MCNIX MX27L2000MC-25 2m-bit [256kx8] cmos eprom Datasheet

INDEX
MX27L2000
2M-BIT [256Kx8] CMOS EPROM
FEATURES
•
•
•
•
•
•
•
256Kx 8 organization
Wide power supply range, 2.7V DC to 3.6V DC
+12.5V programming voltage
Fast access time: 120/150/200/250 ns
Totally static operation
Completely TTL compatible
Operating current:20mA @ 3.6V, 5MHz
• Standby current: 20uA
• Package type:
-
32 pin ceramic DIP, plastic DIP
32 pin SOP
8x20mm 32-lead TSOP(I)
8x14mm 32-lead TSOP(I)
8x13.4mm 32-lead TSOP(I)
GENERAL DESCRIPTION
The MX27L2000 is a 3V only, 2M-bit, ultraviolet Erasable
Programmable Read Only Memory. It is organized as
256K words by 8 bits per word, operates from a single +
3 volt supply, has a static standby mode, and features
fast single address location programming. All programming signals are TTL levels, requiring a single pulse. For
programming outside from the system, existing EPROM
programmers may be used. The MX27L2000 supports a
intelligent fast programming algorithm which can result in
programming time of less than one minute.
PIN CONFIGURATIONS
BLOCK DIAGRAM
This EPROM is packaged in industry standard 32 pin
dual-in-line packages, 32 lead SOP and 32 lead TSOP(I)
packages.
32 CDIP/PDIP/SOP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
MX27L2000
VPP
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
Q0
Q1
Q2
GND
CE
PGM
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
VCC
PGM
A17
A14
A13
A8
A9
A11
OE
A10
CE
Q7
Q6
Q5
Q4
Q3
.
.
A0~A17
ADDRESS
INPUTS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
P/N: PM0372
MX27L2000
Y-DECODER
.
.
OUTPUT
BUFFERS
.
Q0~Q7
Y-SELECT
.
.
.
.
X-DECODER
.
.
.
.
.
.
2M BIT
CELL
MAXTRIX
.
VCC
VSS
PIN DESCRIPTION
32 TSOP(I) (8x20mm,8x14mm,8x13.4mm)
A11
A9
A8
A13
A14
A17
PGM
VCC
VPP
A16
A15
A12
A7
A6
A5
A4
CONTROL
LOGIC
OE
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
OE
A10
CE
Q7
Q6
Q5
Q4
Q3
GND
Q2
Q1
Q0
A0
A1
A2
A3
1
SYMBOL
PIN NAME
A0~A17
Address Input
Q0~Q7
Data Input/Output
CE
Chip Enable Input
OE
Output Enable Input
PGM
Programmable Enable Input
VPP
Program Supply Voltage
NC
No Internal Connection
VCC
Power Supply Pin (+5V)
GND
Ground Pin
REV.2.5, APR 09,1998
INDEX
MX27L2000
through each address of the device. When the
programming mode is completed, the data in all address
is verified at VCC = VPP = 5V ± 10%.
FUNCTIONAL DESCRIPTION
THE ERASURE OF THE MX27L2000
PROGRAM INHIBIT MODE
The MX27L2000 is erased by exposing the chip to an
ultraviolet light source. A dosage of 15 W seconds/cm2 is
required to completely erase a MX27L2000. This dosage
can be obtained by exposure to an ultraviolet lamp wavelength of 2537 Angstroms (A) - with intensity of
12,000 uW/cm2 for 15 to 20 minutes. The MX27L2000
should be directly under and about one inch from the
source and all filters should be removed from the UV light
source prior to erasure.
Programming of multiple MX27L2000s in parallel with
different data is also easily accomplished by using the
Program Inhibit Mode. Except for CE and OE, all like
inputs of the parallel MX27L2000 may be common. A TTL
low-level program pulse applied to an MX27L2000 CE
input with VPP = 12.5 ± 0.5 V and PGM LOW will program
that MX27L2000. A high-level CE input inhibits the other
MX27L2000s from being programmed.
