Freescale MPX53D 50 kpa uncompensated silicon pressure sensor Datasheet

Freescale Semiconductor
Technical Data
MPX53
Rev 4, 01/2007
50 kPa Uncompensated
Silicon Pressure Sensors
The MPX53/MPXV53GC series silicon piezoresistive pressure sensors
provide a very accurate and linear voltage output — directly proportional to the
applied pressure. These standard, low cost, uncompensated sensors permit
manufacturers to design and add their own external temperature compensating
and signal conditioning networks. Compensation techniques are simplified
because of the predictability of Freescale's single element strain gauge design.
Features
• Low Cost
• Patented Silicon Shear Stress Strain Gauge Design
• Ratiometric to Supply Voltage
• Easy to Use Chip Carrier Package Options
• 60 mV Span (Typ)
• Differential and Gauge Options
MPXV53GC6U
CASE 482A-01
ORDERING INFORMATION
Options
Case No.
MPX Series
Order No.
Packing
Options
Device
Marking
SMALL OUTLINE PACKAGE(1) (MPXV53 SERIES)
Ported
Gauge, Side Port, SMT 482A
Elements
482A
482C
UNCOMPENSATED PRESSURE
SENSOR
0 TO 50 kPA (0 – 7.25 psi)
60 mV FULL SCALE SPAN
(TYPICAL)
SMALL OUTLINE PACKAGES
Typical Applications
• Air Movement Control
• Environmental Control Systems
• Level Indicators
• Leak Detection
• Medical Instrumentation
• Industrial Controls
• Pneumatic Control Systems
• Robotics
Device
Type
MPX53
MPXV53GC
SERIES
MPXV53GC7U
CASE 482C-03
SMALL OUTLINE PACKAGE
PIN NUMBERS
1
GND(1)
5
N/C
MPXV53GC6T1 Tape & Rail
MPXV53G
2
+VOUT
6
N/C
MPXV53GC6U
Rails
MPXV53G
3
VS
7
N/C
MPXV53GC7U
Rails
MPXV53G
4
–VOUT
8
N/C
UNIBODY PACKAGE(2) (MPX53 SERIES)
Differential
Basic
Element
344
MPX53D
—
MPX53D
Differential
Ported
Elements Gauge
344C
MPX53DP
—
MPX53DP
344B
MPX53GP
—
MPX53GP
1. The MPXV53GC series pressure sensors are available with a pressure port, surface
mount, or DIP leadforms and two packing options.
2. MPX53 series pressure sensors are available in differential and gauge configurations.
Devices are available with basic element package or with pressure port fittings,
providing printed circuit board mounting ease and barbed hose pressure.
1. Pin 1 in noted by the notch in the lead.
UNIBODY PACKAGE PIN NUMBERS
1
GND(1)
3
VS
2
+VOUT
4
–VOUT
1. Pin 1 in noted by the notch in the lead.
UNIBODY PACKAGES
MPX53D
CASE 344-15
© Freescale Semiconductor, Inc., 2007. All rights reserved.
MPX53GP
CASE 344B-01
MPX53DP
CASE 344C-01
+VS
Sensor
+VOUT
-VOUT
GND
Figure 1. Uncompensated Pressure Sensor Schematic
VOLTAGE OUTPUT VERSUS APPLIED DIFFERENTIAL PRESSURE
The differential voltage output of the sensor is directly
proportional to the differential the pressure side (P1) relative
to the vacuum side (P2). Similarly, output voltage increases
as increasing vacuum is applied to the vacuum side (P2)
relative to the pressure side (P1).
Figure 1 shows a schematic of the internal circuitry on the
stand-alone pressure sensor chip.
