ON MURA140T3G Surface mount ultrafast power rectifier Datasheet

MURA130T3G,
SURA8130T3G,
MURA140T3G,
SURA8140T3G
Preferred Devices
Surface Mount
Ultrafast Power Rectifiers
Ideally suited for high voltage, high frequency rectification, or as
free wheeling and protection diodes in surface mount applications
where compact size and weight are critical to the system.
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ULTRAFAST RECTIFIERS
1 AMPERE, 300−400 VOLTS
Features







Small Compact Surface Mountable Package with J−Bend Leads
Rectangular Package for Automated Handling
High Temperature Glass Passivated Junction
Low Forward Voltage Drop (0.8 V Max @ 1.0 A, TJ = 150C)
AEC−Q101 Qualified and PPAP Capable
SURA8 Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
All Packages are Pb−Free*
SMA
CASE 403D
PLASTIC
MARKING DIAGRAM
U4x
AYWW G
Mechanical Characteristics:
 Case: Epoxy, Molded
 Weight: 70 mg (Approximately)
 Finish: All External Surfaces Corrosion Resistant and Terminal



Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260C Max. for 10 Seconds
Polarity: Polarity Band Indicates Cathode Lead
ESD Protection:
 Human Body Model > 4000 V (Class 3)
 Machine Model > 400 V (Class C)
U4x = Device Code
x = F for MURA130T3
= G for MURA140T3
A
= Assembly Location
Y
= Year
WW = Work Week
G
= Pb−Free Package
ORDERING INFORMATION
Package
Shipping†
MURA130T3G
SMA
(Pb−Free)
5,000/Tape & Reel
SURA8130T3G
SMA
(Pb−Free)
5,000/Tape & Reel
MURA140T3G
SMA
(Pb−Free)
5,000/Tape & Reel
SURA8140T3G
SMA
(Pb−Free)
5,000/Tape & Reel
Device
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Preferred devices are recommended choices for future use
and best overall value.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
 Semiconductor Components Industries, LLC, 2012
January, 2012 − Rev. 5
1
Publication Order Number:
MURA130T3/D
MURA130T3G, SURA8130T3G, MURA140T3G, SURA8140T3G
MAXIMUM RATINGS
Rating
Symbol
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
MURA130T3G/SURA8130T3G
MURA140T3G/SURA8140T3G
VRRM
VRWM
VR
Average Rectified Forward Current
@ TL = 150C
@ TL = 125C
IF(AV)
Non-Repetitive Peak Surge Current
(Surge Applied at Rated Load Condtions Halfwave, Single Phase, 60 Hz)
IFSM
Operating Junction Temperature Range
TJ
Value
Unit
V
300
400
1.0
2.0
35
−65 to +175
A
A
C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Lead (TL = 25C) (Note 1)
Thermal Resistance, Junction−to−Ambient (Note 1)
Symbol
Max
Unit
PsiJL
(Note 2)
RJA
24
C/W
216
1. Rating applies when surface mounted on the minimum pad size recommended, PC Board FR−4.
2. In compliance with JEDEC 51, these values (historically represented by RJL) are now referenced as PsiJL.
ELECTRICAL CHARACTERISTICS
Characteristic
Symbol
Maximum Instantaneous Forward Voltage (Note 3)
(iF = 1.0 A, TJ = 25C)
(iF = 1.0 A, TJ = 150C)
vF
Maximum Instantaneous Reverse Current (Note 3)
(Rated DC Voltage, TJ = 25C)
