OKI MR27T401E-XXXMA 512k-word x 8-bit Datasheet

FEDR27T401E-02-01
OKI Semiconductor
MR27T401E
Issue Date: Apr. 17, 2002
512K–Word × 8–Bit P2ROM
FEATURES
PIN CONFIGURATION (TOP VIEW)
·524,288-word × 8-bit
· 2.7 V to 3.6 V power supply
· Access time
100 ns MAX
· Operating current
25 mA MAX
· Standby current
10 µA MAX
· Input/Output TTL compatible
· Three-state output
PACKAGES
· MR27T401E-xxxMA
32-pin plastic SOP (SOP32-P-525-1.27-K)
· MR27T401E-xxxTA
32-pin plastic TSOP (TSOP I 32-P-814-0.50-1K)
DC 1
32
Vcc
A16 2
A15 3
31
A18
A17
A12 4
A7 5
A6 6
29
A5 7
A4 8
A3 9
A2 10
A1 11
A0 12
23
30
· Short lead time, since the P2ROM is programmed at the
final stage of the production process, a large P2ROM
inventory "bank system" of un-programmed packaged
products are maintained to provide an aggressive lead-time
and minimize liability as a custom product.
· No mask charge, since P2ROMs do not utilize a custom
mask for storing customer code, no mask charges apply.
· No additional programming charge, unlike Flash and
OTP that require additional programming and handling
costs, the P2ROM already has the code loaded at the
factory with minimal effect on the production throughput.
The cost is included in the unit price.
· Custom Marking is available at no additional charge.
A14
A13
27
A8
26
A9
A11
25
24
OE#
A10
CE#
D7
20 D6
19 D5
18 D4
17 D3
22
21
D0 13
D1 14
D2 15
VSS 16
P2ROM ADVANCED TECHNOLOGY
P2ROM stands for Production Programmed ROM. This
exclusive Oki technology utilizes factory test equipment for
programming the customers code into the P2ROM prior to final
production testing. Advancements in this technology allows
production costs to be equivalent to MASKROM and has many
advantages and added benefits over the other non-volatile
technologies, which include the following;
28
32SOP,
A11
A9
A8
A13
A14
A17
A18
Vcc
DC
A16
A15
A12
A7
A6
A5
A4
1
32
2
31
3
30
4
29
5
28
6
27
7
26
8
25
9
24
10
23
11
22
12
21
13
20
14
19
15
18
16
17
OE#
A10
CE#
D7
D6
D5
D4
D3
Vss
D2
D1
D0
A0
A1
A2
A3
32TSOP(Type-I)
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FEDR27T401E-02-01
OKI Semiconductor
MR27T401E
BLOCK DIAGRAM
CE
OE
Row Decoder
OE#
Memory Cell Matrix
512K × 8-Bit
Column Decoder
Address Buffer
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
CE#
Multiplexer
Output Buffer
D0
D1
D2
D3
D4
D5
D6
D7
PIN DESCRIPTIONS
Pin name
Functions
A0 to A18
Address inputs
D0 to D7
Data outputs
CE#
Chip enable input
OE#
Output enable input
VCC
Power supply voltage
VSS
Ground
DC
Don’t Care *,
* : Logical input level is ignored . However the pin is connected to internal circuit.
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FEDR27T401E-02-01
OKI Semiconductor
MR27T401E
FUNCTION TABLE
Mode
CE#
OE#
L
L
Output disable
L
H
Standby
H
*
Read
VCC
D0 to D7
Dout
3.0 V
Hi-Z
Hi-Z
∗: Don’t Care (H or L)
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Operating temperature under bias
Condition
Ta
Storage temperature
VI
relative to VSS
Output voltage
VO
Power supply voltage
VCC
Power dissipation per package
PD
Unit
0 to 70
°C
–55 to 125
°C
–0.5 to VCC+0.5
V
–0.5 to VCC+0.5
V
–0.5 to 5
V
1.0
W
—
Tstg
Input voltage
Value
—
RECOMMENDED OPERATING CONDITIONS
(Ta = 0 to 70°C)
Parameter
Symbol
VCC power supply voltage
VCC
Input “H” level
VIH
Input “L” level
VIL
Condition
Min.
Typ.
2.7
2.2
–0.5∗∗
VCC = 2.7 to 3.6 V
Max.
Unit
—
3.6
V
—
VCC+0.5∗
V
—
0.6
V
Voltage is relative to VSS.
∗ : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns.
∗∗ : -1.5V(Min.) when pulse width of undershoot is less than 10ns.
PIN CAPACITANCE
(VCC = 3.0 V, Ta = 25°C, f = 1 MHz)
Parameter
Symbol
Input
CIN1
DC
CIN2
Output
COUT
Condition
VI = 0 V
VO = 0 V
Min.
Typ.
Max.
—
—
8
—
—
200
—
—
10
Unit
pF
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FEDR27T401E-02-01
OKI Semiconductor
MR27T401E
ELECTRICAL CHARACTERISTICS
DC Characteristics
(VCC = 2.7 V to 3.6 V, Ta = 0 to 70°C)
Symbol
Condition
Min.