Table 1. Maximum Ratings(1)
Rating
Symbol
Value
Unit
Maximum Pressure (P1 > P2)
PMAX
200
kPa
Storage Temperature
TSTG
–40 to +125
°C
TA
–40 to +125
°C
Operating Temperature
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
MPX53
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Table 2. Operating Characteristics (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic
Pressure
Supply
Range(1)
Voltage(2)
Supply Current
Full Scale
Span(3)
Symbol
Min
Typ
Max
Units
POP
0
—
50
kPa
VS
—
3.0
6.0
VDC
IO
—
6.0
—
mAdc
VFSS
45
60
90
mV
Offset(4)
VOFF
0
20
35
mV
Sensitivity
∆V/∆Ρ
—
1.2
—
mV/kPa
Linearity(5)
—
–0.6
—
0.4
%VFSS
—
—
±0.1
—
%VFSS
—
—
±0.5
—
%VFSS
TCVFSS
–0.22
—
-0.16
%VFSS/°C
TCVOFF
—
±15
—
µV/°C
TCR
0.31
—
0.37
%ZIN/°C
ZIN
355
—
505
Ω
ZOUT
750
—
1875
Ω
tR
—
1.0
—
ms
—
—
2.0
—
ms
—
—
±0.5
—
%VFSS
Pressure
Hysteresis(5)
(0 to 50 kPa)
(5)
Temperature Hysteresis
(–40°C to +125°C)
Temperature Coefficient of Full Scale
Temperature Coefficient of
Span(5)
Offset(5)
Temperature Coefficient of Resistance
Input Impedance
Output Impedance
Response Time
(6)
(10% to 90%)
Warm-Up Time
Offset
Stability(7)
(5)
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum related pressure.
4. Offset (VOFF) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
• Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum
or maximum rated pressure, at 25°C.
• TcSpan:
Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
• TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.
• Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
6. Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPX53
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Freescale Semiconductor
3
TEMPERATURE COMPENSATION
Figure 2 shows the typical output characteristics of the
MPX53/MPXV53GC series over temperature.
The piezoresistive pressure sensor element is a
semiconductor device which gives an electrical output signal
proportional to the pressure applied to the device. This device
uses a unique transverse voltage diffused semiconductor
strain gauge which is sensitive to stresses produced in a thin
silicon diaphragm by the applied pressure.
Because this strain gauge is an integral part of the silicon
diaphragm, there are no temperature effects due to
differences in the thermal expansion of the strain gauge and
the diaphragm, as are often encountered in bonded strain
gauge pressure sensors. However, the properties of the
strain gauge itself are temperature dependent, requiring that
the device be temperature compensated if it is to be used
over an extensive temperature range.
Temperature compensation and offset calibration can be
achieved rather simply with additional resistive components,
or by designing your system using the MPX2053 series
sensors.
Several approaches to external temperature
compensation over both –40 to +125°C and 0 to +80°C
ranges are presented in Freescale Application Note AN840.
100
MPX53
VS = 3 Vdc
P1 > P2
Output (mVdc)
90
80
70
+25°C
–40°C
60
50
40
Span
Range
(Typ)
+125×C
30
20
10
0
PSI 0
kPa 0
Offset
(Typ)
1
10
2
3
4
5
6
20
30
40
Pressure Differential
7
50
8
Figure 2. Output vs. Pressure Differential
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user.
Freescale’s specified pressure sensor linearities are based
on the end point straight line method measured at the
midrange pressure.
LINEARITY
Linearity refers to how well a transducer's output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range (see Figure 3). There are two basic methods
for calculating nonlinearity: (1) end point straight line fit or
(2) a least squares best line fit. While a least squares fit gives
the “best case” linearity error (lower numerical value), the
calculations required are burdensome.
90
Linearity
80
70
Actual
60
Span
(VFSS)
Output (mVdc)
50
40
Theoretical
30
20
Offset
(VOFF)
10
0
0
Pressure (kPA)
MAX
POP
Figure 3. Linearity Specification Comparison
MPX53
4
Sensors
Freescale Semiconductor
Silicone
Die Coat
Stainless Steel
Metal Cover
Die
P1
Epoxy
Case
Wire Bond
RTV Die
Bond
Lead Frame
P2
Figure 4. Unibody Package: Cross Sectional Diagram (Not to Scale)
Figure 4 illustrates the differential or gauge configuration
in the unibody chip carrier (Case 344). A silicone gel isolates
the die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the silicon
diaphragm.
The MPX53/MPXV53GC series pressure sensor
operating characteristics and internal reliability and
qualification tests are based on use of dry air as the pressure
media. Media other than dry air may have adverse effects on
sensor performance and long term reliability. Contact the
factory for information regarding media compatibility in your
application.
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing silicone gel which
isolates the die from the environment. The Freescale MPX
pressure sensor is designed to operate with positive
differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
following table.
