PHILIPS N74F51N Dual 2-wide 2-input, 2-wise 3-input and-or-invert gate Datasheet

INTEGRATED CIRCUITS
74F51
Dual 2-wide 2-input, 2-wise 3-input
AND-OR-invert gate
Product specification
IC15 Data Handbook
1989 Mar 03
Philips Semiconductors
Product specification
Dual 2-wide 2-input, 2-wide 3-input AND-OR-invert gate
TYPE
TYPICAL
PROPAGATION
DELAY
TYPICAL
SUPPLY CURRENT
(TOTAL)
74F51
3.0ns
3.5mA
PIN CONFIGURATION
D0a
1
14
VCC
D1a
2
13
D0c
D1b
3
12
D0b
ORDERING INFORMATION
DESCRIPTION
COMMERCIAL RANGE
VCC = 5V ±10%,
Tamb = 0°C to +70°C
PKG DWG #
14-pin plastic DIP
N74F51N
SOT27-1
14-pin plastic SO
N74F51D
SOT108-1
74F51
D1c
4
11
D0f
D1d
5
10
D0e
Q1
6
9
D0d
GND
7
8
Q0
SF00085
INPUT AND OUTPUT LOADING AND FAN-OUT TABLE
PINS
DESCRIPTION
74F (U.L.) HIGH/LOW
Dna, Dnb, Dnc, Dnd, Dne, Dnf Data inputs
1.0/1.0
Q0, Q1
Data outputs
50/33
NOTE: One (1.0) FAST unit load is defined as: 20µA in the High state and 0.6mA in the Low state.
LOGIC SYMBOL
IEC/IEEE SYMBOL
&
9
1
12
LOAD VALUE HIGH/LOW
20µA/0.6mA
1.0mA/20mA
13
9
10
11
2
3
4
5
1
10
11
8
13
&
D0a D0b D0c D0d D0e D0f D1a D1b D1c D1d
12
1
Q0
Q1
2
&
1
3
8
6
4
6
&
5
VCC = Pin 14
GND = Pin 7
SF00086
SF00087
LOGIC DIAGRAM
D0a
D0b
D0c
D0d
D0e
D0f
D1a
D1b
D1c
D1d
VCC = Pin 14
GND = Pin 7
FUNCTION TABLE FOR 3-INPUT GATES
1
D0a
H
X
12
13
8
9
Q0
INPUTS
D0c
D0d
D0e
H
X
X
X
H
H
All other combinations
11
2
3
6
OUTPUT
Q0
L
L
H
FUNCTION TABLE FOR 2-INPUT GATES
Q1
INPUTS
5
SF00088
OUTPUT
D1a
D1b
D1c
D1d
Q1
H
X
H
X
X
H
X
H
L
L
All other combinations
NOTES:
H = High voltage level
L = Low voltage level
X = Don’t care
March 3, 1989
D0f
X
H
NOTES:
H = High voltage level
L = Low voltage level
X = Don’t care
10
4
D0b
H
X
2
H
853–0054 95962
Philips Semiconductors
Product specification
Dual 2-wide 2-input, 2-wide 3-input AND-OR-invert gate
74F51
ABSOLUTE MAXIMUM RATINGS
(Operation beyond the limits set forth in this table may impair the useful life of the device.
Unless otherwise noted these limits are over the operating free-air temperature range.)
SYMBOL
PARAMETER
RATING
UNIT
VCC
Supply voltage
–0.5 to +7.0
V
VIN
Input voltage
–0.5 to +7.0
V
IIN
Input current
–30 to +5
mA
VOUT
Voltage applied to output in High output state
–0.5 to VCC
V
IOUT
Current applied to output in Low output state
Tamb
Operating free-air temperature range
Tstg
Storage temperature range
40
mA
0 to +70
°C
–65 to +150
°C
RECOMMENDED OPERATING CONDITIONS
LIMITS
SYMBOL
PARAMETER
UNIT
MIN
NOM
MAX
5.0
5.5
VCC
Supply voltage
4.5
V
VIH
High-level input voltage
2.0
VIL
Low-level input voltage
0.8
V
IIK
Input clamp current
–18
mA
IOH
High-level output current
–1
mA
IOL
Low-level output current
20
mA
Tamb
Operating free-air temperature range
+70
°C
V
0
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
SYMBOL
TEST CONDITIONS1
PARAMETER
LIMITS
MIN
VCC = MIN, VIL = MAX
±10%VCC
2.5
VIH = MIN, IOH = MAX
±5%VCC
2.7
VCC = MIN, VIL = MAX
±10%VCC
VIH = MIN, IOL = MAX
±5%VCC
VOH
O
High level output voltage
High-level
VOL
O
Low level output voltage
Low-level
VIK
Input clamp voltage
VCC = MIN, II = IIK
II
Input current at maximum input
voltage
IIH
TYP2
MAX
UNIT
V
3.4
V
0.30
0.50
V
0.30
0.50
V
–0.73
–1.2
V
VCC = MAX, VI = 7.0V
100
µA
High-level input current
VCC = MAX, VI = 2.7V
20
µA
IIL
Low-level input current
VCC = MAX, VI = 0.5V
IOS
Short-circuit output current3
VCC = MAX
ICC
Supply current (total)
ICCH
–60
VIN = GND
VCC = MAX
1.8
–0.6
mA
–150
mA
3.0
mA
ICCL
VIN = 4.5V
5.5
7.5
mA
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at VCC = 5V, Tamb = 25°C.