It is important to note that the MX27L2000, and similar
devices, will be cleared for all bits of their programmed
states with light sources having wavelengths shorter than
4000 A. Although erasure times will be much longer than
that with UV sources at 2537 A, nevertheless the
exposure to fluorescent light and sunlight will eventually
erase the MX27L2000 and exposure to them should be
prevented to realize maximum system reliability. If used
in such an environment, the package window should be
covered by an opaque label or substance.
PROGRAM VERIFY MODE
Verification should be performed on the programmed bits
to determine that they were correctly programmed. The
verification should be performed with OE and CE, at VIL,
PGM at VIH, and VPP at its programming voltage.
AUTO IDENTIFY MODE
The auto identify mode allows the reading out of a binary
code from an EPROM that will identify its manufacturer
and device type. This mode is intended for use by
programming equipment for the purpose of automatically
matching the device to be programmed with its
corresponding programming algorithm. This mode is
functional in the 25°C ± 5°C ambient temperature range
that is required when programming the MX27L2000.
THE PROGRAMMING OF THE MX27L2000
When the MX27L2000 is delivered, or it is erased, the
chip has all 2M bits in the "ONE" or HIGH state. "ZEROs"
are loaded into the MX27L2000 through the procedure of
programming.
To activate this mode, the programming equipment must
force 12.0 ± 0.5 V on address line A9 of the device. Two
identifier bytes may then be sequenced from the device
outputs by toggling address line A0 from VIL to VIH. All
other address lines must be held at VIL during auto
identify mode.
For programming, the data to be programmed is applied
with 8 bits in parallel to the data pins.
Vcc must be applied simultaneously or before Vpp, and
removed simultaneously or after Vpp. When
programming an MXIC EPROM, a 0.1uF capacitor is
required across Vpp and ground to suppress spurious
voltage transients which may damage the device.
Byte 0 ( A0 = VIL) represents the manufacturer code, and
byte 1 (A0 = VIH), the device identifier code. For the
MX27L2000, these two identifier bytes are given in the
Mode Select Table. All identifiers for manufacturer and
device codes will possess odd parity, with the MSB (Q7)
defined as the parity bit.
FAST PROGRAMMING
The device is set up in the fast programming mode when
the programming voltage VPP = 12.75V is applied, with
VCC = 6.25 V and PGM = VIH (Algorithm is shown in
Figure 1). The programming is achieved by applying a
single TTL low level 100us pulse to the PGM input after
addresses and data line are stable. If the data is not
verified, an additional pulse is applied for a maximum of
25 pulses. This process is repeated while sequencing
P/N: PM0372
REV.2.5, APR 09,1998
2
INDEX
MX27L2000
READ MODE
It is recommended that CE be decoded and used as the
primary device-selecting function, while OE be made a
common connection to all devices in the array and
connected to the READ line from the system control bus.
This assures that all deselected memory devices are in
their low-power standby mode and that the output pins
are only active when data is desired from a particular
memory device.
The MX27L2000 has two control functions, both of which
must be logically satisfied in order to obtain data at the
outputs. Chip Enable (CE) is the power control and
should be used for device selection. Output Enable (OE)
is the output control and should be used to gate data to the
output pins, independent of device selection. Assuming
that addresses are stable, address access time (tACC) is
equal to the delay from CE to output (tCE). Data is
available at the outputs tQE after the falling edge of OE,
assuming that CE has been LOW and addresses have
been stable for at least tACC - tQE.
SYSTEM CONSIDERATIONS
During the switch between active and standby conditions,
transient current peaks are produced on the rising and
falling edges of Chip Enable. The magnitude of these
transient current peaks is dependent on the output
capacitance loading of the device. At a minimum, a 0.1 uF
ceramic capacitor (high frequency, low inherent
inductance) should be used on each device between Vcc
and GND to minimize transient effects. In addition, to
overcome the voltage drop caused by the inductive
effects of the printed circuit board traces on EPROM
arrays, a 4.7 uF bulk electrolytic capacitor should be used
between VCC and GND for each eight devices. The
location of the capacitor should be close to where the
power supply is connected to the array.
