OKI MSM54V32126A-50TS-K 131,072-word x 32-bit dynamic ram : fast page mode type with edo Datasheet

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131,072-Word ¥ 32-Bit DYNAMIC RAM : FAST PAGE MODE TYPE WITH EDO
DESCRIPTION
The MSM54V32126A is a Graphics DRAM organized in a 131,072-word ¥ 32-bit configuration. The
technology used to fabricate the MSM54V32126A is OKI's CMOS silicon gate process technology.
The device operates with a single 3.3 V power supply.
FEATURES
• 131,072-word ¥ 32-bit organization
• Single 3.3 V power supply, ±0.3 V tolerance
• Refresh: 512 cycles/8 ms
• Fast Page Mode with Extended Data Out (EDO)
• Byte write, Byte read
• RAS only refresh
• CAS before RAS refresh
• CAS before RAS self-refresh
• Hidden refresh
• Package options:
64-pin 525 mil plastic SSOP
(SSOP64-P-525-0.80-K)
(Product : MSM54V32126A-xxGS-K)
70/64-pin 400 mil plastic TSOP (Type II)(TSOPII70/64-P-400-0.65-K)(Product : MSM54V32126A-xxTS-K)
xx indicates speed rank.
PRODUCT FAMILY
Family
Access Time (Max.)
tRAC
tAA
tCAC tOEA
Cycle Time
(Min.)
ar
This version:
Jan. 1998
MSM54V32126A
in
¡ Semiconductor
MSM54V32126A
¡ Semiconductor
Power Dissipation
Operating (Max.) Standby (Max.)
MSM54V32126A-45
45 ns 23 ns 13 ns 13 ns
90 ns
540 mW
MSM54V32126A-50
50 ns 25 ns 15 ns 15 ns
100 ns
504 mW
MSM54V32126A-60
60 ns 30 ns 18 ns 18 ns
120 ns
486 mW
3.1 mW
1/26
¡ Semiconductor
MSM54V32126A
PIN CONFIGURATION (TOP VIEW)
VCC
DQ0
DQ1
DQ2
DQ3
VCC
DQ4
DQ5
DQ6
DQ7
VSS
DQ8
DQ9
DQ10
DQ11
VCC
DQ12
DQ13
DQ14
DQ15
VSS
NC
NC
NC
WE
RAS
NC
A0
A1
A2
A3
VCC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
VSS
DQ31
DQ30
DQ29
DQ28
VCC
DQ27
DQ26
DQ25
DQ24
VSS
DQ23
DQ22
DQ21
DQ20
VCC
DQ19
DQ18
DQ17
DQ16
VSS
CAS1
CAS2
CAS3
CAS4
OE
A8
A7
A6
A5
A4
VSS
VCC
DQ0
DQ1
DQ2
DQ3
VCC
DQ4
DQ5
DQ6
DQ7
VSS
DQ8
DQ9
DQ10
DQ11
VCC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
VSS
DQ31
DQ30
DQ29
DQ28
VCC
DQ27
DQ26
DQ25
DQ24
VSS
DQ23
DQ22
DQ21
DQ20
VCC
DQ12
DQ13
DQ14
DQ15
VSS
NC
NC
NC
WE
RAS
NC
A0
A1
A2
A3
VCC
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
DQ19
DQ18
DQ17
DQ16
VSS
CAS1
CAS2
CAS3
CAS4
OE
A8
A7
A6
A5
A4
VSS
70/64-Pin Plastic TSOP (II)
(K Type)
64-Pin Plastic SSOP
Pin Name
A0 - A8
DQ0 - DQ31
RAS
CAS1 - CAS4
WE
Note:
Function
Address Input
Data Input / Data Output
Row Address Strobe
Column Address Strobe
OE
Write Enable
Output Enable
VCC
Power Supply (3.3 V)
VSS
Ground (0 V)
NC
No Connection
The same power supply voltage must be provided to every VCC pin, and the same GND
voltage level must be provided to every VSS pin.
