temperature
TA
–40 to +125
°C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
MPVZ5010G
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Table 2. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in
Figure 3 required to meet specification.)
Characteristic
Symbol
Min
Typ
Max
Unit
POP
0
—
10
1019.78
kPa
mm H2O
Supply Voltage(2)
VS
4.75
5.0
5.25
Vdc
Supply Current
Io
—
5.0
10
mAdc
Pressure Range
(1)
Minimum Pressure Offset(3)
@ VS = 5.0 Volts
(0 to 85°C)
Voff
0
0.2
0.425
Vdc
Full Scale Output(4)
@ VS = 5.0 Volts
(0 to 85°C)
VFSO
4.475
4.7
4.925
Vdc
Full Scale Span(5)
@ VS = 5.0 Volts
(0 to 85°C)
VFSS
4.275
4.5
4.725
Vdc
Accuracy(6)
(0 to 85°C)
—
—
—
±5.0
%VFSS
V/P
—
450
4.413
—-
mV/kPa
mV/mm H2O
Response Time(7)
tR
—
1.0
—-
ms
Output Source Current at Full Scale Output
IO+
—
0.1
—-
mAdc
Warm-Up Time(8)
—
—
20
—-
ms
Offset Stability(9)
—
—
±0.5
—-
%VFSS
Sensitivity
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
6. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
• Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
• TcSpan:
Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
• TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.
• Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
9. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPVZ5010G
Sensors
Freescale Semiconductor
3
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
The performance over temperature is achieved by
integrating the shear-stress strain gauge, temperature
compensation, calibration and signal conditioning circuitry
onto a single monolithic chip.
Figure 2 illustrates the Differential or Gauge configuration
in the basic chip carrier (Case 482). A gel die coat isolates the
die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the sensor
diaphragm.
The MPVZ5010G series pressure sensor operating
characteristics, internal reliability and qualification tests are
based on use of dry air as the pressure media. Media, other
Fluoro Silicone
Gel Die Coat
than dry air, may have adverse effects on sensor
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
Figure 3 shows the recommended decoupling circuit for
interfacing the integrated sensor to the A/D input of a
microprocessor or microcontroller. Proper decoupling of the
power supply is recommended.
Figure 4 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C using the decoupling circuit shown in Figure 3. The
output will saturate outside of the specified pressure range.
Stainless
Steel Cap
Die
+5 V
P1
Thermoplastic
Case
Wire Bond
Vout
OUTPUT
Vs
Lead
Frame
IPS
1.0 µF
P2
0.01 µF
GND
470 pF
Die Bond
Differential Sensing
Element
Figure 2. Cross-Sectional Diagram SOP
(not to scale)
5.0
Figure 3. Recommended Power Supply Decoupling
and Output Filtering
(For additional output filtering, please refer to
Application Note AN1646.)
Transfer Function (kPa):
Vout = VS × (0.09 × P + 0.04) ± 5.0% VFSS
VS = 5.0 Vdc
TEMP = 0 to 85°C
4.0
Output (V)
3.0
TYPICAL
MAX
2.0
MIN
1.0
0
0
2.0
4.0
6.0
8.0
10
Differential Pressure (kPa)
Figure 4. Output versus Pressure Differential
MPVZ5010G
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Freescale Semiconductor
Transfer Function (MPVZ5010G)
Nominal Transfer Value: Vout = VS x (0.09 x P + 0.04)
± (Pressure Error x Temp. Factor x 0.09 x VS)
VS = 5.0 V ± 0.25 Vdc
P = kPa
Temperature Error Band
MPVZ5010G SERIES
4.0
3.0
Temperature
Error
Factor
2.0
Temp
Multiplier
–40
0 to 85
+125
3
1
3
1.0
0.0
–40
–20
0
20
40
80
60
100
120
140
Temperature in °C
NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C.
