Newhaven NHD-320240WG-C0BGH-VZ-010 Liquid crystal display graphic module Datasheet

User’s Guide
NHD-320240WG-COTFH-VZ#-010-80
LCM
(Liquid Crystal Display Graphic Module)
RoHS Compliant
NHD320240WGC OTFHVZ#010-80:
Newhaven Display
320 x 240 Dots
W= Version Line G= Display Type- Graphic
Model Serial Number
White LED B/L
FSTN (+)
Transflective, 6:00 View, Wide Temperature (-20 ~ +70c)
With built in Negative Voltage, Rohs
Backlight A(+5V)=PIN19, K=PIN20,
Intel 8080 interface mode
For product support, contact
Newhaven Display International
2511 Technology Drive, #101
Elgin, IL 60124
Tel: (847) 844-8795 Fax: (847) 844-8796
April 17, 2008
RECORDS OF REVISION
VERSION
DATE
0
2006.06.23
REVISED
PAGE NO.
DOC. FIRST ISSUE
SUMMARY
First issue
Contents
1.Module classification information
2.Precautions in Use of LCM
3.General Specification
4.Absolute Maximum Ratings
5.Electrical Characteristics
6.Optical Characteristics
7.Interface Description
8.Contour Drawing & Block Diagram
9. Display Control Instruction
10.Reliability
11. Backlight Information
12.Inspection specification
13.Material List of Components for RoHs
第 3 頁,共 20 頁
3
1.Module Classification Information
NHD 320240 W
G - C0 T F H – VZ#-010-80
c
f
d
e
ghij
9
c Brand:Newhaven Display
d Display Font:320 * 240 Dots
e Factory Line: W
f Display Type:H→Character Type, G→Graphic Type, C→ Color, X→Tab Type
g Model / Serial number: C0 Æ With RA8835 Controller
h Backlight Type:
N→Without backlight
T→White LED
B→EL, Blue green
A→LED, Amber
D→EL, Green
R→LED, Red
W→EL, White
O→LED, Orange
F→CCFL, White
G→LED, Green
Y→LED, Yellow Green
i LCD Mode:
B→TN Positive, Gray
T→FSTN Negative
N→TN Negative,
Y→STN Positive, Yellow Green
G→STN Positive, Gray
M→STN Negative, Blue
F→FSTN Positive
j LCD Polarize Type/ A→Reflective, N.T, 6:00
Temperature range/ D→Reflective, N.T, 12:00
View direction
G→Reflective, W. T, 6:00
H→Transflective, W.T,6:00
J→Reflective, W. T, 12:00
F→Transmissive, N.T,12:00
B→Transflective, N.T,6:00
I→Transmissive, W. T, 6:00
E→Transflective, N.T.12:00
L→Transmissive, W.T,12:00
9 Special Code
K→Transflective, W.T,12:00
C→Transmissive, N.T,6:00
#: RoHS ; V: Built in Negative voltage
Z: NT7086 Driver Control RA8835
-010: Backlight A(+5V)=PIN19, K=PIN20
-80: Intel 8080 Interface mode
Newhaven Display International, LLC
NHD-320240WG-C0TFH-VZ#-010-80
2.Precautions in Use of LCD Module
(1)Avoid applying excessive shocks to the module or making any alterations or modifications to it.
(2)Don’t make extra holes on the printed circuit board, modify its shape or change the components of
LCD Module.
(3)Don’t disassemble the LCM.
(4)Don’t operate it above the absolute maximum rating.
(5)Don’t drop, bend or twist LCM.
(6)Soldering: only to the I/O terminals.
(7)Storage: please storage in anti-static electricity container and clean environment.
3.General Specification
ITEM
STANDARD VALUE
UNIT
Number of dots
320x240
dots
Outline dimension
148.02 (W)x 120.24(H)x 15.6max(T)
mm
View area
120.14(W)x 92.14(H)
mm
Active area
115.18(W)x 86.38(H)
mm
Dot size
0.34(W)x 0.34(H)
mm
Dot pitch
0.36(W)x 0.36(H)
mm
LCD type
View direction
Backlight
FSTN Positive , Transflective
6 o’clock
LED , White
第 5 頁,共 20 頁
4.Absolute Maximum Ratings
ITEM
SYMBOL
MIN.
TYP.
MAX.