STANDBY MODE
The MX27L2000 has a CMOS standby mode which
reduces the maximum VCC current to 100 uA. It is placed
in CMOS standby when CE is at VCC ± 0.3 V. The
MX27L2000 also has a TTL-standby mode which reduces
the maximum VCC current to 1.5 mA. It is placed in TTLstandby when CE is at VIH. When in standby mode, the
outputs are in a high-impedance state, independent of the
OE input.
TWO-LINE OUTPUT CONTROL FUNCTION
To accommodate multiple memory connections, a twoline control function is provided to allow for:
1. Low memory power dissipation,
2. Assurance that output bus contention will not occur.
MODE SELECT TABLE
PINS
MODE
CE
OE
PGM
A0
A9
VPP
OUTPUTS
Read
VIL
VIL
X
X
X
VCC
DOUT
Output Disable
VIL
VIH
X
X
X
VCC
High Z
Standby (TTL)
VIH
X
X
X
X
VCC
High Z
Standby (CMOS)
VCC±0.3V
X
X
X
X
VCC
High Z
Program
VIL
VIH
VIL
X
X
VPP
DIN
Program Verify
VIL
VIL
VIH
X
X
VPP
DOUT
Program Inhibit
VIH
X
X
X
X
VPP
High Z
Manufacturer Code(3)
VIL
VIL
X
VIL
VH
VCC
C2H
Device Code(3)
VIL
VIL
X
VIH
VH
VCC
20H
3. A1 - A8 = A10 - A17 = VIL(For auto select)
4. See DC Programming Characteristics for VPP voltage during
programming.
NOTES: 1. VH = 12.0 V ± 0.5 V
2. X = Either VIH or VIL
P/N: PM0372
REV.2.5, APR 09,1998
3
INDEX
MX27L2000
FIGURE 1. FAST PROGRAMMING FLOW CHART
START
ADDRESS = FIRST LOCATION
VCC = 6.25V
VPP = 12.75V
X=0
PROGRAM ONE 100us PULSE
INCREMENT X
INTERACTIVE
SECTION
YES
X = 25?
NO
FAIL
VERIFY BYTE
?
PASS
NO
LAST ADDRESS
INCREMENT ADDRESS
FAIL
YES
VCC = VPP = 5.25V
VERIFY SECTION
VERIFY ALL BYTES
?
FAIL
DEVICE FAILED
PASS
DEVICE PASSED
P/N: PM0372
REV.2.5, APR 09,1998
4
INDEX
MX27L2000
SWITCHING TEST CIRCUITS
DEVICE
UNDER
TEST
1.8K ohm
+5V
DIODES = IN3064
OR EQUIVALENT
CL
6.2K ohm
CL = 100 pF including jig capacitance (30pF for MX27L2000-120, 150ns)
SWITCHING TEST WAVEFORMS
2.0V
2.0V
TEST POINTS
AC driving levels
0.8V
0.8V
OUTPUT
INPUT
AC TESTING: AC driving levels are 3.0V/0V for both commercial grade and industrial grade.
Input pulse rise and fall times are < 10ns.
1.5V
AC driving levels
1.5V
TEST POINTS
OUTPUT
INPUT
AC TESTING: (1) AC driving levels are 3.0V/0V for commercial grade and industrial grade.
Input pulse rise and fall times are < 10ns.
(2) For MX27L2000-12/15.
P/N: PM0372
REV.2.5, APR 09,1998
5
INDEX
MX27L2000
ABSOLUTE MAXIMUM RATINGS
RATING
VALUE
Ambient Operating Temperature
-40oC to 85oC
Storage Temperature
-65oC to 125oC
Applied Input Voltage
-0.5V to 7.0V
Applied Output Voltage
-0.5V to VCC + 0.5V
VCC to Ground Potential
-0.5V to 7.0V
V9 & VPP
-0.5V to 13.5V
NOTICE:
Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or any other
conditions above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating
conditions for extended period may affect reliability.
NOTICE:
Specifications contained within the following tables are subject to
change.
