ON MUR550PFG Switchmode power rectifier Datasheet

MUR550APF, MURD550PF,
MUR550PF
Preferred Device
SWITCHMODEt
Power Rectifier
These state−of−the−art devices are designed for power factor
correction in discontinuous and critical conduction mode.
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Features
•
•
•
•
•
•
ULTRAFAST RECTIFIER
5.0 AMPERES, 520 VOLTS
520 V Rating Meets 80% Derating Requirements of Major OEMs
Low Forward Voltage Drop
Low Leakage
Ultrafast 95 Nanosecond Recovery Time
Reduces Forward Conduction Loss
Pb−Free Packages are Available
MARKING DIAGRAMS
AXIAL LEAD
CASE 267
STYLE 1
Applications
• DCM PFC Designs
• Switching Power Supplies
• Power Inverters
A
MUR
550APF
YYWW G
G
Mechanical Characteristics:
• Case: Epoxy, Molded
• Epoxy Meets UL 94 V−0 @ 0.125 in
• Weight: MUR550APF: 1.1 Gram (Approximately)
•
•
MURD550PF: 0.4 Gram (Approximately)
MUR550PF: 1.9 Gram (Approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
220°C Max. for 10 Seconds
DPAK
CASE 369C
4
1 2
YWW
U
550G
1
3
4
3
Pin 1: No Connect
4
TO−220AC
CASE 221B
PLASTIC
AY WWG
MUR550PF
KA
1
3
1
4
3
A
= Assembly Location
YY, Y
= Year
WW
= Work Week
G or G = Pb−Free Package
KA
= Diode Polarity
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
February, 2006 − Rev. 2
1
Publication Order Number:
MUR550/D
MUR550APF, MURD550PF, MUR550PF
MAXIMUM RATINGS
Rating
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
(Rated VR) TC = 65°C
(Rated VR) TC = 160°C
Symbol
Value
Unit
VRRM
VRWM
VR
520
V
IF(AV)
5.0
A
MUR550APF
MURD550PF, MUR550PF
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, 60 Hz)
IFSM
MUR550APF
MURD550PF
MUR550PF
A
85
75
100
Operating Junction Temperature Range
TJ
−65 to +175
°C
Storage Temperature Range
Tstg
−65 to +175
°C
ESD Ratings:
Machine Model = C
Human Body Model = 3B
ESD
V
> 400
>8000
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Rating
Symbol
Thermal Resistance, Junction−to−Case (Note 1)
MURD550PF, MUR550PF
Thermal Resistance, Junction−to−Ambient
MUR550APF
MURD550PF (Note 3)
RqJC
RqJA
Value
Unit
°C/W
2.8
°C/W
Note 2
62
1. Rating applies when surface mounted on the minimum pad sizes recommended.
2. See Note 2, Ambient Mounting Data.
3. 1 inch square pad size on FR4 board.
ELECTRICAL CHARACTERISTICS
Rating
Symbol
Maximum Instantaneous Forward Voltage Drop (Note 4)
(IF = 5.0 A, TJ = 25°C)
(IF = 5.0 A, TJ = 150°C)
VF
Maximum Instantaneous Reverse Current (Note 4)
(VR = 520 V, TJ = 25°C)
(VR = 520 V, TJ = 150°C)
IR
Maximum Reverse Recovery Time
(IF = 1.0 A, di/dt = 50 A/ms, VR = 30 V, TJ = 25°C)
trr
Value
Unit
V
1.15
0.98
mA
5.0
400
ns
95
4. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.
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2
MUR550APF, MURD550PF, MUR550PF
NOTE 2 — AMBIENT MOUNTING DATA
Data shown for thermal resistance junction−to−ambient
(RqJA) for the mountings shown is to be used as typical
guideline values for preliminary engineering or in case the
tie point temperature cannot be measured.
TYPICAL VALUES FOR RqJA IN STILL AIR
Mounting
Method
1
2
RqJA
Lead Length, L (IN)
1/8
1/4
1/2
3/4
50
51
53
55
58
59
61
63
Units
°C/W
°C/W
28
°C/W
3
MOUNTING METHOD 1
P.C. Board Where Available Copper
Surface area is small.
