ON NLU3G14 Triple schmitt-trigger inverter Datasheet

NLU3G14
Triple Schmitt-Trigger
Inverter
The NLU3G14 MiniGatet is an advanced high−speed CMOS
triple Schmitt−trigger inverter in ultra−small footprint.
The NLU3G14 input and output structures provide protection when
voltages up to 7.0 V are applied, regardless of the supply voltage.
The NLU3G14 can be used to enhance noise immunity or to square
up slowly changing waveforms.
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MARKING
DIAGRAMS
Features
•
•
•
•
•
•
•
8
High Speed: tPD = 4.0 ns (Typ) @ VCC = 5.0 V
Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C
Power Down Protection Provided on inputs
Balanced Propagation Delays
Overvoltage Tolerant (OVT) Input and Output Pins
Ultra−Small Packages
These are Pb−Free Devices
1
IN A1
8
UDFN8
1.45 x 1.0
CASE 517BZ
1
UDFN8
1.6 x 1.0
CASE 517BY
1
XM
XM
VCC
OUT Y3
2
7
OUT Y1
IN A2
3
6
IN A3
4
5
GND
1
UXM
G
UDFN8
CASE 517AJ
UDFN8
1.95 x 1.0
CASE 517CA
XM
1
UX, A or LA = Specific Device Code
M = Date Code
G
= Pb−Free Package
OUT Y2
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
Figure 1. Pinout (Top View)
IN A1
1
OUT Y2
IN A2
1
OUT Y2
IN A3
1
OUT Y3
Figure 2. Logic Symbol
FUNCTION TABLE
PIN ASSIGNMENT
1
IN A1
2
OUT Y3
3
IN A2
4
GND
5
OUT Y2
A
Y
6
IN A3
L
H
H
L
7
OUT Y1
8
VCC
© Semiconductor Components Industries, LLC, 2016
July, 2016 − Rev. 4
1
Publication Order Number:
NLU3G14/D
NLU3G14
MAXIMUM RATINGS
Symbol
Value
Unit
VCC
DC Supply Voltage
−0.5 to +7.0
V
VIN
DC Input Voltage
−0.5 to +7.0
V
DC Output Voltage
−0.5 to +7.0
V
VIN < GND
−20
mA
VOUT < GND
±20
mA
VOUT
Parameter
IIK
DC Input Diode Current
IOK
DC Output Diode Current
IO
DC Output Source/Sink Current
±12.5
mA
ICC
DC Supply Current Per Supply Pin
±25
mA
IGND
DC Ground Current per Ground Pin
±25
mA
TSTG
Storage Temperature Range
−65 to +150
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature Under Bias
150
°C
MSL
FR
VESD
ILATCHUP
Moisture Sensitivity
Level 1
Flammability Rating Oxygen
Index: 28 to 34
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
Latchup Performance Above VCC and Below GND at 125°C (Note 5)
UL 94 V−0 @ 0.125 in
> 2000
> 200
N/A
V
±500
mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.