DC/AC Operating Conditions for Read Operation
MX27L2000
Operating Temperature
Commercial
-12
-15
-20
-25
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
-
-
-40°C to 85°C
-40°C to 85°C
2.7V to 3.6V
2.7V to 3.6V
2.7V to 3.6V
2.7V to 3.6V
Industrial
Vcc Power Supply
DC CHARACTERISTICS
SYMBOL
PARAMETER
MIN.
VOH
Output High Voltage
2.4
VOL
Output Low Voltage
VIH
Input High Voltage
VIL
MAX.
UNIT
CONDITIONS
V
IOH = -0.4mA, VCC=3.0V
0.4
V
IOL = 2.1mA, VCC=3.0V
2.0
VCC + 0.5
V
Input Low Voltage
-0.3
0.8
V
2.7V < VCC < 3.6V
ILI
Input Leakage Current
-10
10
uA
VIN = 0 to 3.6V
ILO
Output Leakage Current
-10
10
uA
VOUT = 0 to 5.5V
ICC3
VCC Power-Down Current
20
uA
CE = VCC ± 0.3V
ICC2
VCC Standby Current
0.25
mA
CE = VIH
ICC1
VCC Active Current
20
mA
CE = VIL, f=5MHz, Iout = 0mA, VCC=3.6V
IPP
VPP Supply Current Read
10
uA
CE = OE = VIL, VPP = VCC
CAPACITANCE TA = 25oC, f = 1.0 MHz (Sampled only)
SYMBOL
PARAMETER
TYP.
MAX.
UNIT
CONDITIONS
CIN
Input Capacitance
8
12
pF
VIN = 0V
COUT
Output Capacitance
8
12
pF
VOUT = 0V
CVPP
VPP Capacitance
18
25
pF
VPP = 0V
P/N: PM0372
REV.2.5, APR 09,1998
6
INDEX
MX27L2000
AC CHARACTERISTICS
27L2000-12
27L2000-15
27L2000-20
27L2000-25
MIN
MIN. MAX.
MIN. MAX.
MIN.
SYMBOL
PARAMETER
tACC
Address to Output Delay
120
150
tCE
Chip Enable to Output Delay
120
tOE
tDF
Output Enable to Output Delay
OE High to Output Float,
tOH
or CE High to Output Floa
Output Hold from Address,
CE or OE which ever occurred first
0
MAX.
50
35
0
0
MAX.
UNIT
CONDITIONS
200
250
ns
CE = OE =VIL
150
200
250
ns
OE = VIL
65
50
100
0
120
0
ns
70
CE = VIL
ns
0
0
60
0
ns
DC PROGRAMMING CHARACTERISTICS TA = 25oC ± 5°C
SYMBOL
PARAMETER
MIN.
VOH
Output High Voltage
2.4
VOL
Output Low Voltage
VIH
Input High Voltage
VIL
MAX.
UNIT
CONDITIONS
V
IOH = -0.40mA
0.4
V
IOL = 2.1mA
2.0
VCC + 0.5
V
Input Low Voltage
-0.3
0.8
V
ILI
Input Leakage Current
-10
10
uA
VH
A9 Auto Select Voltage
11.5
12.5
V
ICC3
VCC Supply Current (Program & Verify)
50
mA
IPP2
VPP Supply Current(Program)
30
mA
VCC1
Fast Programming Supply Voltage
6.00
6.50
V
VPP1
Fast Programming Voltage
12.5
13.0
V
MAX.
UNIT
VIN = 0 to 3.6V
CE=PGM=VIL,OE=VIH
AC PROGRAMMING CHARACTERISTICS TA = 25oC ± 5°C
SYMBOL
PARAMETER
MIN.