2/26
CAS1
I/O
Controller
CAS2
I/O
Controller
CAS3
I/O
Controller
CAS4
Column
8 Address
Buffers
A0 - A8
8
Internal
Address
Counter
Row
9 Address
Buffers
Refresh
Control Clock
9
Row
Decoders
Output
Buffers
8
DQ0 - DQ7
8
Input
Buffers
8
I/O
Controller
8
Output
Buffers
8
Column Decoders
8
Input
Buffers
8
8
Input
Buffers
8
Sense Amps
DQ8 - DQ15
32
I/O
Selector 32
Memory
Cells
DQ16 - DQ23
8
Output
Buffers
8
8
Input
Buffers
8
On-chip
VBB Generator
3/26
VSS
DQ24 - DQ31
8
Output
Buffers
8
MSM54V32126A
VCC
Word
Drivers
8
¡ Semiconductor
OE
BLOCK DIAGRAM
RAS
WE
Timing
Generator
¡ Semiconductor
MSM54V32126A
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
Voltage on Any Pin Relative to VSS
VT
–0.5 to 4.5
V
Short Circuit Output Current
IOS
50
mA
Power Dissipation
PD
1
W
Operating Temperature
Topr
0 to 70
°C
Storage Temperature
Tstg
–55 to 150
°C
Recommended Operating Conditions
Parameter
Power Supply Voltage
(Ta = 0°C to 70°C)
Symbol
Min.
Typ.
Max.
Unit
VCC
3.0
3.3
3.6
V
VSS
0
0
0
V
Input High Voltage
VIH
3.0
—
3.6
V
Input Low Voltage
VIL
–0.3
—
0.3
V
Capacitance
(VCC = 3.3 V ±0.3 V, Ta = 25°C, f = 1 MHz)
Symbol
Typ.
Max.
Unit
Input Capacitance
CIN
—
7
pF
Input / Output Capacitance
CIO
—
7
pF
Parameter
4/26
¡ Semiconductor
MSM54V32126A
DC Characteristics
Parameter
(VCC = 3.3 V ±0.3 V, Ta = 0°C to 70°C)
Symbol
Condition
Output High Voltage
VOH
IOH = –0.1 mA
Output Low Voltage
VOL
IOL = 0.1 mA
Input Leakage Current
ILI
Output Leakage Current
MSM54V32126A MSM54V32126A MSM54V32126A
Unit Note
-45
-50
-60
Min. Max. Min. Max. Min. Max.
VCC
VCC
2.0
VCC
2.0
2.0
V
0
0.8
0
0.8
0
0.8
V
0 V < VIN < VCC;
All other pins not
under test = 0 V
–10
10
–10
10
–10
10
mA
ILO
0 V < VOUT < 3.6 V
Output Disable
–10
10
–10
10
–10
10
mA
Average Power
Supply Current
(Operating)
ICC1
RAS, CAS cycling,
tRC = Min.
—
140
—
130
—
110
mA 1, 2, 3
Power Supply
Current (Standby)
ICC2
RAS ≥ VCC – 0.2 V,
CAS ≥ VCC – 0.2 V
—
850
—
850
—
850
mA
Average Power
Supply Current
(RAS Only Refresh)
ICC3
RAS = cycling,
CAS = VIH,
tRC = Min.
—
140
—
130
—
110
mA 1, 2, 3
Average Power
Supply Current
(Fast Page Mode)
ICC4
RAS = VIL,
CAS cycling,
tHPC = Min.
—
150
—
140
—
135
mA 1, 2, 4
Average Power
Supply Current
(CAS before RAS Refresh)
ICC5
RAS = cycling,
CAS before RAS
—
140
—
130
—
110
mA 1, 2, 4
Average Power
Supply Current
(CAS before RAS
Self-Refresh)
ICCS
RAS = VIL,
CAS = VIL
—
950
—
950
—
950
mA
Notes:
1, 2
1. Specified values are obtained with minimum cycle time.
2. ICC is dependent on output loading. Specified values are obtained with the output
open.
3. Address can be changed once or less while RAS = VIL.
4. Address can be changed once or less while CAS = VIH.
5/26
¡ Semiconductor
MSM54V32126A
AC Characteristics (1/2)
(VCC = 3.3 V ±0.3 V, Ta = 0°C to 70°C) Note 1, 2, 3
Parameter
Random Read or Write Cycle Time
Read Modify Write Cycle
Symbol
MSM54V32126A MSM54V32126A MSM54V32126A
-45
-50
-60
Unit Note
Min.
