MQFP-d Heat Spreader Metric Quad Flat Pack • 14 x 14mm to 32 x 32mm • 64 to 240 lead count • Lead pitch range from 0.80mm to 0.50mm FEATURES DESCRIPTION • Body Sizes: 14 x 14mm to 32 x 32mm STATS ChipPAC’s Heat Spreader Metric Quad Flat Pack (MQFP-d) is a thermally enhanced version of the QFP package. Thermal enhancement is achieved by an embedded anodized aluminum heat spreader which is dropped in during the mold process. This process allows the use of standard leadframe while offering an added margin of thermal performance for high power applications. The QFP-d package offers 30% improvement (typical) in thermal performance over standard MQFP packages. • Package Height: 2.0mm to 3.4mm (same as QFP) • Lead Counts: 64L to 240L • Lead Pitch: 0.80mm to 0.50mm • Moisture Sensitivity: JEDEC Level 3 • Wide range of open tool leadframe and die pad sizes available • JEDEC standard compliant • Lead-free and Green material sets available APPLICATIONS • ASIC • DSP • FPGA • PLD • High speed logic, high power microprocessors / controllers • 3D graphics, telecom, wireless, audio, CPU / GUI www.statschippac.com MQFP-d Heat Spreader Metric Quad Flat Pack SPECIFICATIONS RELIABILITY Die Thickness Gold Wire Lead Finish Marking Packing Options Moisture Sensitivity Level Temperature Cycling High Temperature Storage Pressure Cooker Test 380-560µm (15-22mils) range preferred 25/30µm (1.0/1.2mils) diameter, 99.999% Au 85/15 Sn/Pb or Matte Tin Laser / ink JEDEC tray / tape and reel JEDEC Level 3 -65°C/150°C, 1000 cycles 150°C, 500 hrs 121°C 100% RH, 2 atm, 168 hrs -55°C/125°C, 1000 cycles Liquid Thermal Shock (opt) THERMAL PERFORMANCE, θja (°C/W) Package Body Size (mm) Pad Size (mm) Die Size (mm) 100L 14 x 20 x 2.7 9.0 x 9.0 7.8 x 7.8 208L 28 x 28 x 3.4 14.0 x 14.0 10.2 x 10.2 Thermal Performance, θ ja (°C/W) 26.6 18.4 Note: Simulation data for package mounted on 4 layer PCB (per JEDEC JESD51-7) under natural convection as defined in JESD51-2. ELECTRICAL PERFORMANCE Package Body Size (mm) Pad Size (mm) Frequency Self Inductance (nH) Self Capacitance(pF) 100L 14 x 20 x 2.7 9.0 x 9.0 100MHz 6.3~8.7 0.56~1.11 208L 28 x 28 x 3.4 10.5 x 10.5 100MHz 11.6~14.7 1.43~1.56 Notes: *Results are simulated. Data is available through 2.5GHz. CROSS-SECTION PACKAGE CONFIGURATIONS Package Size (mm) 14 14 14 28 32 Corporate Office Global Offices x x x x x 14 14 20 28 32 x x x x x 2.0 2.7 2.7 3.4 3.4 Lead Count 64, 80 64, 80 80, 100, 128 120, 128, 144, 160, 208 240 10 Ang Mo Kio St. 65, #05-17/20 Techpoint, Singapore 569059 Tel: 65-6824-7777 Fax: 65-6720-7823 USA 510-979-8000 JAPAN 81-43-351-3320 KOREA 82-31-639-8911 TAIWAN 886-3-593-6565 CHINA 86-21-5976-5858 UK 44-1483-413-700 MALAYSIA 603-4257-6222 NETHERLANDS 31-38-333-2023 The STATS ChipPAC logo is a registered trademark of STATS ChipPAC Ltd. All other product names and other company names herein are for identification purposes only and may be the trademarks or registered trademarks of their respective owners. STATS ChipPAC disclaims any and all rights in those marks. STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given, or that the use of such information will not infringe on intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of, or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. ©Copyright 2005. STATS ChipPAC Ltd. All rights reserved. January 2005