ON NLV27WZ06DFT2G Dual inverter with open drain output Datasheet

NL27WZ06
Dual Inverter with Open
Drain Outputs
The NL27WZ06 is a high performance dual inverter with open drain
outputs operating from a 1.65 V to 5.5 V supply.
The internal circuit is composed of multiple stages, including an
open drain output. The open drain output provides the capability to set
the output switching level to a user selectable value with an external
resistor and power supply. The logic high output value is set by the
external power supply and can be less than, equal or greater than the
VCC power supply, provided the voltage supply is less than 5.5 V.
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MARKING
DIAGRAMS
6
Features
•
•
•
•
•
•
Extremely High Speed: tPD 2.4 ns (typical) at VCC = 5 V
Designed for 1.65 V to 5.5 V VCC Operation
Over Voltage Tolerant Inputs
LVTTL Compatible − Interface Capability With 5 V TTL Logic
with VCC = 3 V
LVCMOS Compatible
24 mA Output Sink Capability
Near Zero Static Supply Current Substantially Reduces System
Power Requirements
Chip Complexity: FET = 72; Equivalent Gate = 18
These Devices are Pb−Free and are RoHS Compliant
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
IN A1
GND
1
6
2
5
OUT Y1
VCC
1
M
•
•
•
•
SC−88
DF SUFFIX
CASE 419B
MF M G
G
1
TSOP−6
DT SUFFIX
CASE 318G
1
6
MF M G
G
1
MF
M
G
= Device Code
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may vary
depending upon manufacturing location.
PIN ASSIGNMENT
Pin
Function
1
IN A1
2
GND
3
IN A2
4
OUT Y2
5
VCC
6
OUT Y1
FUNCTION TABLE
IN A2
3
4
OUT Y2
Figure 1. Pinout (Top View)
IN A1
1
OUT Y1
IN A2
1
OUT Y2
A Input
Y Output
L
Z
H
L
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
Figure 2. Logic Symbol
© Semiconductor Components Industries, LLC, 2013
May, 2013 − Rev. 10
1
Publication Order Number:
NL27WZ06/D
NL27WZ06
MAXIMUM RATINGS
Symbol
VCC
Characteristics
DC Supply Voltage
Value
Units
−0.5 to +7.0
V
V
VI
DC Input Voltage
−0.5 ≤ VI ≤ +7.0
VO
DC Output Voltage
Output in Z or LOW State (Note 1)
−0.5 ≤ VO ≤ 7.0
IIK
DC Input Diode Current
IOK
DC Output Diode Current
IO
V
VI < GND
−50
mA
VO < GND
−50
mA
DC Output Sink Current
±50
mA
ICC
DC Supply Current Per Supply Pin
±100
mA
IGND
DC Ground Current Per Ground Pin
±100
mA
TSTG
Storage Temperature Range
−65 to +150
°C
PD
Power Dissipation in Still Air
SC−88, TSOP−6
200
qJA
Thermal Resistance
SC−88, TSOP−6
333
TL
Lead Temperature, 1 mm from Case for 10 s
260
°C
TJ
Junction Temperature under Bias
+150
°C
VESD
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
> 2000
> 200
N/A
ILatchup
Latchup Performance
Above VCC and Below GND at 85°C (Note 5)
mW
°C/W
V
mA
±500
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. IO absolute maximum rating must be observed.
2. Tested to EIA/JESD22−A114−A
3. Tested to EIA/JESD22−A115−A
4. Tested to JESD22−C101−A
5. Tested to EIA/JESD78
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Parameter
Supply Voltage
Operating
Data Retention Only
Min
Max
1.65
1.5
5.5
5.5
Units
V
VI
Input Voltage
0
5.5
V
VO
Output Voltage (Z or LOW State)
0
5.5
V
TA
Operating Free−Air Temperature
−55
+125
Dt/DV
Input Transition Rise or Fall Rate
VCC = 2.5 V ±0.2 V
VCC = 3.0 V ±0.3 V
VCC = 5.0 V ±0.5 V
0
0
0
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2
20
10
5
°C
ns/V
NL27WZ06
DC ELECTRICAL CHARACTERISTICS
TA = 25°C
VCC
−40°C 3 TA 3 85°C
(V)
Min
High−Level Input Voltage
1.65
2.3 to 5.5
0.75 VCC
0.70 VCC
VIL
Low−Level Input Voltage
1.65
2.3 to 5.5
0.25 VCC
0.30 VCC
0.25 VCC
0.30 VCC
V
ILKG
Z−State Output
Leakage Current
VIN = VIL
VOUT = VCC or GND
1.65 to 5.5
±5.0
±10.0
mA
VOL
Low−Level Output