UNIT
Operating Temperature
TOP
-20
-
+70
℃
Storage Temperature
TST
-30
-
+80
℃
Input Voltage
VI
0
-
Vdd
V
Supply Voltage For Logic
VDD
0
-
6.5
V
Supply Voltage For LCD
VDD-VEE
0
-
32
V
SYMBOL
CONDITION
MIN.
TYP.
MAX.
UNIT
VDD-VSS
-
4.5
5.0
5.5
V
Ta=-20℃
-
-
25.0
V
Ta=25℃
-
23.8
-
V
Ta=70℃
23.0
-
-
V
5.Electrical Characteristics
ITEM
Logic Voltage
Supply Voltage For
LCD
VDD-VO
Input High Volt.
VIH
-
0.5VDD
-
VDD
V
Input Low Volt.
VIL
-
0
-
0.2VDD
V
Output High Volt.
VOH
-
2.4
-
-
V
Output Low Volt.
VOL
-
-
-
0.4
V
Supply Current
IDD
-
95.0
100.0
110.0
mA
第 6 頁,共 20 頁
6.Optical Characteristics
ITEM
SYMBAL CONDITION MIN
MAX
UNIT
(V)θ
CR≧2
30
-
60
deg.
(H)φ
CR≧2
-45
-
45
deg.
CR
-
-
5
-
-
T rise
-
-
200
300
ms
T fall
-
-
150
200
ms
View Angle
Contrast Ratio
Response Time
Definitions
■View Angles
( Visual angle direction )
Brightness at selected state ( BS )
Brightness at non-selected state ( Bns )
Selected state
CR =
φ
X
Brightness (%)
Z
■Contrast Ratio
Non-selected state
Bs
Bns
Y
Operating voltage for LCD driving
θ
■Response time
Nonselected Condition
Selected Condition
Nonselected Condition
90 %
100 %
Brightness
6.1
TYP
10 %
tr
Rise Time
td
第 7 頁,共 20 頁
Decay Time ( fall time tf )
7.Interface Description
JM (left) short , for 8080 MPU family
Pin No.
Symbol
Level
Description
1
VSS
0V
2
VDD
5.0V
3
VO
4
/RD
H/L
Active Low=Read data
5
/WR
H/L
/WR signal input to select the write mode
Active Low = Write data
6
A0
H/L
R/W=L, A0=H: Command Write
R/W=H, A0=H: Status Read
7~14
DB0~DB7
H/L
Data bus
15
CS
H/L
Chip select ,Active L
16
RES
H/L
Controller reset signal, Active L
17
VEE
-25V
Negative voltage output (Optional)
18
FGND
Ground
Power supply for Logic
(Variable) Driving voltage for LCD
Frame Ground
19
A
5.0V
Backlight supply
20
K
0V
Backlight ground
第 8 頁,共 20 頁
A0=L: Data Write
A0=L: Data Read
8.Contour Drawing & Block diagram
4.02
139.98
136.2
120.14(V A )
115.18(A A )
13.97
16.45
16.62
13.74
4.02
7.11
4.44
15.6M A X
10.5
86.38(AA)
92.14(VA)
105.4
112.2
120.24 0.5
X H -3P EQ
320*240 D ots
190.0±5.0
2.54
2
1
5.0
20
19
4- 23.5PTH
4- 26.0PA D
22.86
21.06
20- 21.0PTH
20- 21.8PA D
1.6
(P2.54*9)
148.02
L ED B /L
0.5
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
V ss
V dd
Vo
RD
WR
A0
DB0
DB1
DB2
DB3
DB4
DB5
DB6
DB7
CS
R ES
V ee
FG N D
A
K
T he non-specified tolerance of dim ension is ±0.3 m m .
0.34
0.36
0.36
0.34
D O T SIZE
SC A L E 10/1
Com161~240
Power ON
Reset
Com81~160
32K
SRAM
Com1~80
MPU
Driver
Controller
Driver
RA8835
Driver
CL1
M
FLM
RD
WR
A0
DB0~DB7
CS
RES
320X240 DOT
VR
20K
Bias and
Power Circuit
*
Vdd
Vo
Vee
N.V.
Generator
Internal contrast adjustment.
Seg1~80
Seg81~160
Seg161~240
Seg241~320
Driver
Driver
Driver
Driver
CL2
DB0~DB3
Frame PAD
*:6800 family or 8080family interface selectable.
