NLU2G17 Dual Non-Inverting Schmitt-Trigger Buffer The NLU2G17 MiniGatet is an advanced high−speed CMOS dual non−inverting Schmitt−trigger buffer in ultra−small footprint. The NLU2G17 input and output structures provide protection when voltages up to 7.0 V are applied, regardless of the supply voltage. The NLU2G17 can be used to enhance noise immunity or to square up slowly changing waveforms. www.onsemi.com MARKING DIAGRAMS Features UDFN6 1.0 x 1.0 CASE 517BX High Speed: tPD = 4.0 ns (Typ) @ VCC = 5.0 V Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C Power Down Protection Provided on inputs Balanced Propagation Delays Overvoltage Tolerant (OVT) Input and Output Pins Ultra−Small Packages These are Pb−Free Devices UDFN6 1.2 x 1.0 CASE 517AA 6 OUT Y1 GND 2 5 VCC AM 1 R 1 M 1 UDFN6 1.45 x 1.0 CASE 517AQ IN A1 5 • • • • • • • M 1 ULLGA6 1.45 x 1.0 CASE 613AF AM 1 M IN A2 3 4 = Date Code OUT Y2 Figure 1. Pinout (Top View) ORDERING INFORMATION See detailed ordering and shipping information on page 4 of this data sheet. IN A1 1 OUT Y1 IN A2 1 OUT Y2 Figure 2. Logic Symbol PIN ASSIGNMENT 1 IN A1 2 GND 3 IN A2 4 OUT Y2 A Y 5 VCC 6 OUT Y1 L H L H © Semiconductor Components Industries, LLC, 2016 July, 2016 − Rev. 9 FUNCTION TABLE 1 Publication Order Number: NLU2G17/D NLU2G17 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage −0.5 to +7.0 V VIN DC Input Voltage −0.5 to +7.0 V DC Output Voltage −0.5 to +7.0 V VIN < GND −20 mA VOUT < GND ±20 mA VOUT Parameter IIK DC Input Diode Current IOK DC Output Diode Current IO DC Output Source/Sink Current ±12.5 mA ICC DC Supply Current Per Supply Pin ±25 mA IGND DC Ground Current per Ground Pin ±25 mA TSTG Storage Temperature Range −65 to +150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature Under Bias 150 °C MSL FR ILATCHUP Moisture Sensitivity Level 1 Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in ±500 Latchup Performance Above VCC and Below GND at 125°C (Note 2) mA Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow. 2. Tested to EIA / JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit 1.65 5.5 V VCC Positive DC Supply Voltage VIN Digital Input Voltage 0 5.5 V Output Voltage 0 5.5 V −55 +125 °C 0 0 No Limit No Limit ns/V VOUT TA Operating Free−Air Temperature Dt/DV Input Transition Rise or Fall Rate VCC = 3.3 V ± 0.3 V VCC = 5.0 V ± 0.5 V www.onsemi.com 2 NLU2G17 DC ELECTRICAL CHARACTERISTICS Symbol Parameter Conditions TA = 25 5C VCC (V) Min TA = +855C Typ Max 2.0 3.0 3.6 2.2 3.15 3.85 Min VT+ Positive Threshold Voltage 3.0 4.5 5.5 VT− Negative Threshold Voltage 3.0 4.5 5.5 0.9 1.35 1.65 1.5 2.3 2.9 1.65 2.46 3.05 0.9 1.35 1.65 VH Hysteresis Voltage 3.0 4.5 5.5 0.30 0.40 0.50 0.57 0.67 0.74 1.20 1.40 1.60 0.30 0.40 0.50 VOH Minimum High−Level Output Voltage 2.0 3.0 4.5 1.9 2.9 4.4 2.0 3.0 4.5 3.0 4.5 2.58 3.94 VOL Maximum Low−Level Output Voltage VIN w VT+MAX IOH = −50 mA VIN w VT+MAX IOH = −4 mA IOH = −8 mA VIN v VT−MIN IOL = 50 mA VIN v VT−MIN IOL = 4 mA IOL = 8 mA 2.0 3.0 4.5 0 0 0 Max TA = −555C to +1255C Min 2.2 3.15 3.85 Max Unit 2.2 3.15 3.85 V 0.9 1.35 1.65 1.20 1.40 1.60 0.30 0.40 0.50 1.9 2.9 4.4 1.9 2.9 4.4 2.48 3.80 2.34 3.66 V 1.20 1.40 1.60 V V 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 3.0 4.5 0.36 0.36 0.44 0.44 0.52 0.52 V IIN Input Leakage Current 0 v VIN v 5.5 V 0 to 5.5 ±0.1 ±1.0 ±1.0 mA ICC Quiescent Supply Current VIN = 5.5 V or GND 5.5 1.0 10 40 mA AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) Symbol tPLH, tPHL Parameter Propagation Delay, Input A to Output Y CIN Input Capacitance CPD Power Dissipation Capacitance (Note 3) VCC (V) Test Condition TA = 25 5C Min TA = +855C Typ Max Min TA = −555C to +1255C Max Min Max Unit ns 3.0 to 3.6 CL = 15 pF 7.0 12.8 1.0 15 1.0 17 CL = 50 pF 8.5 16.3 1.0 18.5 1.0 20.5 4.5 to 5.5 CL = 15 pF 4.0 8.6 1.0 10 1.0 11.5 CL = 50 pF 5.5 10.6 1.0 12 1.0 13.5 5.0 10 5.0 7.0 10 10 pF pF 3. