ON MURS115T3G Surface mount ultrafast power rectifier Datasheet

MURS120T3G Series,
SURS8120T3G Series
Surface Mount
Ultrafast Power Rectifiers
MURS105T3G, MURS110T3G, MURS115T3G,
MURS120T3G, MURS140T3G, MURS160T3G,
SURS8105T3G, SURS8110T3G, SURS8115T3G,
SURS8120T3G, SURS8140T3G, SURS8160T3G
www.onsemi.com
ULTRAFAST RECTIFIERS
1.0 AMPERE, 50−600 VOLTS
Ideally suited for high voltage, high frequency rectification, or as
free wheeling and protection diodes in surface mount applications
where compact size and weight are critical to the system.
Features
•
•
•
•
•
•
Small Compact Surface Mountable Package with J−Bend Leads
Rectangular Package for Automated Handling
High Temperature Glass Passivated Junction
Low Forward Voltage Drop (0.71 to 1.05 V Max @ 1.0 A, TJ = 150°C)
NRVUS and SURS8 Prefixes for Automotive and Other Applications
Requiring Unique Site and Control Change Requirements;
AEC−Q101 Qualified and PPAP Capable
These Devices are Pb−Free and are RoHS Compliant
Mechanical Characteristics:
• Case: Epoxy, Molded
• Weight: 95 mg (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
•
•
•
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Polarity: Polarity Band Indicates Cathode Lead
ESD Rating:
♦ Human Body Model = 3B (> 8 kV)
♦ Machine Model = C (> 400 V)
SMB
CASE 403A
MARKING DIAGRAM
AYWW
U1x G
G
A
Y
WW
U1
=
=
=
=
Assembly Location*
Year
Work Week
Device Code
x = A, B, C, D, G, or J
G
= Pb−Free Package
(Note: Microdot may be in either location)
* The Assembly Location code (A) is front side
optional. In cases where the Assembly Location is
stamped in the package bottom (molding ejecter
pin), the front side assembly code may be blank.
ORDERING INFORMATION
See detailed ordering and shipping information in the table on
page 2 of this data sheet.
DEVICE MARKING INFORMATION
See general marking information in the device marking table
on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2016
October, 2016 − Rev. 13
1
Publication Order Number:
MURS120T3/D
MURS120T3G Series, SURS8120T3G Series
MAXIMUM RATINGS
MURS/SURS8
Symbol
105T3
110T3
115T3
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
50
100
150
Average Rectified Forward Current
IF(AV)
1.0 @ TL = 155°C
2.0 @ TL = 145°C
1.0 @ TL = 150°C
2.0 @ TL = 125°C
A
Non−Repetitive Peak Surge Current, (Surge applied
at rated load conditions halfwave, single phase, 60 Hz)
IFSM
40
35
A
Rating
Operating Junction Temperature
120T3
140T3
160T3
Unit
200
400
600
V
*65 to +175
TJ
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
MURS/SURS8
Rating
Symbol
Thermal Resistance
Junction−to−Lead (TL = 25°C)
105T3
115T3
110T3
120T3
140T3
160T3
Unit
°C/W
RqJL
13
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 1)
(iF = 1.0 A, TJ = 25°C)
(iF = 1.0 A, TJ = 150°C)
vF
Maximum Instantaneous Reverse Current (Note 1)
(Rated DC Voltage, TJ = 25°C)
(Rated DC Voltage, TJ = 150°C)
iR
Maximum Reverse Recovery Time
(iF = 1.0 A, di/dt = 50 A/ms)
(iF = 0.5 A, iR = 1.0 A, IR to 0.25 A)
trr
Maximum Forward Recovery Time
(iF = 1.0 A, di/dt = 100 A/ms, Rec. to 1.0 V)
tfr
Typical Peak Reverse Recovery Current
(IF = 1.0 A, di/dt = 50 A/ms)
V
0.875
0.71
1.25
1.05
2.0
50
5.0
150
35
25
75
50
25
50
0.75
1.60
mA
ns
ns
IRM
A
1. Pulse Test: Pulse Width = 300 ms, Duty Cycle v 2.0%.
DEVICE MARKING AND ORDERING INFORMATION
Marking
Package
Shipping†
MURS105T3G,
SURS8105T3G*
U1A
SMB
(Pb−Free)
2,500 Units / Tape & Reel
MURS110T3G, NRVUS110VT3G*
SURS8110T3G*
U1B
SMB
(Pb−Free)
2,500 Units / Tape & Reel
MURS115T3G,
SURS8115T3G*
U1C
SMB
(Pb−Free)
2,500 Units / Tape & Reel
MURS120T3G, NRVUS120VT3G*
SURS8120T3G*
U1D
SMB
(Pb−Free)
2,500 Units / Tape & Reel
MURS140T3G,
SURS8140T3G*
U1G
SMB
(Pb−Free)
2,500 Units / Tape & Reel
MURS160T3G, NRVUS160VT3G*
SURS8160T3G*
U1J
SMB
(Pb−Free)
2,500 Units / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NRVUS and SURS8 Prefixes for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable.
www.onsemi.com
2
MURS120T3G Series, SURS8120T3G Series
MURS105T3G, MURS110T3G, MURS115T3G, MURS120T3G,
SURS8105T3G, SURS8110T3G, SURS8115T3G, SURS8120T3G
10
IR, REVERSE CURRENT (m A)
7.0
5.0
3.0
i , INSTANTANEOUS FORWARD CURRENT (AMPS)
F
175°C
100°C
2.0
TC = 25°C
1.0
80
40
20
8.0
4.0
2.0
0.8
0.4
0.2
TJ = 175°C
TJ = 100°C
0.08
0.04
0.02
0.008
0.004
0.002
0.7
TJ = 25°C
0
20
40
0.5
60
80
100
120
140
160
180 200
VR, REVERSE VOLTAGE (VOLTS)
Figure 2. Typical Reverse Current*
*The curves shown are typical for the highest voltage device in the
voltage grouping. Typical reverse current for lower voltage selections
can be estimated from these same curves if applied VR is sufficiently
below rated VR.
