Unity Opto Technology Co., Ltd. Technical Data µSideLEDs MSL-510SW PRELIMINARY 09/09/2003 Features l Package : white micro-sideview PLCC-2 package with yellow epoxy. l Feature of the device : extremely wide viewing angle ideal for backlighting and coupling in light guides l color : x/y coordinate : 0.31/0.32 l Viewing angle : Lambertian Emitter (X : 120o / Y : 120o) l Technology : InGaN on sapphire with yellow phosphor (white) l Grouping parameter : luminous intensity , Chromaticity l Assembly methods : suitable for all SMT assembly methods l Soldering methods : IR reflow soldering l Taping : 8-mm tape with 3500/reel, φ180mm Applications l Backlighting : LCD Display, Key pads 1 Package Dimensions Unit : mm (inch) Notes : 1. All dimensions are in millimeters (inches) 2. Tolerance is ±0.1 unless other specified Recommended Solder Patterns Method of Taping / Polarity and Orientation Packing unit 3500/reel Notes : 1. All dimensions are in millimeters (inches) 2. Tolerance is ±0.1 unless other specified 2 Selection Guide Viewing Angle Luminous Part Number MSL-510SW Chromaticity Coordinates (Typ.) Intensity (Degrees) Typ. Typ. Typ. Typ. R 360 - 500 0.31 0.32 120 120 S 500 - 720 0.31 0.32 120 120 T 720 1000 0.31 0.32 120 120 Forward Reverse Thermal Voltage Current Resistance VF (Volts) IR (uA) RθJ-S (oC/W) @IF = 20mA @ VR = 5V Typ. Max 3.3 4.0 Min. Typ. Symbol T OP Value Unit -30 ~ +85 o T stg -40 ~ +100 o IF 30 C mA Peak forward current I FM 100 mA Reverse Voltage VR 5 V Power dissipation P tot 120 C mW o Soldering Temperature y Max. Maximum Ratings Forward current x Typ. Min. Storage Temp. range y Min. MSL-510SW Operating Temp. range x Bin Device Type Parameter 2θ 1/2 Tsid Reflow Soldering : 260 C, for 10 sec Hand Soldering : 350oC, for 3 sec IFP Conditions : Pulse Width <10msec and Duty < 1/10 3 Max Typ. 50 220 Relative Spectrum Emission Irel = f (l), TA = 25oC, IF = 20mA V(l) = Standard eye response curve White Relative Luminous Intensity 45 40 35 30 25 20 15 10 5 0 350 450 550 650 750 850 950 1050 Wavelength (nm) FIG.1 RELATIVE LUMINOUS INTERSITY VS. WAVELENGTH Forward Current IF = f (VF) Relative Luminous Intensity IV/IV (20mA) = f (IF) o TA = 25oC TA = 25 C (mA) 50 IF 40 2.0 1.8 IV 1.6 1.4 30 1.2 1.0 20 0.8 0.6 10 0.4 0.2 0 0.0 0.0 1.0 2.0 3.0 4.0 5.0 VF 6.0 (V) 0 Ambient Temperature VS. Allowable Forward IF 20 30 40 IF 50 (mA) Forward Current IF (mA) FIG.3 RELATIVE LUMINOUS INTENSITY VS. FORWARD CURRENT Forward Voltage (V) FIG.2 FORWARD CURRENT VS. FORWARD VOLTAGE (mA) 10 Radiation Characteristic Irel = f (q) 0o 40 10o Y X 20o 30o 30 40o 20 1.0 50o 0.9 60o 0.8 70o 80o 90o 10 TA temp. ambient 0 0 20 40 60 80 T 0.7 100 (oC) 0.5 0.3 0.1 0.2 0.4 0.6 FIG.5 RADIATION DIAGRAM Ambient Temperature TA (oC) FIG.4 FORWARD CURRENT VS. AMBIENT TEMPERATURE 4 X Y IR Reflow Soldering Profile Lead Solder Temp 2-5oC / sec. Pre heating 120-150oC 240oC Max. 10sec. Max. 2-5oC / sec. 60sec. Max. Above 200oC 120sec. Max. Time 5 Unity White uSideLEDs Bin Codes Category Code S B3 Luminous Intensity Group R : 360 mcd ~ 500 mcd S : 500 mcd ~ 720 mcd T : 720 mcd ~ 1000 mcd Luminous intensity is tested at a current pulse ( 20mA ) duration of 25 ms and an accuracy of ± 10% Color Coordinate @ IF=20mA Bin Code 1 3 2 4 X Y X Y X Y X Y A0 0.28 0.248 0.264 0.267 0.283 0.305 0.296 0.276 B3 0.287 0.295 0.283 0.305 0.304 0.330 0.307 0.315 B4 0.307 0.315 0.304 0.330 0.330 0.360 0.330 0.339 B5 0.296 0.276 0.287 0.295 0.307 0.315 0.311 0.294 B6 0.311 0.294 0.307 0.315 0.330 0.339 0.330 0.318 C1 0.330 0.360 0.361 0.385 0.361 0.351 0.330 0.318 Chromaticity coordinate groups are tested at a current ( 20mA ) pulse duration of 25 ms and a tolerance of ± 0.01 6 Tape Dimensions REEL Dimensions Items Leader Cover Tape Specifications Remarks Cover tape shall be longer than 400mm without carrier tape Carrier Tape There shall be more than 40 empties Trailer The end of the carrier tape shall be adhered on the cover tape The orientation of tape shall be as shown There shall be more than 40 empties The end of the tape shall be inserted into a slit of the hub 7 Surface Mount Moisture Sensitivity Specifications 1. Controlling Moisture Unity Opto Technology, in its design of packing materials and packing methods, takes into consideration the susceptibility of some Unity packages to moisture induced damage. The risk of this damage is caused when the LED lens plastic encapsulation material is exposed to increases or decreases in the Relative Humidity of the surrounding environment. Such damage may include delamination between the die and the LED lens plastic encapsulation material, which may result in open connections due to broken wire bonds. Moisture in the package having reached a critical level will fracture the package in order to escape when exposed to peak temperature conditions, typical in soldering practices. Therefore, the control of moisture levels in the LED package is critical to reduce the risk of moisture-induced failures. Please follow JEDEC-STD-033A standards for handling moisture sensitive devices. 2. Packaging SMD devices: Unity packages all SMD devices into dry pack bags (moisture barrier bags). Unity includes a desiccant pouch in each bag. Testing confirms that the desiccant pouch greatly reduces the presence of moisture by maintaining the environment in the bag, thus protecting the devices during shipment and storage. 3. Handling Dry Packed Parts Upon receipt, the bags should be inspected for damage to ensure that the bag’s integrity has been maintained. Inspection should verify that there are no holes, gouges, tears, or punctures of any kind that may expose the contents of the bag. To open the bag, simply cut across the top of the bag as close to the original seal as possible being careful not to damage the contents. Once open the desired quantity of units should be removed and the bag resealed. If the bag is left open longer than 2 hours, the desiccant pouch should be replaced with a dry desiccant and the bag should be sealed immediately to avoid moisture damage. 8