Pressure Error Band
0.5
0.4
0.3
Pressure
Error
(kPa)
0.2
0.1
0
–0.1
Pressure (kPa)
0
1
2
3
4
5
6
7
8
9
10
–0.2
–0.3
–0.4
–0.5
Pressure
0 to 10 (kPa)
Error (Max)
±0.5 (kPa)
MPVZ5010G
Sensors
Freescale Semiconductor
5
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing a gel die coat which
protects the die from harsh media. The MPX pressure sensor
Part Number
is designed to operate with positive differential pressure
applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below:
Pressure (P1)
Side Identifier
Case Type
MPVZ5010GW6U
1735-01
Vertical Port Attached
MPVZ5010GW7U
1560-02
Vertical Port Attached
MPVZ5010G6U/T1
482-01
Stainless Steel Cap
482B-03
Stainless Steel Cap
MPVZ5010G7U
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
0.100 TYP 8X
2.54
0.660
16.76
0.060 TYP 8X
1.52
0.300
7.62
0.100 TYP 8X
2.54
inch
mm
SCALE 2:1
Figure 5. SOP Footprint (Case 482)
MPVZ5010G
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PACKAGE DIMENSIONS
PAGE 1 OF 3
CASE 1735-01
ISSUE A
SMALL OUTLINE PACKAGE
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PACKAGE DIMENSIONS
PAGE 2 OF 3
CASE 1735-01
ISSUE A
SMALL OUTLINE PACKAGE
MPVZ5010G
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PACKAGE DIMENSIONS
PAGE 3 OF 3
CASE 1735-01
ISSUE A
SMALL OUTLINE PACKAGE
MPVZ5010G
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PACKAGE DIMENSIONS
PAGE 1 OF 3
CASE 1560-02
ISSUE C
SMALL OUTLINE PACKAGE
MPVZ5010G
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PACKAGE DIMENSIONS
PAGE 2 OF 3
CASE 1560-02
ISSUE C
SMALL OUTLINE PACKAGE
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PACKAGE DIMENSIONS
PAGE 3 OF 3
CASE 1560-02
ISSUE C
SMALL OUTLINE PACKAGE
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PACKAGE DIMENSIONS
-A-
D 8 PL
0.25 (0.010)
4
5
M
T B
S
A
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
-BG
8
1
S
DIM
A
B
C
D
G
H
J
K
M
N
S
N
H
C
J
-TSEATING
PLANE
PIN 1 IDENTIFIER
K
M
INCHES
MIN
MAX
0.415 0.425
0.415 0.425
0.212 0.230
0.038 0.042
0.100 BSC
0.002 0.010
0.009 0.011
0.061 0.071
0˚
7˚
0.405 0.415
0.709 0.725
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
5.38
5.84
0.96
1.07
2.54 BSC
0.05
0.25
0.23
0.28
1.55
1.80
0˚
7˚
10.29
10.54
18.01
18.41
CASE 482-01
ISSUE O
SMALL OUTLINE PACKAGE
-ANOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
6. DIMENSION S TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4
5
-BG
8
1
0.25 (0.010)
M
T B
D 8 PL
S
A
S
DETAIL X
S
PIN 1 IDENTIFIER
N
C
-T-
SEATING
PLANE
DIM
A
B
C
D
G
J
K
M
N
S
INCHES
MILLIMETERS
MIN
MAX MIN
MAX
0.415
0.425 10.54
10.79
0.415
0.425 10.54
10.79
0.210
0.220
5.33
5.59
0.026
0.034
0.66
0.864
0.100 BSC
2.54 BSC
0.009
0.011
0.23
0.28
0.100
0.120
2.54
3.05
0˚
15˚
0˚
15˚
0.405
0.415 10.29
10.54
0.540
0.560 13.72
14.22
K
M
J
DETAIL X
CASE 482B-03
ISSUE B
SMALL OUTLINE PACKAGE
MPVZ5010G
Sensors
Freescale Semiconductor
13
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MPVZ5010G
Rev. 0
09/2005
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