2. Tested to EIA / JESD22−A114−A.
3. Tested to EIA / JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA / JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
1.65
5.5
V
VCC
Positive DC Supply Voltage
VIN
Digital Input Voltage
0
5.5
V
Output Voltage
0
5.5
V
−55
+125
°C
0
0
No Limit
No Limit
ns/V
VOUT
TA
Operating Free−Air Temperature
Dt/DV
Input Transition Rise or Fall Rate
VCC = 3.3 V ± 0.3 V
VCC = 5.0 V ± 0.5 V
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2
NLU3G14
DC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
Conditions
TA = 25 5C
TA = +855C
VCC
(V)
Min
Typ
Max
Min
VT+
Positive
Threshold
Voltage
3.0
4.5
5.5
1.85
2.86
3.50
2.0
3.0
3.6
2.2
3.15
3.85
VT−
Negative
Threshold
Voltage
3.0
4.5
5.5
0.9
1.35
1.65
1.5
2.3
2.9
1.65
2.46
3.05
0.9
1.35
1.65
VH
Hysteresis
Voltage
3.0
4.5
5.5
0.30
0.40
0.50
0.57
0.67
0.74
1.20
1.40
1.60
0.30
0.40
0.50
VOH
Minimum
High−Level
Output
Voltage
2.0
3.0
4.5
1.9
2.9
4.4
2.0
3.0
4.5
3.0
4.5
2.58
3.94
VOL
Maximum
Low−Level
Output
Voltage
VIN v VT−MIN
IOH = −50 mA
VIN v VT−MIN
IOH = −4 mA
IOH = −8 mA
VIN w VT+MAX
IOL = 50 mA
VIN w VT+MAX
IOL = 4 mA
IOL = 8 mA
2.0
3.0
4.5
0
0
0
Max
TA = −555C to
+1255C
Min
2.2
3.15
3.85
Max
Unit
2.2
3.15
3.85
V
0.9
1.35
1.65
1.20
1.40
1.60
0.30
0.40
0.50
1.9
2.9
4.4
1.9
2.9
4.4
2.48
3.80
2.34
3.66
V
1.20
1.40
1.60
V
V
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
3.0
4.5
0.36
0.36
0.44
0.44
0.52
0.52
V
IIN
Input
Leakage
Current
0 v VIN v 5.5 V
0 to
5.5
±0.1
±1.0
±1.0
mA
ICC
Quiescent
Supply
Current
0 v VIN v VCC
5.5
1.0
10
40
mA
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns)
Symbol
tPLH,
tPHL
Parameter
Propagation Delay,
Input A to Output Y
CIN
Input Capacitance
CPD
Power Dissipation
Capacitance (Note 6)
VCC
(V)
Test
Condition
TA = 25 5C
Min
TA = +855C
Typ
Max
Min
TA = −555C to
+1255C
Max
Min
Max
Unit
ns
3.0 to
3.6
CL = 15 pF
7.0
12.8
1.0
15
1.0
17
CL = 50 pF
8.5
16.3
1.0
18.5
1.0
20.5
4.5 to
5.5
CL = 15 pF
4.0
8.6
1.0
10
1.0
11.5
CL = 50 pF
5.5
10.6
1.0
12
1.0
13.5
5.0
10
5.0
7.0
10
10
pF
pF
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without
load. Average operating current can be obtained by the equation ICC(OPR) = CPD • VCC • fin + ICC. CPD is used to determine the no−load
dynamic power consumption: PD = CPD • VCC2 • fin + ICC • VCC.
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3
NLU3G14
OUTPUT
INPUT
VCC
A or B
50%
CL*
GND
tPLH
Y
tPHL
50% VCC
*Includes all probe and jig capacitance.
A 1−MHz square input wave is recommended for propagation delay tests.
Figure 3. Switching Waveforms
Figure 4. Test Circuit
VH
VCC
VT+
VT−
VIN
VCC
VH
VT+
VT−
VIN
GND
GND
VOH
VOH
VOUT
Vout
VOL
VOL
(a) A Schmitt−Trigger Squares Up Inputs With Slow Rise and Fall Times
(b) A Schmitt−Trigger Offers Maximum Noise Immunity
Figure 5. Typical Schmitt−Trigger Applications
ORDERING INFORMATION
Package
Shipping†
UDFN8
(Pb−Free)
3000 / Tape & Reel
NLU3G14DMUTCG
