NLU1GT04 Single Inverter, TTL Level LSTTL-Compatible Inputs The NLU1GT04 MiniGatet is an advanced CMOS high-speed inverting buffer in ultra-small footprint. The device input is compatible with TTL-type input thresholds and the output has a full 5.0 V CMOS level output swing. The NLU1GT04 input and output structures provide protection when voltages up to 7 V are applied, regardless of the supply voltage. http://onsemi.com MARKING DIAGRAMS Features 1 5 2 NM ULLGA6 1.2 x 1.0 CASE 613AE NM ULLGA6 1.45 x 1.0 CASE 613AF M 1 1 VCC NC 2 IN A 6 ULLGA6 1.0 x 1.0 CASE 613AD M 1 VOH > 0.8 VCC; VOL < 0.1 VCC @ Load •Power Down Protection Provided on inputs •Balanced Propagation Delays •Ultra-Small Packages •These are Pb-Free Devices NC UDFN6 MU SUFFIX CASE 517AA N •High Speed: tPD = 3.8 ns (Typ) @ VCC = 5.0 V •Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C •TTL-Compatible Input: VIL = 0.8 V; VIH = 2.0 V •CMOS-Compatible Output: 1 3 GND 4 N or 2 M OUT Y Figure 1. Pinout (Top View) IN A 1 = Device Marking = Date Code PIN ASSIGNMENT 1 OUT Y Figure 2. Logic Symbol NC 2 IN A 3 GND 4 OUT Y 5 NC 6 VCC FUNCTION TABLE A Y L H H L ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. © Semiconductor Components Industries, LLC, 2008 March, 2008 - Rev. 1 1 Publication Order Number: NLU1GT04/D NLU1GT04 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage -0.5 to +7.0 V VIN DC Input Voltage -0.5 to +7.0 V DC Output Voltage -0.5 to +7.0 V VIN < GND -20 mA VOUT < GND ±20 mA VOUT Parameter IIK DC Input Diode Current IOK DC Output Diode Current IO DC Output Source/Sink Current ±12.5 mA ICC DC Supply Current Per Supply Pin ±25 mA IGND DC Ground Current per Ground Pin ±25 mA TSTG Storage Temperature Range -65 to +150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature Under Bias 150 °C MSL FR VESD ILATCHUP Moisture Sensitivity Level 1 Flammability Rating Oxygen Index: 28 to 34 ESD Withstand Voltage UL 94 V-0 @ 0.125 in Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) Latchup Performance Above VCC and Below GND at 125 °C (Note 5) > 2000 > 200 N/A V ±500 mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm-by-1 inch, 2 ounce copper trace no air flow. 2. Tested to EIA / JESD22-A114-A. 3. Tested to EIA / JESD22-A115-A. 4. Tested to JESD22-C101-A. 5. Tested to EIA / JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit 1.65 5.5 V VCC Positive DC Supply Voltage VIN Digital Input Voltage 0 5.5 V Output Voltage 0 5.5 V -55 +125 °C 0 0 100 20 ns/V VOUT TA Operating Free-Air Temperature Dt/DV Input Transition Rise or Fall Rate VCC = 3.3 V ± 0.3 V VCC = 5.0 V ± 0.5 V http://onsemi.com 2 NLU1GT04 DC ELECTRICAL CHARACTERISTICS Symbol Parameter VIH Low-Level Input Voltage VIL VOH VOL Conditions Low-Level Input Voltage High-Level Output Voltage Low-Level Output Voltage TA = 25 5C TA = +855C TA = -555C to +1255C Min Min VCC (V) Min 3.0 1.4 1.4 1.4 4.5 to 5.5 2.0 2.0 2.0 Typ Max Max Max V 3.0 0.53 0.53 0.53 4.5 to 5.5 0.8 0.8 0.8 VIN = VIH or VIL IOH = -50 mA 3.0 4.5 2.9 4.4 VIN = VIH or VIL IOH = -4 mA IOH = -8 mA 3.0 4.5 2.58 3.94 VIN = VIH or VIL IOL = 50 mA 3.0 4.5 VIN = VIH or VIL IOL = 4 mA IOL = 8 mA 3.0 4.5 0 0 2.9 4.4 2.9 4.4 2.48 3.80 2.34 3.66 Unit V V 0.1 0.1 0.1 0.1 0.1 0.1 3.0 4.5 0.36 0.36 0.44 0.44 0.52 0.52 V IIN Input Leakage Current 0 v VIN v 5.5 V 0 to 5.5 ±0.1 ±1.0 ±1.0 mA ICC Quiescent Supply Current 0 v VIN v VCC 5.5 1.0 20 40 mA ICCT Quiescent Supply Current VIN = 3.4 V 5.5 1.35 1.50 1.65 mA IOPD Output Leakage Current VOUT = 5.5 V 0.0 0.5 5.0 10 mA AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) Symbol tPLH, tPHL Parameter Propagation Delay, Input A to Output Y CIN Input Capacitance CPD Power Dissipation