Freescale MPX2202ASX 200kpa on-chip temperature compensated & calibrated silicon pressure sensor Datasheet

Freescale Semiconductor
Technical Data
MPX2202
Rev 4, 08/2006
200 kPa On-Chip Temperature
Compensated & Calibrated
Pressure Sensors
MPX2202
SERIES
The MPX2202/MPXV2202G device series is a silicon piezoresistive pressure
sensor providing a highly accurate and linear voltage output - directly
proportional to the applied pressure. The sensor is a single monolithic silicon
diaphragm with the strain gauge and a thin-film resistor network integrated onchip. The chip is laser trimmed for precise span and offset calibration and
temperature compensation. They are designed for use in applications such as
pump/motor controllers, robotics, level indicators, medical diagnostics, pressure
switching, barometers, altimeters, etc.
0 TO 200 kPA (0 TO 29 psi)
40 mV FULL SCALE SPAN
(TYPICAL)
SMALL OUTLINE PACKAGE
SURFACE MOUNT
Features
• Temperature Compensated Over 0°C to +85°C
• Easy-to-Use Chip Carrier Package Options
• Available in Absolute, Differential and Gauge Configurations
Typical Applications
• Pump/Motor Controllers
• Robotics
• Level Indicators
• Medical Diagnostics
• Pressure Switching
• Barometers
• Altimeters
MPXV2202GP
CASE 1369-01
MPXV2202DP
CASE 1351-01
SMALL OUTLINE PACKAGE
PIN NUMBERS
ORDERING INFORMATION
Device
MPX Series Packing
Device
Options
Case No.
Type
Order No.
Options
Marking
SMALL OUTLINE PACKAGE (MPX2202G SERIES)
Ported
Gauge, Side Port,
1369
MPXV2202GP Trays MPXV2202GP
Elements SMT
Differential, Dual Port,
1351
MPXV2202DP Trays MPXV2202DP
SMT
UNIBODY PACKAGE (MPX2202 SERIES)
Basic
Absolute, Differential
344
MPX2202A
—
MPX2202A
Element
MPX2202D
MPX2202D
Ported
Differential, Dual Port
344C
MPX2202DP
—
MPX2202DP
Elements
Absolute, Gauge
344B
MPX2202AP
—
MPX2202AP
MPX2202GP
MPX2202GP
Absolute, Gauge Axial
344F
MPX2202ASX
—
MPX2202A
1
GND(1)
5
N/C
2
+VOUT
6
N/C
3
VS
7
N/C
4
VS
8
N/C
1. Pin 1 is noted by the notch in the lead.
UNIBODY PACKAGE PIN NUMBERS
1
GND(1)
3
VS
2
+VOUT
4
VS
1. Pin 1 is noted by the notch in the lead.
UNIBODY PACKAGES
MPX2202A/D
CASE 344-15
MPX2202AP/GP
CASE 344B-01
© Freescale Semiconductor, Inc., 2006. All rights reserved.
MPX2202DP
CASE 344C-01
MPX2202ASX
CASE 344F-01
Figure 1 illustrates a block diagram of the internal circuitry
on the stand-alone pressure sensor chip.
VS
3
Thin Film
Temperature
Compensation
And
Calibration
Circuitry
Sensing
Element
2 V
out+
4 V
out-
1
GND
Figure 1. Temperature Compensated Pressure Sensor Schematic
VOLTAGE OUTPUT VERSUS APPLIED DIFFERENTIAL PRESSURE
The differential voltage output of the sensor is directly
proportional to the differential pressure applied.
The absolute sensor has a built-in reference vacuum. The
output voltage will decrease as vacuum, relative to ambient,
is drawn on the pressure (P1) side.
The output voltage of the differential or gauge sensor
increases with increasing pressure applied to the pressure
(P1) side relative to the vacuum (P2) side. Similarly, output
voltage increases as increasing vacuum is applied to the
vacuum (P2) side relative to the pressure (P1) side.
Table 1. Maximum Ratings(1)
Rating
Symbol
Value
Unit
Maximum Pressure (P1 > P2)
Pmax
800
kPa
Storage Temperature
Tstg
-40 to +125
°C
Operating Temperature
TA
-40 to +125
°C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
MPX2202
2
Sensors
Freescale Semiconductor
Table 2. Operating Characteristics
(VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
Characteristics
Symbol
Min
Typ
Max
Unit
Pressure Range(1)
POP
0
-
200
kPa
Supply Voltage(2)
VS
—
10
16
Vdc
Supply Current
Io
—
6.0
-
mAdc
VFSS
38.5
40
41.5
mV
Voff
-1.0
—
1.0
mV
∆V/∆P
—
0.2
—
mV/kPa
—
-0.6
-1.0
—
—
0.4
1.0
%VFSS
Pressure Hysteresis(5) (0 to 200 kPa)
—
—
± 0.1
-
%VFSS
Temperature Hysteresis(5) (-40°C to +125°C)
—
—
± 0.5
-
%VFSS
TCVFSS
-2.0
—
2.0
%VFSS
TCVoff
-1.0
—
1.0
mV
Input Impedance
Zin
1000
—
2500
W
Output Impedance
Zout
1400
—
3000
W
Response Time(6) (10% to 90%)
tR
—
1.0
—
ms
Warm-Up
—
—
20
—
ms
Offset Stability(7)
—
—
±0.5
—
%VFSS
Full Scale Span(3)
Offset(4)
Sensitivity
Linearity(5)
MPX2202D Series
MPX2202A Series
Temperature Effect on Full Scale Span(5)
Temperature Effect on Offset(5)
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
4. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
• Linearity:
•
•
•
•
Output deviation from a straight line relationship with pressure, using end point method, over the specified
pressure range.
Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum
or maximum rated pressure, at 25°C.
TcSpan:
Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
7. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPX2202
Sensors
Freescale Semiconductor
3
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user.
Freescale's specified pressure sensor linearities are based
on the end point straight line method measured at the
midrange pressure.
LINEARITY
Linearity refers to how well a transducer's output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit (see Figure 2) or (2)
a least squares best line fit. While a least squares fit gives the
“best case” linearity error (lower numerical value), the
calculations required are burdensome.
Least
Square
Deviation
Least Squares Fit
Exaggerated
Performance
Curve
Relative Voltage Output
Straight Line
Deviation
End Point Straight
Line Fit
Offset
50
Pressure (% Fullscale)
0
100
Figure 2. Linearity Specification Comparison
ON-CHIP TEMPERATURE COMPENSATION AND CALIBRATION
Figure 3 shows the output characteristics of the MPX2202/
MPXV2202G series at 25°C. The output is directly
proportional to the differential pressure and is essentially a
straight line.
40
VS = 10 Vdc
TA = 25°C
P1 > P2
35
30
The effects of temperature on Full Scale Span and Offset
are very small and are shown under Operating
Characteristics.
TYP
Output (mVdc)
25
20
Span
Range
(TYP)
MAX
15
MIN
10
5
0
kPa
PSI
-5
0
25
50
7.25
100
14.5
Pressure
75
125
150
21.75
175
200
29
Offset
(TYP)
Figure 3. Output versus Pressure Differential
MPX2202
4
Sensors
Freescale Semiconductor
Silicone Gel
Die Coat
Differential/gauge
Die
P1
Stainless Steel
Metal Cover
Epoxy
Case
Wire Bond
Lead Frame
Differential/Gauge Element
P2
Bond
DIE
Silicone Gel
Die Coat
Absolute
Die
Stainless Steel
Metal Cover
P1
Epoxy
Case
Wire Bond
Lead Frame
Absolute Element
P2
Die
Bond
Figure 4. Cross-Sectional Diagrams (Not to Scale)
Figure 4 illustrates an absolute sensing die (right) and the
differential or gauge die in the basic chip carrier (Case 344).
A silicone gel isolates the die surface and wire bonds from the
environment, while allowing the pressure signal to be
transmitted to the silicon diaphragm.
The MPX2202/MPXV2202G series pressure sensor
operating characteristics and internal reliability and
qualification tests are based on use of dry air as the pressure
media. Media other than dry air may have adverse effects on
sensor performance and long term reliability. Contact the
factory for information regarding media compatibility in your
application.
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing the silicone gel
which isolates the die from the environment. The differential
or gauge sensor is designed to operate with positive
differential pressure applied, P1 > P2. The absolute sensor is
designed for vacuum applied to P1 side.
The Pressure (P1) side may be identified by using the
table below:
Table 3. Pressure (P1)/Vacuum (P2) Side Identification
Table
Part Number
Case Type
Pressure (P1) Side
Identifier
MPX2202A/D
344
Stainless Steel Cap
MPX2202DP
344C
Side with Part Marking
MPX2202AP/GP
344B
Side with Port Attached
MPX2202ASX
344F
Side with Port Attached
MPXV2202GP
1369
Side with Port Attached
MPXV2202DP
1351
Side with Part Marking
MPX2202
Sensors
Freescale Semiconductor
5
PACKAGE DIMENSIONS
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MPX2202
6
Sensors
Freescale Semiconductor
PACKAGE DIMENSIONS
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MPX2202
Sensors
Freescale Semiconductor
7
PACKAGE DIMENSIONS
C
R
M
1
B
-A-
2
Z
4
3
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
DIM
A
B
C
D
F
G
J
L
M
N
R
Y
Z
N
L
1 2 3 4
PIN 1
-TSEATING
PLANE
J
F
G
F
Y
D 4 PL
0.136 (0.005)
STYLE 1:
PIN 1.
2.
3.
4.