Max.
Min.
Max.
Min.
Max.
tRC
90
—
100
—
120
—
ns
tRWC
135
—
145
—
170
—
ns
tHPC
18
—
20
—
24
—
ns
tPRWC
65
—
70
—
80
—
ns
Access Time from RAS
tRAC
—
45
—
50
—
60
ns
4, 9,10
Access Time from Column Address
tAA
—
23
—
25
—
30
ns
4, 10
Access Time from CAS
tCAC
—
13
—
15
—
18
ns
4, 9
Access Time from CAS Precharge
tCPA
—
28
—
30
—
35
ns
4, 13
Output Buffer Turn-off Delay Time from RAS
tREZ
3
20
3
20
3
20
ns
5
Output Buffer Turn-off Delay Time from CAS
tCEZ
3
20
3
20
3
20
ns
5
tT
3
35
3
35
3
35
ns
3
RAS Precharge Time
tRP
39
—
44
—
54
—
ns
RAS Pulse Width
tRAS
45
10k
50
10k
60
10k
ns
RAS Pulse Width (Hyper Page Mode Only)
tRASP
45
100k
50
100k
60
100k
ns
RAS Hold Time
tRSH
12
—
14
—
14
—
ns
CAS Hold Time
tCSH
45
—
50
—
60
—
ns
CAS Pulse Width
tCAS
6
10k
7
10k
9
10k
ns
RAS to CAS Delay Time
tRCD
20
32
20
35
20
42
ns
9
RAS to Column Address Delay Time
tRAD
15
22
15
25
15
30
ns
10
Column Address to RAS Lead Time
tRAL
22
—
24
—
28
—
ns
CAS to RAS Precharge Time
tCRP
6
—
6
—
8
—
ns
13
CAS Precharge Time (Hyper Page Mode)
tCP
6
—
7
—
9
—
ns
15
Row Address Set-up Time
tASR
0
—
0
—
0
—
ns
Row Address Hold Time
tRAH
6
—
7
—
9
—
ns
Column Address Set-up Time
tASC
0
—
0
—
0
—
ns
12
Column Address Hold Time
tCAH
7
—
8
—
10
—
ns
12
Column Address Hold Time referenced to RAS
tAR
30
—
35
—
40
—
ns
Read Command Set-up Time
tRCS
0
—
0
—
0
—
ns
12
Read Command Hold Time
tRCH
0
—
0
—
0
—
ns
6, 12
Read Command Hold Time referenced to RAS
tRRH
0
—
0
—
0
—
ns
6
CAS "H" to RAS "H" Lead Time
tCRL
0
—
0
—
0
—
ns
RAS "H" to CAS "H" Lead Time
tRCL
0
—
0
—
0
—
ns
Data Output Hold after CAS Low
tDOH
3
—
3
—
3
—
ns
11
Write Command Set-up Time
tWCS
0
—
0
—
0
—
ns
8, 12
Write Command Hold Time
tWCH
7
—
8
—
10
—
ns
12
Fast Page Mode Cycle Time
Fast Page Mode Read-Modify-Write Cycle Time
Transition Time (Rise and Fall)
6/26
¡ Semiconductor
MSM54V32126A
AC Characteristics (2/2)
(VCC = 3.3 V ±0.3 V, Ta = 0°C to 70°C) Note 1, 2, 3
Parameter
Symbol
MSM54V32126A MSM54V32126A MSM54V32126A
-45
-50
-60
Unit Note
Min.
Max.
Min.
Max.
Min.
Max.