tAS
Address Setup Time
2.0
us
tOES
OE Setup Time
2.0
us
tDS
Data Setup Time
2.0
us
tAH
Address Hold Time
0
us
tDH
Data Hold Time
2.0
us
tDFP
Output Enable to Output Float Delay
0
tVPS
VPP Setup Time
2.0
tPW
PGM Program Pulse Width
95
tVCS
VCC Setup Time
2.0
us
tCES
CE Setup Time
2
us
tOE
Data valid from OE
P/N: PM0372
130
CONDITIONS
ns
us
105
150
us
ns
REV.2.5, APR 09,1998
7
INDEX
MX27L2000
WAVEFORMS
READ CYCLE
ADDRESS
INPUTS
DATA ADDRESS
tACC
CE
tCE
OE
tDF
DATA
OUT
VALID DATA
tOE
tOH
FAST PROGRAMMING ALGORITHM WAVEFORM
PROGRAM
PROGRAM VERIFY
VIH
Addresses
VIL
DATA
tAH
Hi-z
tAS
DATA OUT VALID
DATA IN STABLE
tDS
tDFP
tDH
VPP1
VPP
VCC
tVPS
VCC1
VCC
tVCS
VCC
VIH
CE
VIL
tCES
VIH
PGM
VIL
tPW
tOES
tOE
Max
VIH
OE
P/N: PM0372
VIL
REV.2.5, APR 09,1998
8
INDEX
MX27L2000
ORDERING INFORMATION
CERAMIC PACKAGE
PART NO.
ACCESS TIME(ns)
OPERATING
STANDBY
CURRENT MAX.(mA)
CURRENT MAX.(uA)
OPERATING
PACKAGE
TEMPERATURE
MX27L2000DC-12
120
20
20
0°C to 70°C
32 Pin DIP
MX27L2000DC-15
150
20
20
0°C to 70°C
32 Pin DIP
MX27L2000DC-20
200
20
20
0°C to 70°C
32 Pin DIP
MX27L2000DC-25
250
20
20
0°C to 70°C
32 Pin DIP
MX27L2000DI-12
120
20
20
-40°C to 85°C
32 Pin DIP
MX27L2000DI-15
150
20
20
-40°C to 85°C
32 Pin DIP
MX27L2000DI-20
200
20
20
-40°C to 85°C
32 Pin DIP
MX27L2000DI-25
250
20
20
-40°C to 85°C
32 Pin DIP
ACCESS TIME(ns)
OPERATING
STANDBY
OPERATING
PACKAGE
CURRENT MAX.(mA)
CURRENT MAX.(uA)
PLASTIC PACKAGE
PART NO.
TEMPERATURE
MX27L2000PC-12
120
20
20
0°C to 70°C
32 Pin DIP
MX27L2000MC-12
120
20
20
0°C to 70°C
32 Pin SOP
MX27L2000TC-12
120
20
20
0°C to 70°C
8x20mm 32 Pin TSOP(I)
MX27L2000PC-15
150
20
20
0°C to 70°C
32 Pin DIP
MX27L2000MC-15
150
20
20
0°C to 70°C
32 Pin SOP
MX27L2000TC-15
150
20
20
0°C to 70°C
8x20mm 32 Pin TSOP(I)
MX27L2000PC-20
200
20
20
0°C to 70°C
32 Pin DIP
MX27L2000MC-20
200
20
20
0°C to 70°C
32 Pin SOP
MX27L2000TC-20
200
20
20
0°C to 70°C
8x20mm 32 Pin TSOP(I)
MX27L2000PC-25
250
20
20
0°C to 70°C
32 Pin DIP
MX27L2000MC-25
250
20
20
0°C to 70°C
32 Pin SOP
MX27L2000TC-25
250
20
20
0°C to 70°C
8x20mm 32 Pin TSOP(I)
MX27L2000PI-12
120
20
20
-40°C to 85°C
32 Pin DIP
MX27L2000MI-12
120
20
20
-40°C to 85°C
32 Pin SOP
MX27L2000TI-12
120
20
20
-40°C to 85°C
8x20mm 32 Pin TSOP(I)
MX27L2000PI-15
150
20
20
-40°C to 85°C
32 Pin DIP
MX27L2000MI-15
150
20
20
-40°C to 85°C
32 Pin SOP
MX27L2000TI-15
150
20
20
-40°C to 85°C
8x20mm 32 Pin TSOP(I)
MX27L2000PI-20
200
20
20
-40°C to 85°C
32 Pin DIP
MX27L2000MI-20
200
20
20
-40°C to 85°C
32 Pin SOP
MX27L2000TI-20
200
20
20
-40°C to 85°C
8x20mm 32 Pin TSOP(I)
MX27L2000PI-25
250
20
20
-40°C to 85°C
32 Pin DIP
MX27L2000MI-25
250
20
20
-40°C to 85°C
32 Pin SOP
MX27L2000TI-25
250
20
20
-40°C to 85°C
8x20mm 32 Pin TSOP(I)
P/N: PM0372
REV.2.5, APR 09,1998
9
INDEX
MX27L2000
PLASTIC PACKAGE
PART NO.