0.3
0.2
50
0.1
45
0.07
NOTE: TYPICAL
CAPACITANCE AT
0 V = 45 pF
C, CAPACITANCE (pF)
40
0.05
0.03
0.02
35
30
25
20
15
10
0.01
5.0
0.3 0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
0
0
vF, INSTANTANEOUS VOLTAGE (VOLTS)
10
20
30
40
50
60
70
80
90
100
VR, REVERSE VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
10
RATED VOLTAGE APPLIED
RqJC = 13°C/W
TJ = 175°C
9.0
8.0
7.0
6.0
5.0
4.0
DC
3.0
2.0
SQUARE WAVE
1.0
0
80
90
100
110
120
130
140
150
160
170
180
PF(AV) , AVERAGE POWER DISSIPATION (WATTS)
IF(AV) , AVERAGE FORWARD CURRENT (AMPS)
Figure 3. Typical Capacitance
5.0
TJ = 175°C
4.0
5.0
I
10
(CAPACITANCELOAD) PK + 20
I
3.0
AV
2.0
DC
SQUARE WAVE
1.0
0
0
0.5
1.0
1.5
2.0
TC, CASE TEMPERATURE (°C)
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
Figure 4. Current Derating, Case
Figure 5. Power Dissipation
www.onsemi.com
3
2.5
MURS120T3G Series, SURS8120T3G Series
MURS140T3G, MURS160T3G, SURS8140T3G, SURS8160T3G
10
IR, REVERSE CURRENT (m A)
7.0
175°C
5.0
100°C
3.0
i , INSTANTANEOUS FORWARD CURRENT (AMPS)
F
TC = 25°C
2.0
1.0
0.7
400
200
80
40
20
8.0
4.0
2.0
0.8
0.4
0.2
0.08
0.04
0.02
0.008
0.004
TJ = 175°C
TJ = 100°C
TJ = 25°C
0
100
200
0.5
300
400
500
600
700
VR, REVERSE VOLTAGE (VOLTS)
Figure 7. Typical Reverse Current*
*The curves shown are typical for the highest voltage device in the
voltage grouping. Typical reverse current for lower voltage selections
can be estimated from these same curves if applied VR is sufficiently
below rated VR.
0.3
0.2
25
0.1
0.07
NOTE: TYPICAL
CAPACITANCE AT
0 V = 24 pF
C, CAPACITANCE (pF)
20
0.05
0.03
0.02
15
10
5.0
0.01
0.3 0.5
0.7
0.9
1.1
1.3
1.5
1.7
1.9
2.1
2.3
0
0
vF, INSTANTANEOUS VOLTAGE (VOLTS)
4.0
8.0
12
16
20
24
28
32
36
40
VR, REVERSE VOLTAGE (VOLTS)
Figure 6. Typical Forward Voltage
10
RATED VOLTAGE APPLIED
RqJC = 13°C/W
TJ = 175°C
9.0
8.0
7.0
6.0
5.0
4.0
DC
3.0
2.0
SQUARE WAVE
1.0
0
0
20
40
60
80
100
120
140
160
180
200
PF(AV) , AVERAGE POWER DISSIPATION (WATTS)
IF(AV) , AVERAGE FORWARD CURRENT (AMPS)
Figure 8. Typical Capacitance
5.0
4.0
5.0
10
(CAPACITANCE LOAD)
I
PK + 20
I
SQUARE WAVE
AV
3.0
DC
TJ = 175°C
2.0
1.0
0
0
0.5
1.0
1.5
2.0
TC, CASE TEMPERATURE (°C)
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
Figure 9. Current Derating, Case
Figure 10. Power Dissipation
www.onsemi.com
4
2.5
MURS120T3G Series, SURS8120T3G Series
PACKAGE DIMENSIONS
SMB
CASE 403A−03
ISSUE J
HE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L1.
E
b
DIM
A
A1
b
c
D
E
HE
L
L1
D
POLARITY INDICATOR
OPTIONAL AS NEEDED
MIN
1.95
0.05
1.96
0.15
3.30
4.06
5.21
0.76
MILLIMETERS
NOM
MAX
2.30
2.47
0.10
0.20
2.03
2.20
0.23
0.31
3.56
3.95
4.32
4.60
5.44
5.60
1.02
1.60
0.51 REF
MIN
0.077
0.002
0.077
0.006
0.130
0.160
0.205
0.030
INCHES
NOM
0.091
0.004
0.080
0.009
0.140
0.170
0.214
0.040
0.020 REF
MAX
0.097
0.008
0.087
0.012
0.156
0.181
0.220
0.063
A
L
L1
A1
c
SOLDERING FOOTPRINT*
2.261
0.089
2.743
0.108
2.159
0.085
SCALE 8:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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MURS120T3/D
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