M
T A
DAMBAR TRIM ZONE:
THIS IS INCLUDED
WITHIN DIM. "F" 8 PL
M
STYLE 2:
PIN 1.
2.
3.
4.
GROUND
+ OUTPUT
+ SUPPLY
- OUTPUT
STYLE 3:
PIN 1.
2.
3.
4.
VCC
- SUPPLY
+ SUPPLY
GROUND
INCHES
MILLIMETERS
MIN
MAX MIN
MAX
0.595
0.630 15.11
16.00
0.514
0.534 13.06
13.56
0.200
0.220
5.08
5.59
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.014
0.016
0.36
0.40
0.695
0.725 17.65
18.42
30˚ NOM
30˚ NOM
0.475
0.495 12.07
12.57
0.430
0.450 10.92
11.43
0.048
0.052
1.22
1.32
0.106
0.118
2.68
3.00
GND
-VOUT
VS
+VOUT
CASE 344-15
ISSUE AA
UNIBODY PACKAGE
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
-A-
-T-
U
L
R
H
N
PORT #1
POSITIVE
PRESSURE
(P1)
-Q-
B
1 2 3 4
PIN 1
K
-P0.25 (0.010)
J
M
T Q
S
S
F
C
G
D 4 PL
0.13 (0.005)
M
T S
S
Q
S
DIM
A
B
C
D
F
G
H
J
K
L
N
P
Q
R
S
U
INCHES
MILLIMETERS
MIN
MAX
MIN
MAX
1.145
1.175
29.08
29.85
0.685
0.715
17.40
18.16
0.305
0.325
7.75
8.26
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.182
0.194
4.62
4.93
0.014
0.016
0.36
0.41
0.695
0.725
17.65
18.42
0.290
0.300
7.37
7.62
0.420
0.440
10.67
11.18
0.153
0.159
3.89
4.04
0.153
0.159
3.89
4.04
0.230
0.250
5.84
6.35
0.220
0.240
5.59
6.10
0.910 BSC
23.11 BSC
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
CASE 344B-01
ISSUE B
UNIBODY PACKAGE
MPX2202
8
Sensors
Freescale Semiconductor
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
-AU
V
PORT #1
R
W
L
H
PORT #2
PORT #1
POSITIVE PRESSURE
(P1)
PORT #2
VACUUM
(P2)
N
-QB
SEATING
PLANE
SEATING
PLANE
1 2 3 4
PIN 1
K
-P-T-
0.25 (0.010)
-T-
M
T Q
S
S
F
J
G
D 4 PL
C
0.13 (0.005)
M
T S
S
Q
S
INCHES
MILLIMETERS
MIN
MAX
MIN MAX
1.145
1.175
29.08 29.85
0.685
0.715
17.40 18.16
0.405
0.435
10.29 11.05
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.182
0.194
4.62
4.93
0.014
0.016
0.36
0.41
0.695
0.725
17.65 18.42
0.290
0.300
7.37
7.62
0.420
0.440
10.67 11.18
0.153
0.159
3.89
4.04
0.153
0.159
3.89
4.04
0.063
0.083
1.60
2.11
0.220
0.240
5.59
6.10
0.910 BSC
23.11 BSC
0.248
0.278
6.30
7.06
0.310
0.330
7.87
8.38
DIM
A
B
C
D
F
G
H
J
K
L
N
P
Q
R
S
U
V
W
STYLE 1:
PIN 1.
2.
3.
4.
GROUND
+ OUTPUT
+ SUPPLY
- OUTPUT
CASE 344C-01
ISSUE B
UNIBODY PACKAGE
-TC
A
E
-Q-
U
N
V
B
R
PORT #1
POSITIVE
PRESSURE
(P1)
PIN 1
-P0.25 (0.010)
M
T Q
M
4
3
2
1
S
K
J
F
D 4 PL
0.13 (0.005)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
B
C
D
E
F
G
J
K
N
P
Q
R
S
U
V
INCHES
MILLIMETERS
MIN
MAX MIN
MAX
1.080
1.120 27.43
28.45
0.740
0.760 18.80
19.30
0.630
0.650 16.00
16.51
0.016
0.020
0.41
0.51
0.160
0.180
4.06
4.57
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.014
0.016
0.36
0.41
0.220
0.240
5.59
6.10
0.070
0.080
1.78
2.03
0.150
0.160
3.81
4.06
0.150
0.160
3.81
4.06
0.440
0.460 11.18
11.68
0.695
0.725 17.65
18.42
0.840
0.860 21.34
21.84
0.182
0.194
4.62
4.92
G
M
T P
S
Q
S
STYLE 1:
PIN 1.
2.
3.
4.
GROUND
V (+) OUT
V SUPPLY
V (-) OUT
CASE 344F-15
ISSUE B
UNIBODY PACKAGE
MPX2202
Sensors
Freescale Semiconductor
9
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MPX2202
Rev. 4
08/2006
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