ACCESS TIME(ns)
OPERATING
STANDBY
CURRENT MAX.(mA)
CURRENT MAX.(uA)
OPERATING
PACKAGE
TEMPERATURE
MX27L2000T2C-12
120
20
20
0°C to 70°C
8x14mm 32 Pin TSOP(I)
MX27L2000T2C-15
150
20
20
0°C to 70°C
8x14mm 32 Pin TSOP(I)
MX27L2000T2C-20
200
20
20
0°C to 70°C
8x14mm 32 Pin TSOP(I)
MX27L2000T2C-25
250
20
20
0°C to 70°C
8x14mm 32 Pin TSOP(I)
MX27L2000T2I-12
120
20
20
-40°C to 85°C
8x14mm 32 Pin TSOP(I)
MX27L2000T2I-15
150
20
20
-40°C to 85°C
8x14mm 32 Pin TSOP(I)
MX27L2000T2I-20
200
20
20
-40°C to 85°C
8x14mm 32 Pin TSOP(I)
MX27L2000T2I-25
250
20
20
-40°C to 85°C
8x14mm 32 Pin TSOP(I)
MX27L2000T3C-12
120
20
20
0°C to 70°C
8x13.4mm 32 Pin TSOP(I)
MX27L2000T3C-15
150
20
20
0°C to 70°C
8x13.4mm 32 Pin TSOP(I)
MX27L2000T3C-20
200
20
20
0°C to 70°C
8x13.4mm 32 Pin TSOP(I)
MX27L2000T3C-25
250
20
20
0°C to 70°C
8x13.4mm 32 Pin TSOP(I)
MX27L2000T3I-12
120
20
20
-40°C to 85°C
8x13.4mm 32 Pin TSOP(I)
MX27L2000T3I-15
150
20
20
-40°C to 85°C
8x13.4mm 32 Pin TSOP(I)
MX27L2000T3I-20
200
20
20
-40°C to 85°C
8x13.4mm 32 Pin TSOP(I)
MX27L2000T3I-25
250
20
20
-40°C to 85°C
8x13.4mm 32 Pin TSOP(I)
P/N: PM0372
REV.2.5, APR 09,1998
10
INDEX
MX27L2000
PACKAGE INFORMATION
32-PIN CERDIP(MSI) WITH WINDOW (600mil)
ITEM
MILLIMETERS
INCHES
A
42.26 max
1.665 max
B
1.90 ± .38
.075 ± .015
C
2.54 [TP]
.100 [TP]
D
.46 [REF]
.018 [REF]
E
38.07
1.500
F
1.42 [REF]
.056 [REF]
G
3.43 ± .38
.135 ± .015
H
.96 ± .43
.038 ± .017
I
4.06
.160
J
5.00
.203
K
15.58 ± .13
.614 ± .005
L
13.20 ± .38
.520 ± .015
M
.25 [REF]
.010 [REF]
N
ø8.12
ø.320
NOTE:
32
17
N
1
16
K
L
A
I
J
H G
F
D
C
B
M
0.15¡
E
Each lead centerline is located within .25
mm[.01 inch] of its true position [TP] at
maximum material condition.
32-PIN PLASTIC DIP(600 mil)
ITEM
MILLIMETERS
A
42.13 max.
1.660 max.
B
1.90 [REF]
.075 [REF]
C
2.54 [TP]
.100 [TP]
D
.46 [Typ.]
.018 [Typ.]
E
38.07
1.500
F
1.27 [Typ.]
.050 [Typ.]