第 9 頁,共 20 頁
FGND
9.Display Control Instruction
PLEASE TO CONSUL RA8835 SPEC
第 10 頁,共 20 頁
10.RELIABILITY
Content of Reliability Test (wide temperature, -20℃~70℃)
Environmental Test
Test Item
Content of Test
Test Condition
Endurance test applying the high storage temperature for a long
80℃
time.
200hrs
Low Temperature
Endurance test applying the high storage temperature for a long
-30℃
storage
time.
200hrs
High Temperature
Endurance test applying the electric stress (Voltage & Current)
70℃
Operation
and the thermal stress to the element for a long time.
200hrs
Low Temperature
Endurance test applying the electric stress under low temperature -20℃
Operation
for a long time.
High Temperature storage
200hrs
The module should be allowed to stand at 60℃,90%RH max
High Temperature/
Humidity Operation
For 96hrs under no-load condition excluding the polarizer,
Then taking it out and drying it at normal temperature.
Note
2
1,2
——
1
60℃,90%RH
96hrs
1,2
The sample should be allowed stand the following 10 cycles of
operation
-20℃
25℃
70℃
Thermal shock resistance
-20℃/70℃
10 cycles
30min
5min
——
30min
1 cycle
Total fixed amplitude :
15mm
Vibration test
Endurance test applying the vibration during transportation and
Vibration Frequency :
using.
3
10~55Hz
One cycle 60 seconds to 3
directions of X,Y,Z for
Each 15 minutes
VS=800V,RS=1.5kΩ
Static electricity test
Endurance test applying the electric stress to the terminal.
CS=100pF
——
1 time
Note1: No dew condensation to be observed.
Note2: The function test shall be conducted after 4 hours storage at the normal
Temperature and humidity after remove from the test chamber.
Note3: Vibration test will be conducted to the product itself without putting it in a container.
第 11 頁,共 20 頁
11. Backlight Information
Specification
PARAMETER
SYMBOL MIN
TYP
MAX
UNIT
TEST
Supply Current
ILED
160
200
mA
VatPIN19=5.0V
Supply Voltage
V(PIN19) 4.8
5.0
5.1
V
-
Reverse Voltage
VR
-
-
8
V
-
IV
260
280
-
-
-
50K
Luminous
Intensity
Wave Length
λp
Life Time
-
Color
White
130
CONDITION
CD/M2 ILED=160mA
-
-
nm
ILED=160mA
Hr.
ILED=160mA
Note: The LED of B/L is drive by current only, drive voltage is for reference only.
drive voltage can make driving current under safety area (current between
minimum and maximum).
LED B\L Drive Method
1.Drive from 19,20
R
19
B/L
20
第 12 頁,共 20 頁
12. Inspection specification
NO
Item
Criterion
AQL
1.1 Missing vertical, horizontal segment, segment contrast defect.
1.2 Missing character , dot or icon.
1.3 Display malfunction.
1.4 No function or no display.
1.5 Current consumption exceeds product specifications.
1.6 LCD viewing angle defect.
1.7 Mixed product types.
1.8 Contrast defect.
01
Electrical
Testing
02
Black or white 2.1 White and black spots on display ≦0.25mm, no more than three
spots on LCD
2.5
white or black spots present.
(display only) 2.2 Densely spaced: No more than two spots or lines within 3mm
03
04
3.1 Round type : As following drawing
Φ=( x + y ) / 2
SIZE
Φ≦0.10
0.10<Φ≦0.20
black
0.20<Φ≦0.25
white
0.25<Φ
LCD
spots,
spots,
contamination 3.2 Line type : (As following drawing)
(non-display)
Length
Width
--W≦0.02
L≦3.0 0.02<W≦0.03
L≦2.5 0.03<W≦0.05
--0.05<W
Polarizer
bubbles
If bubbles are visible,
judge using black spot
specifications, not
easy to find, must
check in specify
direction.