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
L
L
MOUNTING METHOD 2
Vector Push−In Terminals T−28
ÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉ
L
L
MOUNTING METHOD 3
P.C. Board with
1−1/2 ″ x 1−1/2 ″ Copper Surface
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
L = 1/2 ″
Board Ground Plane
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3
IF, INSTANTANEOUS FORWARD CURRENT (AMPS)
iF, INSTANTANEOUS FORWARD CURRENT (AMPS)
MUR550APF, MURD550PF, MUR550PF
100
100
10
150°C
1.0
125°C
25°C
0.1
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
10
150°C
1.0
125°C
25°C
0.1
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE
(VOLTS)
Figure 2. Maximum Forward Voltage
IR, MAXIMUM REVERSE CURRENT (AMPS)
Figure 1. Typical Forward Voltage
1.0E−3
IR, REVERSE CURRENT (AMPS)
1.0E−3
150°C
1.0E−4
1.0E−4
150°C
125°C
1.0E−5
1.0E−5
125°C
1.0E−6
1.0E−6
1.0E−7
1.0E−7
25°C
1.0E−8
1.0E−8
1.0E−9
0
100
200
25°C
300
400
500
1.0E−9
0
100
200
300
400
VR, REVERSE VOLTAGE (VOLTS)
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Reverse Current
Figure 4. Maximum Reverse Current
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4
500
10
PFO, AVERAGE POWER DISSIPATION
(WATTS)
IF, AVERAGE FORWARD CURRENT (AMPS)
MUR550APF, MURD550PF, MUR550PF
dc
SQUARE WAVE
5
0
100
110
120
130
140
150
160
170
10
180
9
8
SQUARE
WAVE
7
6
dc
5
4
3
2
1
0
0
1
2
3
4
5
6
7
8
9
TC, CASE TEMPERATURE (°C)
IO, AVERAGE FORWARD CURRENT (AMPS)
Figure 5. Current Derating
Figure 6. Forward Power Dissipation
10
C, CAPACITANCE (pF)
100
25°C
10
1
0
50
100
150
200
VR, REVERSE VOLTAGE (VOLTS)
R(t), TRANSIENT THERMAL RESISTANCE
Figure 7. Capacitance
100
10
0.5
0.2
0.1
0.05
1
P(pk)
0.01
t1
0.1
0.01
0.000001
0.00001
t2
DUTY CYCLE, D = t1/t2
Single Pulse
0.0001
0.001
0.01
0.1
1.0
t, TIME (s)
Figure 8. Thermal Response for MUR550APF
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5
10
100
1000
R(t), TRANSIENT THERMAL RESISTANCE
MUR550APF, MURD550PF, MUR550PF
10
0.5
1
0.2
0.1
0.05
0.01
P(pk)
0.1
t1
Single Pulse
t2
DUTY CYCLE, D = t1/t2
0.01
0.000001
0.00001
0.0001
0.001
0.01
0.1
1.0
100
10
1000
t, TIME (s)
R(t), TRANSIENT THERMAL RESISTANCE
Figure 9. Thermal Response for MURD550PF
10
0.5
1
0.2
0.1
0.05
P(pk)
0.01
0.1
t1
Single Pulse
t2
DUTY CYCLE, D = t1/t2
0.01
0.000001
0.00001
0.0001
0.001
0.01
0.1
1.0
10
100
1000
t, TIME (s)
Figure 10. Thermal Response for MUR550PF
ORDERING INFORMATION
Package
Shipping †
MUR550APF
Axial*
500 Units/Bag
MUR550APFG
Axial*
500 Units/Bag
MUR550APFRL
Axial*
1500 Tape & Reel
MUR550APFRLG
Axial*
1500 Tape & Reel
MURD550PFT4
DPAK
2500 Tape & Reel
DPAK
(Pb−Free)
2500 Tape & Reel
TO−220
50 Units/Rail
TO−220
(Pb−Free)
50 Units/Rail
Device
MURD550PFT4G
MUR550PF
MUR550PFG
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure, BRD8011/D.
*This package is inherently Pb−Free.
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6
MUR550APF, MURD550PF, MUR550PF
PACKAGE DIMENSIONS
AXIAL LEAD
CASE 267−05
ISSUE G
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 267−04 OBSOLETE, NEW STANDARD 267−05.
A
K
D
1
2
B
DIM
A
B
D
K
K
INCHES
MIN
MAX
0.287
0.374
0.189
0.209
0.047
0.051
1.000
−−−
MILLIMETERS
MIN
MAX
7.30
9.50
4.80
5.30
1.20
1.30
25.40
−−−
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
DPAK
CASE 369C−01
ISSUE O
−T−
C
B
V
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
SEATING
PLANE
E
R
4
Z
A
S
1
2
DIM
A
B
C
D
E
F
G
H
J
K
L
R
S
U
V
Z
3
U
K
F
J
L
H
D
G
2 PL
0.13 (0.005)
M
T
SOLDERING FOOTPRINT*
6.20
0.244
3.0
0.118
2.58
0.101
5.80
0.228
1.6
0.063
6.172
0.243
SCALE 3:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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7
INCHES
MIN
MAX
0.235 0.245
0.250 0.265
0.086 0.094
0.027 0.035
0.018 0.023
0.037 0.045
0.180 BSC
0.034 0.040
0.018 0.023
0.102 0.114
0.090 BSC
0.180 0.215
0.025 0.040
0.020
−−−
0.035 0.050
0.155
−−−
MILLIMETERS
MIN
MAX
5.97
6.22
6.35
6.73
2.19
2.38
0.69
0.88
0.46
0.58
0.94
1.14
4.58 BSC
0.87
1.01
0.46
0.58
2.60
2.89
2.29 BSC
4.57
5.45
0.63
1.01
0.51
−−−
0.89
1.27
3.93
−−−
MUR550APF, MURD550PF, MUR550PF
PACKAGE DIMENSIONS
TO−220 TWO−LEAD
CASE 221B−04
ISSUE D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
C
B
Q
F
T
S
DIM
A
B
C
D
F
G
H
J
K
L
Q
R
S
T
U
4
A
1
U
3
H
K
L
R
D
G
J
INCHES
MIN
MAX
0.595
0.620
0.380
0.405
0.160
0.190
0.025
0.035
0.142
0.147
0.190
0.210
0.110
0.130
0.018
0.025
0.500
0.562
0.045
0.060
0.100
0.120
0.080
0.110
0.045
0.055
0.235
0.255
0.000
0.050
MILLIMETERS
MIN
MAX
15.11
15.75
9.65
10.29
4.06
4.82
0.64
0.89
3.61
3.73
4.83
5.33
2.79
3.30
0.46
0.64
12.70
14.27
1.14
1.52
2.54
3.04
2.04
2.79
1.14
1.39
5.97
6.48
0.000
1.27
SWITCHMODE is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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For additional information, please contact your
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MUR550/D
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