(Rated DC Voltage, TJ = 150C)
iR
Maximum Reverse Recovery Time
(iF = 1.0 A, di/dt = 50 A/s)
trr
3. Pulse Test: Pulse Width = 300 ms, Duty Cycle  2.0%.
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2
Max
1.1
0.8
5.0
150
65
Unit
V
A
ns
MURA130T3G, SURA8130T3G, MURA140T3G, SURA8140T3G
IR, REVERSE CURRENT (mA)
TJ = 175C
10
TJ = 100C
1
0.1
TJ = 25C
0.01
IF, INSTANTANEOUS FORWARD CURRENT (A)
1000
50
100
150
200
300
250
350
100
TJ = 100C
10
TJ = 25C
50
100
150
200
250
300
350
VR, REVERSE VOLTAGE (VOLTS)
VR, REVERSE VOLTAGE (VOLTS)
Figure 1. Typical Reverse Current
Figure 2. Maximum Reverse Current
10
100C
TC = 175C
25C
1
0.1
0.01
TJ = 175C
1
400
0.3 0.4 0.5 0.6
0.7 0.8 0.9
1
1.1 1.2 1.3 1.4
IF, INSTANTANEOUS FORWARD CURRENT (A)
IR, REVERSE CURRENT (mA)
100
10
100C
TC = 175C
25C
1
0.1
0.01
0.5 0.6
VF, INSTANTANEOUS VOLTAGE (VOLTS)
0.7
0.8
0.9
1
1.1
1.2
1.3
1.4
VF, INSTANTANEOUS VOLTAGE (VOLTS)
Figure 4. Maximum Forward Voltage
Figure 3. Typical Forward Voltage
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3
400
1.5
MURA130T3G, SURA8130T3G, MURA140T3G, SURA8140T3G
30
30
NOTE: TYPICAL
CAPACITANCE AT
0 V = 26 pF
20
15
10
8
12
16
20
24
28
32
36
15
10
0
4
8
12
16
20
24
28
32
VR, REVERSE VOLTAGE (VOLTS)
VR, REVERSE VOLTAGE (VOLTS)
Figure 5. Typical Capacitance
Figure 6. Maximum Capacitance
4
dc
3
2 SQUARE WAVE
1
80 90
0
40
100 110 120 130 140 150 160 170 180
IF(AV), AVERAGE FORWARD CURRENT (A)
4
0.25
0
20
0
40
60
100
120
140
Figure 8. Current Derating, Ambient
(FR−4 Board with Minimum Pad)
dc
SQUARE WAVE
1.5
1
0.5
0.5
80
TA, AMBIENT TEMPERATURE (C)
3
0
180
SQUARE WAVE
0.5
3.5
0
160
0.75
4
2
40
dc
Figure 7. Current Derating, Lead
2.5
36
1
TL, LEAD TEMPERATURE (C)
PF, AVERAGE POWER DISSIPATION (W)
IF(AV), AVERAGE FORWARD CURRENT (A)
0
5
0
20
5
5
0
NOTE: MAXIMUM
CAPACITANCE AT
0 V = 29 pF
25
C, CAPACITANCE (pF)
C, CAPACITANCE (pF)
25
1
1.5
2
2.5
3
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
Figure 9. Power Dissipation
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4
3.5
MURA130T3G, SURA8130T3G, MURA140T3G, SURA8140T3G
PACKAGE DIMENSIONS
SMA
CASE 403D−02
ISSUE F
HE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 403D−01 OBSOLETE, NEW STANDARD IS 403D−02.
E
b
DIM
A
A1
b
c
D
E
HE
L
D
POLARITY INDICATOR
OPTIONAL AS NEEDED
(SEE STYLES)
MIN
1.97
0.05
1.27
0.15
2.29
4.06
4.83
0.76
MILLIMETERS
NOM
MAX
2.10
2.20
0.10
0.15
1.45
1.63
0.28
0.41
2.60
2.92
4.32
4.57
5.21
5.59
1.14
1.52
MIN
0.078
0.002
0.050
0.006
0.090
0.160
0.190
0.030
INCHES
NOM
0.083
0.004
0.057
0.011
0.103
0.170
0.205
0.045
MAX
0.087
0.006
0.064
0.016
0.115
0.180
0.220
0.060
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
A
L
A1
c
SOLDERING FOOTPRINT*
4.0
0.157
2.0
0.0787
2.0
0.0787
SCALE 8:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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MURA130T3/D
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