Voltage
VIN = VIH
IOL = 100 mA
1.65 to 5.5
0.0
0.1
0.1
V
IOL = 3 mA
1.65
0.08
0.24
Symbol
Parameter
VIH
IIN
Condition
Input Leakage Current
Typ
Max
Min
Max
0.75 VCC
0.70 VCC
Units
V
IOL = 8 mA
2.3
0.22
0.3
0.3
IOL = 12 mA
2.7
0.22
0.4
0.4
IOL = 16 mA
3.0
0.28
0.4
0.4
IOL = 24 mA
3.0
0.38
0.55
0.55
IOL = 32 mA
4.5
0.42
0.55
0.55
VIN = 5.5 V or GND
0 to 5.5
±0.1
±1.0
mA
IOFF
Power Off
Leakage Current
VIN = 5.5 V or
VOUT = 5.5 V
0
1
10
mA
ICC
Quiescent Supply
Current
VIN = 5.5 V or GND
5.5
1
10
mA
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎ
ÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns; CL = 50 pF; RL = 500 W
TA = 25°C
Symbol
tPZL
tPLZ
Condition
VCC (V)
Min
Typ
Max
Min
Max
Units
RL = R1 = 5000 W, CL = 15 pF
1.8 ± 0.15
2.0
5.7
10.5
2.0
11.0
ns
RL = R1 = 500 W, CL = 50 pF
2.5 ± 0.20
0.8
3.0
3.6
0.8
4.1
RL = R1 = 500 W, CL = 50 pF
3.3 ± 0.30
0.8
2.4
3.2
0.8
3.7
RL = R1 = 500 W, CL = 50 pF
5.0 ± 0.50
0.5
2.4
3.0
0.5
3.5
RL = R1 = 5000 W, CL = 15 pF
1.8 ± 0.15
2.0
5.7
10.5
2.0
11.0
RL = R1 = 500 W, CL = 50 pF
2.5 ± 0.20
0.8
3.0
3.6
0.8
4.1
RL = R1 = 500 W, CL = 50 pF
3.3 ± 0.30
0.8
2.1
3.2
0.8
3.7
RL = R1 = 500 W, CL = 50 pF
5.0 ± 0.50
0.5
1.2
3.0
0.5
3.5
Parameter
Propagation Delay
(Figure 3 and 4)
Propagation Delay
(Figure 3 and 4)
−40°C 3 TA 3 85°C
ns
CAPACITIVE CHARACTERISTICS
Symbol
CIN
Parameter
Input Capacitance
COUT
Output Capacitance
CPD
Power Dissipation Capacitance (Note 6)
Condition
Typical
Units
VCC = 5.5 V, VI = 0 V or VCC
2.5
pF
VCC = 5.5 V, VI = 0 V or VCC
4
pF
10 MHz, VCC = 5.5 V, VI = 0 V or VCC
4
pF
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
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3
NL27WZ06
A
VCC
50%
tPZL
GND
tPLZ
HIGH
IMPEDANCE
50% VCC
Y
VOL +0.3 V
Figure 3. Switching Waveforms
VCC
R1
PULSE
GENERATOR
DUT
RT
CL
VCC x 2
RL
RT = ZOUT of pulse generator (typically 50 W)
Figure 4. Test Circuit
ORDERING INFORMATION
Package
Shipping†
NL27WZ06DFT2G
SC−88
(Pb−Free)
3000 / Tape & Reel
NLV27WZ06DFT2G*
SC−88
(Pb−Free)
3000 / Tape & Reel
NL27WZ06DTT1G
TSOP−6
(Pb−Free)
3000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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4
NL27WZ06
PACKAGE DIMENSIONS
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE W
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419B−01 OBSOLETE, NEW STANDARD 419B−02.
D
e
6
5
DIM
A
A1
A3
b
C
D
E
e
L
HE
4
HE
−E−
1
2
3
b 6 PL
0.2 (0.008)
M
E
M
MILLIMETERS
MIN
NOM MAX
0.80
0.95
1.10
0.00
0.05
0.10
0.20 REF
0.10
0.21
0.30
0.10
0.14
0.25
1.80
2.00
2.20
1.15
1.25
1.35
0.65 BSC
0.10
0.20
0.30
2.00
2.10
2.20
A3
C
A
A1
L
SOLDERING FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
INCHES
NOM MAX
0.037 0.043
0.002 0.004
0.008 REF
0.004 0.008 0.012
0.004 0.005 0.010
0.070 0.078 0.086
0.045 0.049 0.053
0.026 BSC
0.004 0.008 0.012
0.078 0.082 0.086
MIN
0.031
0.000
NL27WZ06
PACKAGE DIMENSIONS
TSOP−6
CASE 318G−02
ISSUE U
D
H
6
5
ÉÉ
E1
1
NOTE 5
2
L2
4
GAUGE
PLANE
E
3
L
b
DETAIL Z
e
0.05
M
A
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM
LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D
AND E1 ARE DETERMINED AT DATUM H.
5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.
SEATING
PLANE
DIM
A
A1
b
c
D
E
E1
e
L
L2
M
c
A1
DETAIL Z
MIN
0.90
0.01
0.25
0.10
2.90
2.50
1.30
0.85
0.20
0°
MILLIMETERS
NOM
MAX
1.00
1.10
0.06
0.10
0.38
0.50
0.18
0.26
3.00
3.10
2.75
3.00
1.50
1.70
0.95
1.05
0.40
0.60
0.25 BSC
10°
−
RECOMMENDED
SOLDERING FOOTPRINT*
6X
0.60
6X
3.20
0.95
0.95
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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NL27WZ06/D
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