UDFN8, 1.95 x 1.0, 0.5P
(Pb−Free)
3000 / Tape & Reel
NLU3G14EMUTCG
UDFN8, 1.6 x 1.0, 0.4P
(Pb−Free)
3000 / Tape & Reel
NLU3G14FMUTCG
UDFN8, 1.45 x 1.0, 0.35P
(Pb−Free)
3000 / Tape & Reel
Device
NLU3G14MUTAG
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
NLU3G14
PACKAGE DIMENSIONS
UDFN8 1.6x1.0, 0.4P
CASE 517BY
ISSUE O
PIN ONE
REFERENCE
0.10 C
2X
2X
ÉÉÉ
ÉÉÉ
ÉÉÉ
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
A B
D
E
DIM
A
A1
A3
b
D
E
e
L
L1
TOP VIEW
A3
0.05 C
A
0.05 C
A1
SIDE VIEW
C
RECOMMENDED
SOLDERING FOOTPRINT*
SEATING
PLANE
7X
e/2
0.49
e
1
7X
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.15
0.25
1.60 BSC
1.00 BSC
0.40 BSC
0.25
0.35
0.30
0.40
L
8X
0.26
4
L1
1.24
8
5
BOTTOM VIEW
8X
b
0.10
M
C A B
0.05
M
C
0.53
1
PKG
OUTLINE
0.40
PITCH
DIMENSIONS: MILLIMETERS
NOTE 3
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
5
NLU3G14
PACKAGE DIMENSIONS
UDFN8 1.45x1.0, 0.35P
CASE 517BZ
ISSUE O
PIN ONE
REFERENCE
0.10 C
2X
2X
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
A B
D
ÉÉ
ÉÉ
ÉÉ
E
DIM
A
A1
A3
b
D
E
e
L
L1
TOP VIEW
A3
0.05 C
A
0.05 C
A1
SIDE VIEW
C
RECOMMENDED
SOLDERING FOOTPRINT*
SEATING
PLANE
7X
0.48
e/2
e
1
7X
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.15
0.25
1.45 BSC
1.00 BSC
0.35 BSC
0.25
0.35
0.30
0.40
8X
0.22
L
4
L1
1.18
8
5
BOTTOM VIEW
8X
0.53
b
0.10
M
C A B
0.05
M
C
1
PKG
OUTLINE
NOTE 3
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
6
0.35
PITCH
NLU3G14
PACKAGE DIMENSIONS
UDFN8 1.95x1.0, 0.5P
CASE 517CA
ISSUE O
PIN ONE
REFERENCE
0.10 C
2X
2X
ÉÉÉ
ÉÉÉ
ÉÉÉ
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
A B
D
E
DIM
A
A1
A3
b
D
E
e
L
L1
TOP VIEW
A3
0.05 C
A
0.05 C
A1
SIDE VIEW
C
RECOMMENDED
SOLDERING FOOTPRINT*
SEATING
PLANE
7X
e/2
0.49
e
7X
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.15
0.25
1.95 BSC
1.00 BSC
0.50 BSC
0.25
0.35
0.30
0.40
L
8X
0.30
4
1
L1
1.24
8
5
BOTTOM VIEW
8X
b
0.10
M
C A B
0.05
M
C
0.54
NOTE 3
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
7
1
PKG
OUTLINE
NLU3G14
PACKAGE DIMENSIONS
UDFN8 1.8x1.2, 0.4P
CASE 517AJ
ISSUE O
PIN ONE
REFERENCE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 mm FROM TERMINAL TIP.
4. MOLD FLASH ALLOWED ON TERMINALS
ALONG EDGE OF PACKAGE. FLASH MAY
NOT EXCEED 0.03 ONTO BOTTOM
SURFACE OF TERMINALS.
5. DETAIL A SHOWS OPTIONAL
CONSTRUCTION FOR TERMINALS.
A B
D
0.10 C
ÉÉ
ÉÉ
L1
E
DETAIL A
NOTE 5
0.10 C
TOP VIEW
(A3)
0.05 C
DIM
A
A1
A3
b
b2
D
E
e
L
L1
L2
A
0.05 C
SIDE VIEW
A1
e/2
e
(b2)
C
DETAIL A
8X
1
SEATING
PLANE
L
4
MOUNTING FOOTPRINT
SOLDERMASK DEFINED
(L2)
8
5
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.127 REF
0.15
0.25
0.30 REF
1.80 BSC
1.20 BSC
0.40 BSC
0.45
0.55
0.00
0.03
0.40 REF
8X b
BOTTOM VIEW
8X
0.10
M
C A B
0.05
M
C
0.66
7X
0.22
NOTE 3
1.50
1
0.32
0.40 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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NLU3G14/D
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