Typ.
Max.
Unit
Input leakage current
Parameter
ILI
VI = 0 to VCC
—
—
10
µA
Output leakage current
ILO
VO = 0 to VCC
—
—
10
µA
VCC power supply current
ICCSC
CE# = VCC
—
—
10
µA
(Standby)
ICCST
CE# = VIH
—
—
1
mA
VCC power supply current
ICCA1
CE# = VIL
—
—
25
mA
ICCA2
OE# = VIH
(Read)
tc = 100 ns
—
—
20
mA
Input “H” level
VIH
—
tc = 200 ns
2.2
—
VCC+0.5∗
V
Input “L” level
VIL
—
–0.5∗∗
—
0.6
V
Output “H” level
VOH
IOH = –1 mA
2.4
—
—
V
Output “L” level
VOL
IOL = 2 mA
—
—
0.4
V
Voltage is relative to VSS.
∗ : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns.
∗∗ : -1.5V(Min.) when pulse width of undershoot is less than 10ns
AC Characteristics
(VCC = 2.7 V to 3.6 V, Ta = 0 to 70°C)
Parameter
Symbol
Condition
Min.
Max.
Unit
tC
—
100
—
ns
Address access time
tACC
CE# = OE# = VIL
—
100
ns
CE# access time
tCE
OE# = VIL
—
100
ns
OE# access time
tOE
CE #= VIL
—
40
ns
Address cycle time
Output disable time
Output hold time
tCHZ
OE# = VIL
0
35
ns
tOHZ
CE# = VIL
0
30
ns
tOH
CE #= OE# = VIL
0
—
ns
Measurement conditions
Input signal level -------------------------------- 0 V/Vcc V
Input timing reference level ------------------ 1/2Vcc
Output load--------------------------------------- 50 pF
Output timing reference level ---------------- 1/2Vcc
Output load
Output
50 pF
(Including scope and jig)
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FEDR27T401E-02-01
OKI Semiconductor
MR27T401E
TIMING CHART (READ CYCLE)
Read
tC
tC
A0 to A18
tOH
tACC
tCE
CE#
tOE
tCHZ
tOH
OE#
tOHZ
tACC
D0 to D7
Hi-Z
Valid Data
Valid Data
Hi-Z
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FEDR27T401E-02-01
OKI Semiconductor
MR27T401E
PACKAGE DIMENSIONS
(Unit: mm)
SOP32-P-525-1.27-K
Mirror finish
5
Package material
Lead frame material
Pin treatment
Package weight (g)
Rev. No./Last Revised
Epoxy resin
42 alloy
Solder plating (≥5µm)
1.32 TYP.
5/Fev. 10, 1997
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity
absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name,
package name, pin number, package code and desired mounting conditions (reflow method, temperature and
times).
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FEDR27T401E-02-01
OKI Semiconductor
MR27T401E
(Unit: mm)
TSOP(1)32-P-0814-0.50-1K
Mirror finish
5
Package material
Lead frame material
Pin treatment
Package weight (g)
Rev. No./Last Revised
Epoxy resin
42 alloy
Solder plating (≥5µm)
0.27 TYP.
3/Dec. 10, 1996
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity
absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name,
package name, pin number, package code and desired mounting conditions (reflow method, temperature and
times).
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FEDR27T401E-02-01
OKI Semiconductor
MR27T401E
REVISION HISTORY
Page
Document
No.
Date
FEDR27T401E-02-01
Apr. 17, 2002
Previous
Edition
Current
Edition
–
–
Description
Final edition 1
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FEDR27T401E-02-01
OKI Semiconductor
MR27T401E
NOTICE
1. The information contained herein can change without notice owing to product and/or technical improvements.
Before using the product, please make sure that the information being referred to is up-to-date.
2.
The outline of action and examples for application circuits described herein have been chosen as an
explanation for the standard action and performance of the product. When planning to use the product, please
ensure that the external conditions are reflected in the actual circuit, assembly, and program designs.
3.
When designing your product, please use our product below the specified maximum ratings and within the
specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating
temperature.
4.
Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation
resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or
unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified
maximum ratings or operation outside the specified operating range.
5.
Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is
granted by us in connection with the use of the product and/or the information and drawings contained herein.
No responsibility is assumed by us for any infringement of a third party’s right which may result from the use
thereof.
6.
The products listed in this document are intended for use in general electronics equipment for commercial
applications (e.g., office automation, communication equipment, measurement equipment, consumer
electronics, etc.). These products are not authorized for use in any system or application that requires special
or enhanced quality and reliability characteristics nor in any system or application where the failure of such
system or application may result in the loss or damage of property, or death or injury to humans.
Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace
equipment, nuclear power control, medical equipment, and life-support systems.
7.
Certain products in this document may need government approval before they can be exported to particular
countries. The purchaser assumes the responsibility of determining the legality of export of these products
and will take appropriate and necessary steps at their own expense for these.
8.
No part of the contents contained herein may be reprinted or reproduced without our prior permission.
Copyright 2002 Oki Electric Industry Co., Ltd.
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