OKI MR27T1602L 1m-word x 16-bit or 2m-word x 8-bit Datasheet

FEDR27T1602L-02-01
OKI Semiconductor
MR27T1602L
1M–Word × 16–Bit or 2M–Word × 8–Bit
Issue Date: Dec. 8, 2004
P2ROM
FEATURES
· 1,048,576-word × 16-bit / 2,097,152-word × 8-bit electrically
switchable configuration
· Access time
2.7 V to 3.6 V power supply 90 ns MAX
3.0 V to 3.6 V power supply 80 ns MAX
· Operating current 16 mA MAX (5MHz)
· Standby current 10 µA MAX
· Input/Output TTL compatible
· Three-state output
PACKAGES
· MR27T1602L-xxxTN
48-pin plastic TSOP (TSOP I 48-P-1220-0.50-1K)
P2ROM ADVANCED TECHNOLOGY
PIN CONFIGURATION (TOP VIEW)
A15
A14
A13
A12
A11
A10
A9
A8
A19
NC
NC
NC
NC
NC
NC
A18
A17
A7
A6
A5
A4
A3
A2
A1
1
48
2
47
3
46
4
45
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17
32
18
31
19
30
20
29
21
28
22
27
23
26
24
25
A16
BYTE#
VSS
D15/A–1
D7
D14
D6
D13
D5
D12
D4
VCC
D11
D3
D10
D2
D9
D1
D8
D0
OE#
VSS
CE#
A0
48TSOP(Type-I)
P2ROM stands for Production Programmed ROM. This
exclusive Oki technology utilizes factory test equipment for
programming the customers code into the P2ROM prior to final
production testing. Advancements in this technology allows
production costs to be equivalent to MASKROM and has many
advantages and added benefits over the other non-volatile
technologies, which include the following;
· Short lead time, since the P2ROM is programmed at the final stage of the production process, a large P2ROM
inventory "bank system" of un-programmed packaged products are maintained to provide an aggressive
lead-time and minimizes liability as a custom product.
· No mask charge, since P2ROMs do not utilize a custom mask for storing customer code, no mask charges
apply.
· No additional programming charge, unlike Flash and OTP that require additional programming and
handling costs, the P2ROM already has the code loaded at the factory with minimal effect on the production
throughput. The cost is included in the unit price.
· Custom Marking is available at no additional charge.
· Pin Compatible with Mask ROM and some FLASH products.
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FEDR27T1602L-02-01
OKI Semiconductor
MR27T1602L / P2ROM
BLOCK DIAGRAM
A–1
OE#
CE
OE
Row Decoder
CE#
BYTE#
Memory Cell Matrix
1M × 16-Bit or 2M × 8-Bit
Column Decoder
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
Address Buffer
× 8/× 16 Switch
Multiplexer
Output Buffer
D0
D2
D1
D4
D3
D6
D5
D8
D7
D10
D9
D12
D11
D14
D13
D15
In 8-bit output mode, these pins
are placed in a high-Z state and
pin D15 functions as the A-1
address pin.
PIN DESCRIPTIONS
Pin name
D15 / A–1
A0 to A19
D0 to D14
CE#
OE#
BYTE#
VCC
VSS
NC
Functions
Data output / Address input
Address inputs
Data outputs
Chip enable input
Output enable input
Word / Byte select input
Power supply voltage
Ground
No connect
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FEDR27T1602L-02-01
OKI Semiconductor
MR27T1602L / P2ROM
FUNCTION TABLE
Mode
Read (16-Bit)
Read (8-Bit)
CE#
L
L
OE#
L
L
Output disable
L
H
Standby
H
∗
BYTE#
H
L
H
L
H
L
VCC
D0 to D7
DOUT
3.0 V
D8 to D14
DOUT
Hi–Z
D15/A–1
Hi–Z
∗
Hi–Z
∗
L/H
∗: Don’t Care (H or L)
ABSOLUTE MAXIMUM RATINGS
Parameter
Operating temperature under bias
Storage temperature
Input voltage
Output voltage
Power supply voltage
Power dissipation per package
Output short circuit current
Symbol
Ta
Tstg
VI
VO
VCC
PD
IOS
Condition
—
relative to VSS
Ta = 25°C
—
Value
0 to 70
–55 to 125
–0.5 to VCC+0.5
–0.5 to VCC+0.5
–0.5 to 5
1.0
10
Unit
°C
°C
V
V
V
W
mA
RECOMMENDED OPERATING CONDITIONS
Parameter
VCC power supply voltage
Input “H” level
Input “L” level
Symbol
VCC
VIH
VIL
Condition
VCC = 2.7 to 3.6 V
Min.
2.7
2.2
–0.5∗∗
Typ.
—
—
—
(Ta = 0 to 70°C)
Max.
Unit
3.6
V
VCC+0.5∗
V
0.6
V
Voltage is relative to VSS.
∗ : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns.
∗∗ : -1.5V(Min.) when pulse width of undershoot is less than 10ns.
PIN CAPACITANCE
Parameter
Input
BYTE#
Output
Symbol
CIN1
CIN2
COUT
Condition
VI = 0 V
VO = 0 V
Min.
—
—
—
(VCC = 3.0 V, Ta = 25°C, f = 1 MHz)
Typ.
Max.