Capacitance (Note 6) VCC (V) Test Condition 3.0 to 3.6 4.5 to 5.5 TA = 25 5C Min TA = +855C Typ Max CL = 15 pF 5.0 10.0 CL = 50 pF 6.2 CL = 15 pF CL = 50 pF 5.0 Max Unit 11.0 13.0 ns 13.5 15.0 17.5 3.8 6.7 7.5 8.5 4.2 7.7 8.5 9.5 5 10 10 10.0 10 Min Max TA = -555C to +1255C Min pF pF 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without load. Average operating current can be obtained by the equation ICC(OPR) = CPD • VCC • fin + ICC. CPD is used to determine the no-load dynamic power consumption: PD = CPD • VCC2 • fin + ICC • VCC. http://onsemi.com 3 NLU1GT04 VCC A or B 50% GND tPLH Y tPHL 50% VCC Figure 3. Switching Waveforms OUTPUT INPUT CL* *Includes all probe and jig capacitance. A 1-MHz square input wave is recommended for propagation delay tests. Figure 4. Test Circuit ORDERING INFORMATION Package Shipping† UDFN6 (Pb-Free) 3000 / Tape & Reel NLU1GT04AMX1TCG ULLGA6, 1.45 x 1.0, 0.5P (Pb-Free) 3000 / Tape & Reel NLU1GT04BMX1TCG ULLGA6, 1.2 x 1.0, 0.4P (Pb-Free) 3000 / Tape & Reel NLU1GT04CMX1TCG ULLGA6, 1.0 x 1.0, 0.35P (Pb-Free) 3000 / Tape & Reel Device NLU1GT04MUTCG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 4 NLU1GT04 PACKAGE DIMENSIONS UDFN6, 1.2x1.0, 0.4P CASE 517AA-01 ISSUE C EDGE OF PACKAGE PIN ONE REFERENCE 2X 0.10 C ÉÉ ÉÉ ÉÉ L1 E DETAIL A Bottom View (Optional) TOP VIEW 2X EXPOSED Cu 0.10 C (A3) 0.10 C A1 A 10X 0.08 C ÉÉÉ ÉÉÉ A3 DETAIL B Side View (Optional) 5X MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 1.20 BSC 1.00 BSC 0.40 BSC 0.30 0.40 0.00 0.15 0.40 0.50 MOUNTING FOOTPRINT* 6X 6X 0.42 C A1 DIM A A1 A3 b D E e L L1 L2 MOLD CMPD SEATING PLANE SIDE VIEW 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. A B D 0.22 L 3 L2 6X b 0.10 C A B 0.05 C 6 0.40 PITCH 4 e NOTE 3 1.07 DIMENSIONS: MILLIMETERS BOTTOM VIEW *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 NLU1GT04 PACKAGE DIMENSIONS ULLGA6 1.0x1.0, 0.35P CASE 613AD-01 ISSUE A PIN ONE REFERENCE 0.10 C ÉÉ ÉÉ ÉÉ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D E DIM A A1 b D E e L L1 TOP VIEW 0.05 C A 6X 0.05 C SEATING PLANE SIDE VIEW MOUNTING FOOTPRINT SOLDERMASK DEFINED* C A1 MILLIMETERS MIN MAX --0.40 0.00 0.05 0.12 0.22 1.00 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 5X 0.48 6X 0.22 e 5X L NOTE 4 3 1 1.18 L1 0.53 6 4 6X b 0.05 C 0.35 PITCH DIMENSIONS: MILLIMETERS 0.10 C A B BOTTOM VIEW 1 PKG OUTLINE *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NOTE 3 http://onsemi.com 6 NLU1GT04 PACKAGE DIMENSIONS ULLGA6 1.2x1.0, 0.4P CASE 613AE-01 ISSUE A PIN ONE REFERENCE 0.10 C ÉÉ ÉÉ ÉÉ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D E DIM A A1 b D E e L L1 TOP VIEW 0.05 C A 6X 0.05 C SEATING PLANE SIDE VIEW MOUNTING FOOTPRINT SOLDERMASK DEFINED* C A1 MILLIMETERS MIN MAX --0.40 0.00 0.05 0.15 0.25 1.20 BSC 1.00 BSC 0.40 BSC 0.25 0.35 0.35 0.45 5X 0.49 e 5X L NOTE 4 3 1 1.24 L1 0.53 6 6X 0.26 4 6X b 0.05 C 0.40 PITCH DIMENSIONS: MILLIMETERS 0.10 C A B BOTTOM VIEW 1 PKG OUTLINE *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NOTE 3 http://onsemi.com 7 NLU1GT04 PACKAGE DIMENSIONS ULLGA6 1.45x1.0, 0.5P CASE 613AF-01 ISSUE A PIN ONE REFERENCE 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D ÉÉÉ ÉÉÉ ÉÉÉ E DIM A A1 b D E e L L1 TOP VIEW 0.10 C 0.05 C MILLIMETERS MIN MAX --0.40 0.00 0.05 0.15 0.25 1.45 BSC 1.00 BSC 0.50 BSC 0.25 0.35 0.30 0.40 A 6X 0.05 C MOUNTING FOOTPRINT SOLDERMASK DEFINED* SEATING PLANE SIDE VIEW C A1 e 5X L 5X 0.49 NOTE 4 3 1 1.24 L1 0.53 6 6X 0.30 4 BOTTOM VIEW 6X b 0.10 C A B 0.05 C 1 PKG OUTLINE 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NOTE 3 MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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