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without load. Average operating current can be obtained by the equation ICC(OPR) = CPD • VCC • fin + ICC. CPD is used to determine the no−load dynamic power consumption: PD = CPD • VCC2 • fin + ICC • VCC. www.onsemi.com 3 NLU2G17 OUTPUT INPUT VCC A or B 50% RL GND tPLH CL tPHL Y 50% VCC A 1−MHz square input wave is recommended for propagation delay tests. Figure 4. Test Circuit Figure 3. Switching Waveforms VH VCC VT+ VT− VIN VCC VH VT+ VT− VIN GND GND VOH VOH VOUT Vout VOL VOL (a) A Schmitt−Trigger Squares Up Inputs With Slow Rise and Fall Times (b) A Schmitt−Trigger Offers Maximum Noise Immunity Figure 5. Typical Schmitt−Trigger Applications ORDERING INFORMATION Package Shipping† NLU2G17MUTCG UDFN6, 1.2 x 1.0, 0.4P (Pb−Free) 3000 / Tape & Reel NLU2G17AMUTCG UDFN6, 1.45 x 1.0, 0.5P (Pb−Free) 3000 / Tape & Reel NLU2G17CMUTCG UDFN6, 1.0 x 1.0, 0.35P (Pb−Free) 3000 / Tape & Reel NLU2G17AMX1TCG ULLGA6, 1.45 x 1.0, 0.5P (Pb−Free) 3000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 4 NLU2G17 PACKAGE DIMENSIONS UDFN6 1.0x1.0, 0.35P CASE 517BX ISSUE O PIN ONE REFERENCE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D ÉÉÉ ÉÉÉ ÉÉÉ E 0.10 C 2X 2X 0.10 C DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.12 0.22 1.00 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 0.05 C SIDE VIEW A1 C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE 5X e 5X 0.48 L 6X 0.22 3 1 L1 1.18 6 4 BOTTOM VIEW 6X b 0.10 M C A B 0.05 M C 0.53 1 PKG OUTLINE NOTE 3 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 5 NLU2G17 PACKAGE DIMENSIONS UDFN6, 1.2x1.0, 0.4P CASE 517AA ISSUE C EDGE OF PACKAGE PIN ONE REFERENCE 2X 0.10 C L1 ÉÉ ÉÉ E DETAIL A Bottom View (Optional) TOP VIEW 2X EXPOSED Cu 0.10 C (A3) 0.10 C A1 A 10X 0.08 C ÉÉÉ ÉÉÉ A3 DETAIL B Side View (Optional) 5X MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 1.20 BSC 1.00 BSC 0.40 BSC 0.30 0.40 0.00 0.15 0.40 0.50 MOUNTING FOOTPRINT* 6X 6X 0.42 C A1 DIM A A1 A3 b D E e L L1 L2 MOLD CMPD SEATING PLANE SIDE VIEW 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. A B D 0.22 L 3 L2 6X 0.40 PITCH b 0.10 C A B 0.05 C 6 4 e NOTE 3 1.07 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. BOTTOM VIEW www.onsemi.com 6 NLU2G17 PACKAGE DIMENSIONS UDFN6 1.45x1.0, 0.5P CASE 517AQ ISSUE O A B D L L L1 PIN ONE REFERENCE 0.10 C ÉÉÉ ÉÉÉ DETAIL A E OPTIONAL CONSTRUCTIONS DETAIL B MOLD CMPD DETAIL B 0.05 C 6X DIM A A1 A2 b D E e L L1 ÉÉ ÉÉ EXPOSED Cu TOP VIEW 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. OPTIONAL CONSTRUCTIONS A MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.07 REF 0.20 0.30 1.45 BSC 1.00 BSC 0.50 BSC 0.30 0.40 −−− 0.15 MOUNTING FOOTPRINT 0.05 C A1 A2 SIDE VIEW e 6X C 6X SEATING PLANE L 1.24 3 1 DETAIL A 6X 0.53 6 0.30 PACKAGE OUTLINE 4 BOTTOM VIEW 6X 0.50 PITCH DIMENSIONS: MILLIMETERS b 0.10 C A B 0.05 C 1 NOTE 3 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 7 NLU2G17 PACKAGE DIMENSIONS ULLGA6 1.45x1.0, 0.5P CASE 613AF ISSUE A PIN ONE REFERENCE 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D ÉÉÉ ÉÉÉ E DIM A A1 b D E e L L1 TOP VIEW 0.10 C 0.05 C A 6X 0.05 C MOUNTING FOOTPRINT SOLDERMASK DEFINED* SEATING PLANE SIDE VIEW 5X C A1 e 5X L MILLIMETERS MIN MAX −−− 0.40 0.00 0.05 0.15 0.25 1.45 BSC 1.00 BSC 0.50 BSC 0.25 0.35 0.30 0.40 0.49 NOTE 4 3 1 6X 0.30 1.24 L1 0.53 6 4 BOTTOM VIEW 6X b 0.10 C A B 0.05 C NOTE 3 1 PKG OUTLINE 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. 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