Write Command Hold Time referenced to RAS tWCR
30
—
35
—
40
—
ns
Write Command Pulse Width
tWP
8
—
9
—
10
—
ns
Write Command to RAS Lead Time
tRWL
8
—
9
—
10
—
ns
Write Command to CAS Lead Time
tCWL
8
—
9
—
10
—
ns
Output Buffer Turn-off Delay Time from WE
tWEZ
3
20
3
20
3
20
ns
5
Data Set-up Time
tDS
0
—
0
—
0
—
ns
7, 12
7, 12
14
Data Hold Time
tDH
7
—
8
—
10
—
ns
Data Hold Time referenced to RAS
tDHR
30
—
35
—
40
—
ns
OE to Data-in Delay Time
tOED
12
—
12
—
12
—
ns
RAS to WE Delay Time
tRWD
65
—
70
—
80
—
ns
8
Column Address to WE Delay Time
tAWD
42
—
45
—
50
—
ns
8
8
CAS to WE Delay Time
tCWD
32
—
35
—
40
—
ns
Data to CAS Delay Time
tDZC
0
—
0
—
0
—
ns
Data to OE Delay Time
tDZO
0
—
0
—
0
—
ns
Access Time from OE
tOEA
—
13
—
15
—
18
ns
Output Buffer Turn-off Delay Time from OE
tOEZ
3
20
3
20
3
20
ns
OE Command Hold Time
tOEH
8
—
9
—
10
—
ns
RAS Hold Time referenced to OE
tROH
10
—
10
—
12
—
ns
OE "L" to CAS "H" Lead Time
tOCH
10
—
10
—
10
—
ns
CAS "H" to OE "L" Lead Time
tCHO
10
—
10
—
10
—
ns
OE Precharge Time
tOEP
10
—
10
—
12
—
ns
WE Pulse Width (Output Disable)
tWPE
10
—
10
—
12
—
ns
CAS Set-up Time for CAS before RAS Cycle
tCSR
6
—
8
—
10
—
ns
12
CAS Hold Time for CAS before RAS Cycle
tCHR
6
—
8
—
10
—
ns
13
5
RAS Precharge to CAS Active Time
tRPC
10
—
10
—
10
—
ns
12
CAS Precharge Time (Refresh Counter Test)
tCPT
20
—
25
—
30
—
ns
15
Refresh Period
tREF
—
8
—
8
—
8
ms
RAS Pulse Width (CAS before RAS Self-Refresh) tRASS
100
—
100
—
100
—
ms
tRPS
100
—
110
—
130
—
ns
tCHS
0
—
0
—
0
—
ns
RAS Precharge Time
(CAS before RAS Self-Refresh)
CAS Hold Time (CAS before RAS Self-Refresh)
7/26
¡ Semiconductor
Notes:
MSM54V32126A
1. An initial pause of 200 ms is required after power-up followed by any 8 RAS cycles
(Example : RAS only refresh) before proper device operation is achieved. In case of
using internal refresh counter, a minimum of 8 CAS before RAS cycles instead of 8 RAS
cycles are required.
2. The AC characteristics assume at tT = 3 ns.
3. VIH (Min.) and VIL (Max.) are reference levels for measuring timing of input signals.
Also, transition times are measured between VIH and VIL. Input levels at the AC testing
are 3.0 V/0 V.
4. Data outputs are measured with a load of 30 pF.
DOUT reference levels : VOH/VOL = 2.0 V/0.8 V.
5. tREZ (Max.), tCEZ (Max.), tWEZ (Max.) and tOEZ (Max.) define the time at which the
outputs achieve the open circuit condition and are not referenced to output voltage
levels. This parameter is sampled and not 100% tested.
6. Either tRCH or tRRH must be satisfied for a read cycle.
7. These parameters are referenced to CAS leading edge of early write cycles and to WE
leading edge in OE controlled write cycles and read modify write cycles.
8. tWCS, tRWD, tCWD and tAWD are not restrictive operating parameters. They are included
in the data sheet as electrical characteristics only. If tWCS ≥ tWCS (Min.), the cycle is an
early write cycle and the data out pin will remain open circuit throughout the entire
cycle; If tRWD ≥ tRWD (Min.), tCWD ≥ tCWD (Min.) and tAWD ≥ tAWD (Min.), the cycle is
a read modify write cycle and the data out will contain data read from the selected cell:
If neither of the above sets of conditions is satisfied, the condition of the data out is
indeterminate.
