PHILIPS N74F1808D Hex 2-input and driver Datasheet

INTEGRATED CIRCUITS
74F808, 74F1808
Hex 2-input AND drivers
Product specification
IC15 Data Handbook
1991 Jan 02
Philips Semiconductors
Product specification
Hex 2-input AND drivers
74F808/74F1808
FEATURES
PIN CONFIGURATION
• High capacitive drive capability
• Choice of configuration
74F808
Corner VCC and GND – 74F808
Center VCC and GND – 74F1808
• Typical propagation delay of 4.0ns
• Superior ground noise characteristics
(implemented using output
edge rate control)
• Increased source and sink current (64mA)
TYPICAL
PROPAGATION
DELAY
TYPICAL SUPPLY
CURRENT
( TOTAL)
74F808
4.0ns
24mA
74F1808
4.0ns
24mA
TYPE
D0a 1
20 VCC
D0b 2
19 D5b
Q0 3
18 D5a
D1a 4
17 Q5
D1b 5
16 D4b
Q1 6
15 D4a
D2a 7
14 Q4
D2b 8
13 D3b
Q2 9
12 D3a
GND 10
11 Q3
SF00474
ORDERING INFORMATION
LOGIC SYMBOL
ORDER CODE
DESCRIPTION
COMMERCIAL RANGE
VCC = 5V ±10%,
Tamb = 0°C to +70°C
PKG DWG #
20–pin plastic DIP
N74F808N, N74F1808N
SOT 146-1
20–pin plastic SOL
N74F808D, N74F1808D
SOT163-1
74F808
1
DESCRIPTION
Dna – Dnb
Data inputs
Q0 – Q5
Data outputs
4
5
7
8
12 13 15 16 18 19
D0a D0bD1a D1b D2a D2b D3aD3b D4aD4bD5a D5b
INPUT AND OUTPUT LOADING
AND FAN OUT TABLE
PINS
2
74F
(U.L.)
HIGH/
LOW
LOAD VALUE
HIGH/LOW
1.0/0.033
20µA/20µA
Q0 Q1 Q2 Q3 Q4 Q5
3
6
9 11
VCC = Pin 20
GND = Pin 10
3200/106.
64mA/64mA
NOTE: One (1.0) FAST unit load is defined7as: 20µA in the high
state and 0.6mA in the low state.
14 17
SF00475
IEC/IEEE SYMBOL
74F808
1
2
&
3
4
5
6
7
8
9
12
13
11
15
16
14
18
19
17
SF00476
January 2, 1991
2
853-1528 01346
Philips Semiconductors
Product specification
Hex 2-input AND drivers
74F808/74F1808
PIN CONFIGURATION
LOGIC DIAGRAM
74F1808
D4b 1
20 D4a
Q5 2
19 Q4
D5a 3
18 D3b
D5b 4
17 D3a
VCC 5
16 Q3
1
D0a
Dob
3
2
4
D1a
D1b
6
5
7
D0a 6
15 GND
D0b 7
14 Q2
Q0 8
13 D2b
D1a 9
12 D2a
D1b 10
74F1808
74F808
D2a
D2b
12
D3a
D3b
15
14
16
18
D5a
D5b
SF00477
11
13
D4a
D4b
11 Q1
9
8
17
19
QO
D0a
Dob
Q1
D1a
D1b
Q2
D2a
D2b
Q3
D3a
D3b
Q4
D4a
D4b
Q5
D5a
D5b
6
7
9
12
17
9
10 12 13 17 18 20
1
3
4
20
Q0 Q1 Q2 Q3 Q4 Q5
8
11
14 16 19
VCC = Pin 5
GND = Pin 15
3
4
IEC/IEEE SYMBOL
74F1808
6
&
8
9
11
12
14
17
16
20
1
19
3
4
2
SF00479
January 2, 1991
OUTPUT
Da
Db
Q
H
H
H
L
X
L
X
L
L
NOTES:
H = High voltage level
L = Low voltage level
X = Don’t care
2
SF00478
18
19
1
FUNCTION TABLE
D0a D0bD1a D1b D2a D2b D3a D3bD4a D4bD5a D5b
13
16
18
2
Q1
Q2
Q3
Q4
Q5
SF00480
INPUTS
10
14
13
74F1808
7
11
10
LOGIC SYMBOL
7
QO
VCC = Pin 5
GND = Pin 15
VCC = Pin 20
GND = Pin 10
6
8
3
Philips Semiconductors
Product specification
Hex 2-input AND drivers
74F808/74F1808
ABSOLUTE MAXIMUM RATINGS
(Operation beyond the limit set forth in this table may impair the useful life of the device. Unless otherwise noted these limits are over the
operating free air temperature range.)