Size Φ
Φ≦0.20
Acceptable Q TY
Accept no dense
2
1
0
2.5
2
As round type
Acceptable Q TY
Accept no dense
3
0.50<Φ≦1.00
2
1.00<Φ
0
第 13 頁,共 20 頁
2.5
Acceptable Q TY
Accept no dense
0.20<Φ≦0.50
Total Q TY
0.65
3
2.5
NO
Item
05
Scratches
Criterion
AQL
Follow NO.3 LCD black spots, white spots, contamination
Symbols Define:
x: Chip length
y: Chip width
z: Chip thickness
k: Seal width
t: Glass thickness
a: LCD side length
L: Electrode pad length:
6.1 General glass chip :
6.1.1 Chip on panel surface and crack between panels:
Chipped
06
glass
z: Chip thickness
y: Chip width
x: Chip length
Z≦1/2t
Not over viewing area
x≦1/8a
1/2t<z≦2t
Not exceed 1/3k
x≦1/8a
☉If there are 2 or more chips, x is total length of each chip.
6.1.2 Corner crack:
z: Chip thickness
y: Chip width
x: Chip length
Z≦1/2t
Not over viewing area
x≦1/8a
1/2t<z≦2t
Not exceed 1/3k
x≦1/8a
☉If there are 2 or more chips, x is the total length of each chip.
第 14 頁,共 20 頁
2.5
NO
Item
Criterion
AQL
Symbols :
x: Chip length
y: Chip width
z: Chip thickness
k: Seal width
t: Glass thickness a: LCD side length
L: Electrode pad length
6.2 Protrusion over terminal :
6.2.1 Chip on electrode pad :
y: Chip width
x: Chip length
y≦0.5mm
x≦1/8a
6.2.2 Non-conductive portion:
06
z: Chip thickness
0 < z≦t
Glass
crack
2.5
y: Chip width
x: Chip length
z: Chip thickness
y≦ L
x≦1/8a
0 < z≦t
☉If the chipped area touches the ITO terminal, over 2/3 of the ITO must
remain and be inspected according to electrode terminal specifications.
☉If the product will be heat sealed by the customer, the alignment mark
not be damaged.
6.2.3 Substrate protuberance and internal crack.
y: width
y≦1/3L
第 15 頁,共 20 頁
x: length
x≦a
NO
Item
07
Cracked glass
08
09
10
Backlight
elements
Bezel
PCB、COB
Criterion
AQL
The LCD with extensive crack is not acceptable.
2.5
8.1 Illumination source flickers when lit.
8.2 Spots or scratched that appear when lit must be judged. Using LCD
spot, lines and contamination standards.
8.3 Backlight doesn't light or color wrong.
0.65
2.5
9.1 Bezel may not have rust, be deformed or have fingerprints, stains or
other contamination.
9.2 Bezel must comply with job specifications.
2.5
0.65
10.1 COB seal may not have pinholes larger than 0.2mm or
contamination.
10.2 COB seal surface may not have pinholes through to the IC.
10.3 The height of the COB should not exceed the height indicated
in the assembly diagram.
10.4 There may not be more than 2mm of sealant outside the seal
area on the PCB. And there should be no more than three
places.
10.5 No oxidation or contamination PCB terminals.
10.6 Parts on PCB must be the same as on the production
characteristic chart. There should be no wrong parts, missing
parts or excess parts.
10.7 The jumper on the PCB should conform to the product
characteristic chart.
10.8 If solder gets on bezel tab pads, LED pad, zebra pad or screw
hold pad, make sure it is smoothed down.
10.9 The Scraping testing standard for Copper Coating of PCB
2.5
0.65
2.5
0.65
2.5
2.5
0.65
0.65
2.5
2.5
X
Y
11
Soldering
X * Y<=2mm2
11.1 No un-melted solder paste may be present on the PCB.
11.2 No cold solder joints, missing solder connections, oxidation or
icicle.
11.3 No residue or solder balls on PCB.
11.4 No short circuits in components on PCB.
第 16 頁,共 20 頁
2.5
2.5
2.5
0.65
NO
Item
Criterion
12.1 No oxidation, contamination, curves or, bends on interface Pin
AQL
2.5
(OLB) of TCP.
12.2 No cracks on interface pin (OLB) of TCP.
0.65
12.3 No contamination, solder residue or solder balls on product.
2.5
12.4 The IC on the TCP may not be damaged, circuits.
2.5
12.5 The uppermost edge of the protective strip on the interface pin
2.5
must be present or look as if it cause the interface pin to sever.
General
12
appearance
12.6 The residual rosin or tin oil of soldering (component or chip
2.5
component) is not burned into brown or black color.