9. Operation within the tRCD (Max.) limit ensures that tRAC (Max.) can be met.
tRCD (Max.) is specified as a reference point only: If tRCD is greater than the specified
tRCD (Max.) limit, then access time is controlled by tCAC.
10. Operation within the tRAD (Max.) limit ensures that tRAC (Max.) can be met. tRAD (Max.)
is specified as a reference point only: If tRAD is greater than the specified tRAD (Max.)
limit, then access time is controlled by tAA.
11. This is guaranteed by design. (tDOH = tCAC - output transition time) This parameter is
not 100% tested.
12. These parameters are determined by the earliest falling edge of CAS1, CAS2, CAS3, or
CAS4.
13. These parameters are determined by the latest rising edge of CAS1, CAS2, CAS3, or
CAS4.
14. tCWL should be satisfied by all CASes.
15. tCP and tCPT are determined by the time that all CASes are high.
8/26
¡ Semiconductor
MSM54V32126A
CASn-DQ FUNCTION TABLE
CAS1
CAS2
CAS3
CAS4
DQ0-7
DQ8-15
DQ16-23
DQ24-31
H
H
H
H
*
*
*
*
H
H
H
L
*
*
*
Enable
H
H
L
H
*
*
Enable
*
H
H
L
L
*
*
Enable
Enable
H
L
H
H
*
Enable
*
*
H
L
H
L
*
Enable
*
Enable
H
L
L
H
*
Enable
Enable
*
H
L
L
L
*
Enable
Enable
Enable
L
H
H
H
Enable
*
*
*
L
H
H
L
Enable
*
*
Enable
L
H
L
H
Enable
*
Enable
*
L
H
L
L
Enable
*
Enable
Enable
L
L
H
H
Enable
Enable
*
*
L
L
H
L
Enable
Enable
*
Enable
L
L
L
H
Enable
Enable
Enable
*
L
L
L
L
Enable
Enable
Enable
Enable
Enable
*
Read cycle
Valid Data-out
High-Z
Write cycle
Write Data
Don't Care
9/26
,
,,
,
¡ Semiconductor
MSM54V32126A
TIMING WAVEFORM
Read Cycle (Outputs Controlled by RAS)
tRC
tRP
tRAS
RAS
tCSH
tCRP
CAS1
|
CAS4
Address
tRCD
tCRP
tRSH
tCAS
tASR
tRAD
tRAH
tASC
Row
tCRL
tCAH
tRAL
Column
tAR
tRRH
tRCS
tRCH
WE
tROH
tOEA
OE
tCAC
tAA
DQ0 - DQ31
Open
tRAC
tOEZ
tREZ
Valid Data-out
"H" or "L"
10/26
,
,,
,
¡ Semiconductor
MSM54V32126A
Read Cycle (Outputs Controlled by CAS)
tRC
tRP
tRAS
RAS
tCSH
tCRP
CAS1
|
CAS4
tCRP
tRSH
tCAS
tASR
Address
tRCD
tRAD
tRAH
tASC
Row
tCAH
tRAL
tRCL
Column
tRCH
tAR
tRRH
tRCS
WE
tROH
tOEA
OE
tCAC
tAA
DQ0 - DQ31
Open
tOEZ
tCEZ
Valid Data-out
tRAC
"H" or "L"
11/26
¡ Semiconductor
MSM54V32126A
Write Cycle (Early Write)
tRC
tRAS
tRP
tAR
RAS
tCSH
CAS1
|
CAS4
tCRP
tRSH
tRCD
tCAS
,
,,,,
,,
tRAD
tASR
Address
tRAL
tASC
tRAH
Row
tCAH
Column
tCWL
tRWL
tWP
WE
tWCH
tWCS
tWCR
OE