Part Number
MPX53D
MPX53DP
MPX53GP
MPX53GC Series
Case Type
344
Pressure (P1) Side
Identifier
Stainless Steep Cap
344C
Side with Port Marking
344B
Side with Port Attached
482A, 482C
Side with Port Attached
MPX53
Sensors
Freescale Semiconductor
5
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
C
R
M
1
B
-A-
2
Z
4
3
DIM
A
B
C
D
F
G
J
L
M
N
R
Y
Z
N
L
1 2 3 4
PIN 1
-TSEATING
PLANE
J
F
G
F
D 4 PL
0.136 (0.005)
STYLE 1:
PIN 1.
2.
3.
4.
Y
M
T A
DAMBAR TRIM ZONE:
THIS IS INCLUDED
WITHIN DIM. "F" 8 PL
M
STYLE 2:
PIN 1.
2.
3.
4.
GROUND
+ OUTPUT
+ SUPPLY
- OUTPUT
STYLE 3:
PIN 1.
2.
3.
4.
VCC
- SUPPLY
+ SUPPLY
GROUND
INCHES
MILLIMETERS
MIN
MAX MIN
MAX
0.595
0.630 15.11
16.00
0.514
0.534 13.06
13.56
0.200
0.220
5.08
5.59
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.014
0.016
0.36
0.40
0.695
0.725 17.65
18.42
30˚ NOM
30˚ NOM
0.475
0.495 12.07
12.57
0.430
0.450 10.92
11.43
0.048
0.052
1.22
1.32
0.106
0.118
2.68
3.00
GND
-VOUT
VS
+VOUT
CASE 344-15
ISSUE AA
UNIBODY PACKAGE
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
-A-
-T-
U
L
R
H
N
PORT #1
POSITIVE
PRESSURE
(P1)
-Q-
B
1 2 3 4
PIN 1
K
-P0.25 (0.010)
J
M
T Q
S
S
F
C
G
D 4 PL
0.13 (0.005)
M
T S
S
Q
S
DIM
A
B
C
D
F
G
H
J
K
L
N
P
Q
R
S
U
INCHES
MILLIMETERS
MIN
MAX
MIN
MAX
1.145
1.175
29.08
29.85
0.685
0.715
17.40
18.16
0.305
0.325
7.75
8.26
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.182
0.194
4.62
4.93
0.014
0.016
0.36
0.41
0.695
0.725
17.65
18.42
0.290
0.300
7.37
7.62
0.420
0.440
10.67
11.18
0.153
0.159
3.89
4.04
0.153
0.159
3.89
4.04
0.230
0.250
5.84
6.35
0.220
0.240
5.59
6.10
0.910 BSC
23.11 BSC
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
CASE 344B-01
ISSUE B
UNIBODY PACKAGE
MPX53
6
Sensors
Sensors
FreescaleSemiconductor
Semiconductor
Freescale
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
-AU
V
PORT #1
R
W
L
H
PORT #2
PORT #1
POSITIVE PRESSURE
(P1)
PORT #2
VACUUM
(P2)
N
-QB
SEATING
PLANE
SEATING
PLANE
1 2 3 4
PIN 1
K
-P-T-
-T-
0.25 (0.010)
M
T Q
S
S
F
J
G
D 4 PL
C
0.13 (0.005)
M
T S
S
Q
S
DIM
A
B
C
D
F
G
H
J
K
L
N
P
Q
R
S
U
V
W
INCHES
MILLIMETERS
MIN
MAX
MIN MAX
1.145
1.175
29.08 29.85
0.685
0.715
17.40 18.16
0.405
0.435
10.29 11.05
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.182
0.194
4.62
4.93
0.014
0.016
0.36
0.41
0.695
0.725
17.65 18.42
0.290
0.300
7.37
7.62
0.420
0.440
10.67 11.18
0.153
0.159
3.89
4.04
0.153
0.159
3.89
4.04
0.063
0.083
1.60
2.11
0.220
0.240
5.59
6.10
0.910 BSC
23.11 BSC
0.248
0.278
6.30
7.06
0.310
0.330
7.87
8.38
STYLE 1:
PIN 1.
2.
3.
4.
GROUND
+ OUTPUT
+ SUPPLY
- OUTPUT
CASE 344C-01
ISSUE B
UNIBODY PACKAGE
MPX53
Sensors
Freescale Semiconductor
7
PACKAGE DIMENSIONS
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
CASE 482C-03
ISSUE B
SMALL OUTLINE PACKAGE
MPX53
8
Sensors
Freescale Semiconductor
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MPX53
Rev. 4
01/2007
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