3. Not more than one output should be shorted at a time. For testing IOS, the use of high-speed test apparatus and/or sample-and-hold
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
of a High output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, IOS tests should be performed last.
March 3, 1989
3
Philips Semiconductors
Product specification
Dual 2-wide 2-input, 2-wide 3-input AND-OR-invert gate
74F51
AC ELECTRICAL CHARACTERISTICS
LIMITS
SYMBOL
TEST
CONDITION
PARAMETER
tPLH
tPHL
Propagation delay
Dna, Dnb, Dnc, Dnd, Dne, Dnf to Qn
VCC = +5.0V ± 10%
Tamb = 0°C to +70°C
CL = 50pF, RL = 500Ω
VCC = +5.0V
Tamb = +25°C
CL = 50pF, RL = 500Ω
Waveform 1
MIN
TYP
MAX
MIN
MAX
2.0
1.0
3.5
2.5
5.5
4.0
1.5
1.0
6.5
4.5
UNIT
ns
AC WAVEFORMS
Dna, Dnb, Dnc, Dnd, Dne, Dnf
VM
VM
tPHL
tPLH
VM
Qn
VM
SF00089
Waveform 1. Propagation Delay for Inverting Outputs
NOTE:
For all waveforms, VM = 1.5V.
TEST CIRCUIT AND WAVEFORM
VCC
VIN
tw
90%
NEGATIVE
PULSE
VM
D.U.T.
RT
CL
RL
AMP (V)
VM
10%
VOUT
PULSE
GENERATOR
90%
10%
tTHL (tf )
tTLH (tr )
tTLH (tr )
tTHL (tf )
0V
AMP (V)
90%
90%
POSITIVE
PULSE
DEFINITIONS:
RL = Load resistor;
see AC ELECTRICAL CHARACTERISTICS for value.
CL = Load capacitance includes jig and probe capacitance;
see AC ELECTRICAL CHARACTERISTICS for value.
RT = Termination resistance should be equal to ZOUT of
pulse generators.
VM
VM
10%
Test Circuit for Totem-Pole Outputs
10%
tw
0V
Input Pulse Definition
INPUT PULSE REQUIREMENTS
family
amplitude VM
74F
3.0V
1.5V
rep. rate
tw
tTLH
tTHL
1MHz
500ns
2.5ns
2.5ns
SF00006
March 3, 1989
4
Philips Semiconductors
Product specification
Dual 2-wide 2-input, 2-wise 3-input AND-OR-invert gate
DIP14: plastic dual in-line package; 14 leads (300 mil)
1989 Mar 03
5
74F51
SOT27-1
Philips Semiconductors
Product specification
Dual 2-wide 2-input, 2-wise 3-input AND-OR-invert gate
SO14: plastic small outline package; 14 leads; body width 3.9 mm
1989 Mar 03
6
74F51
SOT108-1
Philips Semiconductors
Product specification
Dual 2-wide 2-input, 2-wise 3-input AND-OR-invert gate
NOTES
1989 Mar 03
7
74F51
Philips Semiconductors
Product specification
Dual 2-wide 2-input, 2-wise 3-input AND-OR-invert gate
74F51
Data sheet status
Data sheet
status
Product
status
Definition [1]
Objective
specification
Development
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
Preliminary
specification
Qualification
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
Product
specification
Production
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
 Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
print code
Document order number:
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Date of release: 10-98
9397-750-05065
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