tDS
DQ0 - DQ31
tDH
Valid Data-in
tDHR
"H" or "L"
12/26
¡ Semiconductor
MSM54V32126A
Write Cycle (OE Control Write)
tRC
tRAS
RAS
tRP
tAR
,
,,,
,,
tCSH
CAS1
|
CAS4
tCRP
tASR
Address
tRSH
tCAS
tRCD
tRAD
tRAH
tRAL
tASC
Row
tCAH
Column
tCWL
tRWL
tRCS
WE
tWP
tWCR
tOEH
OE
tOED
tDHR
tDS
DQ0 - DQ31
tDH
Valid Data-in
"H" or "L"
13/26
¡ Semiconductor
MSM54V32126A
Read Modify Write Cycle
tRWC
tRAS
RAS
tRP
tAR
,
,,
tCSH
CAS1
|
CAS4
tCRP
tRSH
tCAS
tRAD
tASR
Address
tRCD
tRAL
tRAH
tASC
Row
tCAH
Column
tCWL
tCWD
tRCS
WE
tRWL
tWP
tAWD
tRWD
tOEA
OE
tDZO
tAA
DQ0 - DQ31
tRAC
tDZC
tCAC
tOEZ
Valid
Data-out
tOEH
tOED
tDS
tDH
Valid Data-in
"H" or "L"
14/26
,,
,,
¡ Semiconductor
MSM54V32126A
Fast Page Mode Read Cycle with EDO
tRC
tRASP
tAR
RAS
tCSH
tCRP
CAS1
|
CAS4
tHPC
tRCD
tRSH
tCP
tCAS
tCAS
tRAD
tRAL
tASC
tASC tCAH
tRAH
tCRP
tCP
tCAS
tASR
Address
tRP
Row
Column
tASC
tCAH
Column
tRCS
tRCS
tRCH
tCAH
Column
tRRH
tRCS tRCH
tRCH
WE
tOEA
OE
tCAC
tAA
DQ0 - DQ31
Open
tCAC
tDOH
Valid Data-out
tRAC
tAA
tCPA
tCAC
tDOH
Valid Data-out
tREZ
tOEZ
Valid Data-out
tAA
tCPA
"H" or "L"
15/26
¡ Semiconductor
MSM54V32126A
Fast Page Mode Write Cycle (Early Write)
tRC
tRASP
tRP
tAR
RAS
tCSH
tCRP
tHPC
tRCD
tCAS
CAS1
|
CAS4
tCP
tCAS
tRSH
tCRP
tCP
tCAS
,
,
,,
tRAD
tASR tRAH
Address
tASC
Row
tCAH
tASC
Column
tCAH
Column
tCWL
tWCS
WE
tWCH
tWP
tASC
tRAL
tCAH
Column
tCWL
tWCS
tWCH
tWP
tCWL
tWCS
tWCH
tWP
tWCR
tRWL
OE
tDHR
tDS
DQ0 - DQ31
tDH
Valid
Data-in
tDS tDH
tDS tDH
Valid
Data-in
Valid
Data-in
"H" or "L"
16/26
¡ Semiconductor
MSM54V32126A
Fast Page Mode Read Modify Write Cycle
tRC
tRASP
tRP
tAR
RAS
tCSH
tCRP
tPRWC
tRCD
tCP
tCAS
tRSH
tCRP
tCP
tCAS
tCAS
,
,,
,
CAS1
|
CAS4
tRAD
tASR tRAH
Address
tASC
Row
tASC
tCAH
Column
WE
tCWL
tRWD
tAWD
tOEA
OE
tDS
Valid
Data-out
DQ0 - DQ31
tCAC
tAA
tOEZ
tCWL
tAWD
tOEA
tWP
tDH
Valid
Data-in
tCAC
tDS
Valid
Data-out
tRAL
tCAH
Column
tCWD
tOED
tAA
tASC
Column
tCWD
tRCS
tCAH
tWP
tOED
tAA
tOEZ
tDH
Valid
Data-in
tRWL
tCWL
tCWD
tAWD
tOEA
tWP
tROH
tOED
tOEZ
tDS
Valid
Data-out
tOEH
tDH
Valid
Data-in
tCAC
tRAC
"H" or "L"
17/26
,
,,,
¡ Semiconductor
MSM54V32126A
RAS Only Refresh Cycle
tRC
tRP
tRAS
RAS
tRPC
tCRP
CAS1
|
CAS4
Address
tASR
tRAH
Row
Note: DQs are open, WE, OE = "H" or "L"
"H" or "L"
18/26
¡ Semiconductor
MSM54V32126A
CAS before RAS Refresh Cycle
tRC
tRP
RAS