SYMBOL
PARAMETER
RATING
UNIT
VCC
Supply voltage
–0.5 to +7.0
V
VIN
Input voltage
–0.5 to +7.0
V
IIN
Input current
–30 to +5
mA
VOUT
Voltage applied to output in high output state
–0.5 to VCC
V
IOUT
Current applied to output in low output state
96
mA
Tamb
Operating free air temperature range
0 to +70
Tstg
Storage temperature range
°C
°C
–65 to +150
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
LIMITS
UNIT
TA =
–40 to
+85°C
V
MIN
NOM
MAX
VCC
Supply voltage
4.5
5.0
5.5
VIH
High–level input voltage
2.0
VIL
Low–level input voltage
0.8
V
IIk
Input clamp current
–18
mA
IOH
High–level output current
–64
mA
IOL
Low–level output current
64
mA
Tamb
Operating free air temperature range
+70
°C
V
0
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
SYMBOL
TEST CONDITIONS1
PARAMETER
LIMITS
MIN
VOH
High-level output voltage
UNIT
MAX
VCC = MIN, VIL = MAX
±10%VCC
2.0
V
VIH = MIN, IOH = MAX
±5%VCC
2.0
V
VCC = MIN, VIL = MAX
±10%VCC
VIH = MIN, IOL = MAX
±5%VCC
VOL
Low-level output voltage
VIK
Input clamp voltage
VCC = MIN, II = IIK
II
Input current at maximum input voltage
VCC = MAX, VI = 7.0V
IIH
High–level input current
IIL
Low–level input current
IO
Output
current3
ICC
Supply current (total)
0.38
0.55
V
0.38
0.55
V
-0.73
-1.2
V
100
µA
VCC = MAX, VI = 2.7V
20
µA
VCC = MAX, VI = 0.5V
-20
µA
-180
mA
27
mA
VCC = MAX
ICCH
TYP2
-60
VCC = MAX
VIN = GND
19
ICCL
VIN = 4.5V
30
42
mA
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at VCC = 5V, Tamb = 25°C.
3. The output conditions have been chosen to produce a current that closely approximates one half of the true short–circuit output current, IOS.
January 2, 1991
4
Philips Semiconductors
Product specification
Hex 2-input AND drivers
74F808/74F1808
AC ELECTRICAL CHARACTERISTICS
LIMITS
Tamb = +25°C
SYMBOL
tPLH
tPHL
PARAMETER
TEST
CONDITION
Propagation delay
Dna, Dnb to Qn
Tamb = 0°C to +70°C
VCC = +5.0V ± 10%
CL = 50pF,
RL = 500Ω
VCC = +5.0V
CL = 50pF,
RL = 500Ω
Waveform 1
UNIT
MIN
TYP
MAX
MIN
MAX
2.0
2.0
4.5
3.5
6.3
6.0
2.0
1.5
6.8
6.5
ns
3.0
ns
tsk(o)
Output skew1,2
Waveform 2
2.5
NOTES:
1. [tPN actual – tPM actual] for any output compared to any other output where N and M are either LH or HL.
2. Skew times are valid only under same test conditions (temperature, VCC, loading, etc.,).
AC WAVEFORMS
Qn
Dna, Dnb
VM
VM
VM
tsk(0)
tPLH
tPHL
Qn
VM
Qn
VM
VM
SF00481
SF00054
Waveform 1. Propagation delay for inverting outputs
Waveform 2. Output skew
NOTE: For all waveforms, VM = 1.5V.
TEST CIRCUIT AND WAVEFORMS
VCC
NEGATIVE
PULSE
VIN
tw
90%
10%
D.U.T.
RT
CL
RL
AMP (V)
VM
VM
VOUT
PULSE
GENERATOR
90%
10%
tTHL (tf )
tTLH (tr )
tTLH (tr )
tTHL (tf )
0V
AMP (V)
90%
POSITIVE
PULSE
VM
VM
10%
Test Circuit for Totem-Pole Outputs
DEFINITIONS:
RL = Load resistor;
see AC ELECTRICAL CHARACTERISTICS for value.
CL = Load capacitance includes jig and probe capacitance;
see AC ELECTRICAL CHARACTERISTICS for value.
RT = Termination resistance should be equal to ZOUT of
pulse generators.
90%
10%
tw
0V
Input Pulse Definition
INPUT PULSE REQUIREMENTS
family
amplitude VM
74F
3.0V
1.5V
rep. rate
tw
tTLH
tTHL
1MHz
500ns
2.5ns
2.5ns
SF00006
January 2, 1991
5
Philips Semiconductors
Product specification
Hex 2-input AND drivers
74F808, 74F1808
DIP20: plastic dual in-line package; 20 leads (300 mil)
1991 Jan 02
6
SOT146-1
Philips Semiconductors
Product specification
Hex 2-input AND drivers
74F808, 74F1808
SO20: plastic small outline package; 20 leads; body width 7.5 mm
1991 Jan 02
7
SOT163-1
Philips Semiconductors
Product specification
Hex 2-input AND drivers
74F808, 74F1808
Data sheet status
Data sheet
status
Product
status
Definition [1]
Objective
specification
Development
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
Preliminary
specification
Qualification
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
Product
specification
Production
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
 Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
print code
Document order number:
yyyy mmm dd
8
Date of release: 10-98
9397-750-05184
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