12.7 Sealant on top of the ITO circuit has not hardened.
2.5
12.8 Pin type must match type in specification sheet.
0.65
12.9 LCD pin loose or missing pins.
0.65
12.10 Product packaging must the same as specified on packaging
0.65
specification sheet.
12.11 Product dimension and structure must conform to product
specification sheet.
第 17 頁,共 20 頁
0.65
13 Material List of Components for RoHs
1.
Newhaven Display hereby declares that all of or part of products (with the mark
“#”in code), including, but not limited to, the LCM, accessories or packages, manufactured
and/or delivered to your company (including your subsidiaries and affiliated company)
directly or indirectly by our company (including our subsidiaries or affiliated companies) do
not intentionally contain any of the substances listed in all applicable EU directives and
regulations, including the following substances.
Exhibit A:The Harmful Material List
Material
(Cd)
(Pb)
(Hg)
(Cr6+)
PBBs
PBDEs
Limited
100
1000
1000
1000
1000
1000
Value
ppm
ppm
ppm
ppm
ppm
ppm
Above limited value is set up according to RoHS.
2.Process for RoHS requirement:
(1) Use the Sn/Ag/Cu soldering surface;the surface of Pb-free solder is rougher than we used
before.
(2) Heat-resistance temp.:
Reflow:250℃,30 seconds Max.;
Connector soldering wave or hand soldering:320℃, 10 seconds max.
(3) Temp. curve of reflow, max. Temp.:235±5℃;
Recommended customer’s soldering temp. of connector:280℃, 3 seconds.
第 18 頁,共 20 頁
Newhaven LCM Sample Estimate Feedback Sheet
Module Number:
1、Panel Specification:
1.
Panel Type:
Page: 1
□ Pass
□ NG ,
2.
View Direction:
□ Pass
□ NG ,
3.
Numbers of Dots:
□ Pass
□ NG ,
4.
View Area:
□ Pass
□ NG ,
5.
Active Area:
□ Pass
□ NG ,
6.
Operating Temperature:
□ Pass
□ NG ,
7.
Storage Temperature:
□ Pass
□ NG ,
8.
Others:
2、Mechanical Specification:
1.
PCB Size:
□ Pass
□ NG ,
2.
Frame Size:
□ Pass
□ NG ,
3.
Material of Frame:
□ Pass
□ NG ,
4.
Connector Position:
□ Pass
□ NG ,
5.
Fix Hole Position:
□ Pass
□ NG ,
6.
Backlight Position:
□ Pass
□ NG ,
7.
Thickness of PCB:
□ Pass
□ NG ,
8.
Height of Frame to PCB: □ Pass
□ NG ,
9.
Height of Module:
□ Pass
□ NG ,
10.
Others:
□ Pass
□ NG ,
3、Relative Hole Size:
1.
Pitch of Connector:
□ Pass
□ NG ,
2.
Hole size of Connector:
□ Pass
□ NG ,
3.
Mounting Hole size:
□ Pass
□ NG ,
4.
Mounting Hole Type:
□ Pass
□ NG ,
5.
Others:
□ Pass
□ NG ,
4、Backlight Specification:
1.
B/L Type:
□ Pass
□ NG ,
2.
B/L Color:
□ Pass
□ NG ,
3.
B/L Driving Voltage (Reference for LED Type): □ Pass
4.
B/L Driving Current:
□ Pass
□ NG ,
5.
Brightness of B/L:
□ Pass
□ NG ,
6.
B/L Solder Method:
□ Pass
□ NG ,
7.
Others:
□ Pass
□ NG ,
>> Go to page 2 <<
第 19 頁,共 20 頁 Newhaven
□ NG ,
Newhaven
Module Number:
5、Electronic Characteristics of Module:
1.
Input Voltage:
□ Pass
Page: 2
□ NG ,
2.
Supply Current:
□ Pass
□ NG ,
3.
Driving Voltage for LCD:
□ Pass
□ NG ,
4.
Contrast for LCD:
□ Pass
□ NG ,
5.
B/L Driving Method:
□ Pass
□ NG ,
6.
Negative Voltage Output:
□ Pass
□ NG ,
7.
Interface Function:
□ Pass
□ NG ,
8.
LCD Uniformity:
□ Pass
□ NG ,
9.
ESD test:
□ Pass
□ NG ,
Others:
□ Pass
□ NG ,
10.
6、Summary:
Sales signature:
Customer Signature:
Date:
第 20 頁,共 20 頁
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