tRAS
tRP
tRPC
tCP
tCSR
tCHR
CASn
tCEZ
DQ0 - DQ31
Open
Note: WE, OE, A0 - A8 = "H" or "L"
19/26
,,,
,
¡ Semiconductor
MSM54V32126A
Hidden Refresh Read Cycle
tRC
tRC
tRAS
tRP
tRAS
tRP
RAS
tCRP
tRSH
tRCD
tCHR
CAS1
|
CAS4
tASR
Address
tRAD
tRAH tASC
Row
tRAL
tCAH
Column
tAR
tRCS
tRRH
WE
tROH
OE
tOEA
tCAC
DQ0 - DQ31
tOEZ
tREZ
Valid Data-out
tAA
tRAC
"H" or "L"
20/26
¡ Semiconductor
MSM54V32126A
Hidden Refresh Write Cycle
tRC
tRAS
tRC
tRAS
tRP
tRP
,,,,
,,
RAS
tCRP
CAS1
|
CAS4
tASR
Address
tRCD
tRSH
tCHR
tRAL
tRAD
tASC
tRAH
tCAH
Column
Row
tAR
tWCS
tWCH
tWP
WE
tRWL
tWCR
OE
tDS
DQ0 - DQ31
tDH
Valid
Data-in
tDHR
"H" or "L"
21/26
¡ Semiconductor
MSM54V32126A
,
,
,,,
,
CAS before RAS Refresh Counter Test Cycle
tRAS
tRP
RAS
CAS1
|
CAS4
tCSR
tCHR
tCPT
tRSH
tCAS
tASC
tCAH
Column
Address
tRAL
Read Cycle
tRCS
WE
tRRH
tRCH
tCAC
tROH
tAA
tOEA
OE
tAA
DQ0 - DQ31
tOEZ
Open
tCEZ
Valid Data-out
tRWL
tCWL
Write Cycle
tWCS
tWCH
tWP
tDS
tDH
WE
OE
DQ0 - DQ31
Open
Valid Data-in
tRWL
tCWL
tAWD
tCWD
Read Modify Write Cycle
tRCS
tWP
WE
tOEA
OE
tAA
DQ0 - DQ31
Open
tCAC
tOEZ
Valid
Data-out
tOED
tDS
tDH
Valid
Data-in
"H" or "L"
22/26
¡ Semiconductor
CAS before RAS Self-Refresh Cycle
tRASS
tRP
RAS
tRPC
tCP
tRPS
tRPC
tCHS
tCSR
CASn
tCEZ
DQ0 - DQ31
,
MSM54V32126A
Open
Note: WE, OE, A0 - A8 = "H" or "L"
"H" or "L"
23/26
tAR
RAS
tCSH
tCRP
CAS1
|
CAS4
tHPC
tRCD
tCP
tCAS
tRSH
tCP
tCP
tCAS
tCRP
tCAS
tCAS
,
tRAL
tRAD
tASR tRAH
Address
tASC
Row
tCAH
tASC tCAH
tASC tCAH
tASC tCAH
Column
Column
Column
Column
tRRH
tRCS
tRCH
tRCH
tRCS
WE
tRAC
tCHO
tOEA
tCAC
tCAC
Valid
Data-out
tOEP
tAA
tOEZ
Valid
Data-out
tOEA
tCAC
tOEZ tOEA
Valid*
Data-out
tWEZ
tAA
Valid*
Data-out
tREZ
Valid
Data-out
24/26
* : Same Data
"H" or "L"
MSM54V32126A
Open
tDOH
tWPE
tCAC
tCPA
tAA
DQ0 - DQ31
tOEP
tAA
OE
tOCH
¡ Semiconductor
tRP
tRASP
Fast Page Mode Read with EDO High-Z Operation
tRC
¡ Semiconductor
MSM54V32126A
PACKAGE DIMENSIONS
(Unit : mm)
SSOP64-P-525-0.80-K
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
1.34 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
25/26
¡ Semiconductor
MSM54V32126A
(Unit : mm)
TSOPII70/64-P-400-0.65-K
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.59 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
26/26
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