Unit
—
8
pF
—
120
—
10
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FEDR27T1602L-02-01
OKI Semiconductor
MR27T1602L / P2ROM
ELECTRICAL CHARACTERISTICS
DC Characteristics
Parameter
Input leakage current
Output leakage current
VCC power supply current
(Standby)
VCC power supply current
(Read)
Input “H” level
Input “L” level
Output “H” level
Output “L” level
Symbol
ILI
ILO
ICCSC
ICCST
ICCA
VIH
VIL
VOH
VOL
Condition
VI = 0 to VCC
VO = 0 to VCC
CE# = VCC
CE# = VIH
CE# = VIL, OE# = VIH
f=5MHz
—
—
IOH = –1 mA
IOL = 2 mA
Min.
—
—
—
—
(VCC = 2.7 V to 3.6 V, Ta = 0 to 70°C)
Typ.
Max.
Unit
—
10
µA
—
10
µA
—
10
µA
—
1
mA
—
—
16
mA
2.2
–0.5∗∗
2.4
—
—
—
—
—
VCC+0.5∗
0.6
—
0.4
V
V
V
V
Voltage is relative to VSS.
∗ : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns.
∗∗ : -1.5V(Min.) when pulse width of undershoot is less than 10ns.
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FEDR27T1602L-02-01
OKI Semiconductor
MR27T1602L / P2ROM
AC Characteristics
Parameter
Address cycle time
Address access time
CE# access time
OE# access time
Output disable time
Output hold time
Parameter
Address cycle time
Address access time
CE# access time
OE# access time
Output disable time
Output hold time
Symbol
tC
tACC
tCE
tOE
tCHZ
tOHZ
tOH
Condition
—
CE# = OE# = VIL
OE# = VIL
CE# = VIL
OE# = VIL
CE# = VIL
CE# = OE# = VIL
(VCC = 2.7 V to 3.6 V, Ta = 0 to 70°C)
Min.
Max.
Unit
90
—
ns
—
90
ns
—
90
ns
—
35
ns
0
30
ns
0
25
ns
0
—
ns
Symbol
tC
tACC
tCE
tOE
tCHZ
tOHZ
tOH
Condition
—
CE# = OE# = VIL
OE# = VIL
CE# = VIL
OE# = VIL
CE# = VIL
CE# = OE# = VIL
(VCC = 3.0 V to 3.6 V, Ta = 0 to 70°C)
Min.
Max.
Unit
80
—
ns
—
80
ns
—
80
ns
—
30
ns
0
20
ns
0
20
ns
0
—
ns
Measurement conditions
Input signal level------------------------------------ 0 V / 3 V
Input timing reference level ---------------------- 1/2 Vcc
Output load------------------------------------------- 50 pF
Output timing reference level-------------------- 1/2 Vcc
Output load
Output
50 pF
(Including scope and jig)
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FEDR27T1602L-02-01
OKI Semiconductor
MR27T1602L / P2ROM
TIMING CHART (READ CYCLE)
16-Bit Read Mode (BYTE# = VIH)
tC
tC
A0 to A19
tOH
tACC
tCE
CE#
tOE
tCHZ
tOH
OE#
tOHZ
tACC
D0 to D15
Valid Data
Hi-Z
Valid Data
Hi-Z
8-Bit Read Mode (BYTE# = VIL)
tC
tC
A-1 to A19
tOH
tACC
tCE
CE#
tOE
tCHZ
tOH
OE#
tOHZ
tACC
D0 to D7
Hi-Z
Valid Data
Valid Data
Hi-Z
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FEDR27T1602L-02-01
OKI Semiconductor
MR27T1602L / P2ROM
PACKAGE DIMENSIONS
(Unit: mm)
TSOP(1)48-P-1220-0.50-1K
Mirror finish
5
Package material
Lead frame material
Pin treatment
Package weight (g)
Rev. No./Last Revised
Epoxy resin
42 alloy
Solder plating (≥5µm)
0.55 TYP.
1/Dec. 2, 1999
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in
storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name,
package name, pin number, package code and desired mounting conditions (reflow method, temperature and
times).
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FEDR27T1602L-02-01
OKI Semiconductor
MR27T1602L / P2ROM
REVISION HISTORY
Document
No.
FEDR27T1602L-02-01
Page
Date
Previous
Edition
Current
Edition
Dec. 08, 2004
–
–
Description
Final edition 1
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FEDR27T1602L-02-01
OKI Semiconductor
MR27T1602L / P2ROM
NOTICE
1. The information contained herein can change without notice owing to product and/or technical improvements.
Before using the product, please make sure that the information being referred to is up-to-date.
2. The outline of action and examples for application circuits described herein have been chosen as an explanation
for the standard action and performance of the product. When planning to use the product, please ensure that the
external conditions are reflected in the actual circuit, assembly, and program designs.
3. When designing your product, please use our product below the specified maximum ratings and within the
specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating
temperature.
4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation
resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or
unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified
maximum ratings or operation outside the specified operating range.
5. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is granted
by us in connection with the use of the product and/or the information and drawings contained herein. No
responsibility is assumed by us for any infringement of a third party’s right which may result from the use
thereof.
6. The products listed in this document are intended for use in general electronics equipment for commercial
applications (e.g., office automation, communication equipment, measurement equipment, consumer
electronics, etc.). These products are not, unless specifically authorized by Oki, authorized for use in any
system or application that requires special or enhanced quality and reliability characteristics nor in any system
or application where the failure of such system or application may result in the loss or damage of property, or
death or injury to humans.
Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace
equipment, nuclear power control, medical equipment, and life-support systems.
7. Certain products in this document may need government approval before they can be exported to particular
countries. The purchaser assumes the responsibility of determining the legality of export of these products and
will take appropriate and necessary steps at their own expense for these.
8. No part of the contents contained herein may be reprinted or reproduced without our prior permission.
Copyright 2004 Oki Electric Industry Co., Ltd.
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