G
3.30 ± .25
.130 ± .010
H
.51 [REF]
.020 [REF]
I
3.94 ± .25
.155 ± .010
J
5.33 max.
.210 max.
K
15.22 ± .25
.600 ± .010
L
13.97 ± .25
.550 ±.010
.25 [Typ.]
.010 [Typ.]
M
NOTE:
P/N: PM0372
INCHES
32
17
1
16
A
F
D
Each lead centerline is located within .25
mm[.01 inch] of its true position [TP] at
maximum material condition.
K
L
C
B
I
J
H
G
M
0~15¡
E
REV.2.5, APR 09,1998
11
INDEX
MX27L2000
PACKAGE INFORMATION(Continued)
32-PIN PLASTIC SOP (450 mil)
ITEM
MILLIMETERS
A
20.95 max.
.825 max.
B
1.00 [REF]
.039 [REF]
C
1.27 [TP]
.050 [TP]
D
.40 [Typ.]
.016 [Typ.]
E
.05 min.
.002 min.
F
3.05 max.
.120 max.
G
2.69 ± .13
.106 ±.005
H
14.12 ± .25
.556 ± .010
I
11.30 ± .13
.445 ± .005
J
1.42
.056
K
.20 [Typ.]
.008 [Typ.]
.79
.031
L
NOTE:
32
17
1
16
INCHES
H
A
I
G
J
F
K
Each lead centerline is located within .25
mm[.01 inch] of its true position [TP] at
maximum material condition.
E
D
C
L
B
32-PIN PLASTIC TSOP
ITEM
MILLIMETERS
A
20.0 ± .20
.078 ±.006
B
18.40 ± .10
.724 ± .004
C
8.20 max.
.323 max.
D
0.15 [Typ.]
.006 [Typ.]
E
.80 [Typ.]
.031 [Typ.]
F
.20 ± .10
.008 ± .004
G
.30 ± .10
.012 ±.004
H
.50 [Typ.]
.020 [Typ.]
I
.45 max.
.018 max.
J
0 ~ .20
0 ~ .008
K
1.00 ±.10
.039 ±.004
L
1.27 max.
.050 max.
M
.50
.020
N
0 ~ 5°
.500
NOTE:
INCHES
A
B
C
O
K
L
D
E
Each lead centerline is located within .25
mm[.01 inch] of its true position [TP] at
maximum material condition.
P/N: PM0372
N
M
F
G
H
I
J
REV.2.5, APR 09,1998
12
INDEX
MX27L2000
Revision History
Revision No. Description
2.0
Eliminate Interactive Programming Mode.
AC driving levels changed from 2.4V/0.4V to 3V/0V.
2.1
IPP 100uA --> 10uA
2.2
Add 120/150ns speed grades.
2.3
Corrected errors in the DC/AC Operating Conditions for Read Operation
2.4
Add 8x14mm and 8x13.4mm 32-TSOP(I) Packages
2.5
Change TSOP Orientation
P/N: PM0372
Date
5/29/1997
8/07/1997
12/24/1997
2/5/1998
2/24/1998
4/09/1998
REV.2.5, APR 09,1998
13
INDEX
MX27L2000
MACRONIX INTERNATIONAL CO., LTD.
HEADQUARTERS:
TEL:+886-3-578-8888
FAX:+886-3-578-8887
EUROPE OFFICE:
TEL:+32-2-456-8020
FAX:+32-2-456-8021
JAPAN OFFICE:
TEL:+81-44-246-9100
FAX:+81-44-246-9105
SINGAPORE OFFICE:
TEL:+65-747-2309
FAX:+65-748-4090
TAIPEI OFFICE:
TEL:+886-3-509-3300
FAX:+886-3-509-2200
MACRONIX AMERICA, INC.
TEL:+1-408-453-8088
FAX:+1-408-453-8488
CHICAGO OFFICE:
TEL:+1-847-963-1900
FAX:+1-847-963-1909
http : //www.macronix.com
MACRONIX INTERNATIONAL CO., LTD. reserves the rignt to change product and specifications without notice.
14
Similar pages