ON NLV37WZ07USG Triple buffer with open drain output Datasheet

NL37WZ07
Triple Buffer with Open
Drain Outputs
The NL37WZ07 is a high performance triple buffer with open drain
outputs operating from a 1.65 V to 5.5 V supply.
The internal circuit is composed of multiple stages, including an
open drain output which provides the capability to set output
switching level. This allows the NL37WZ07 to be used to interface
5 V circuits to circuits of any voltage between VCC and 7 V using an
external resistor and power supply.
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MARKING
DIAGRAM
8
Features
•
•
•
•
•
•
•
•
•
•
Extremely High Speed: tPD 2.5 ns (typical) at VCC = 5 V
Designed for 1.65 V to 5.5 V VCC Operation
Overvoltage Tolerant Inputs
LVTTL Compatible − Interface Capability with 5 V TTL Logic with
VCC = 3 V
LVCMOS Compatible
24 mA Output Sink Capability @ 3.0 V
Near Zero Static Supply Current Substantially Reduces System
Power Requirements
Chip Complexity: FET = 72
These Devices are Pb−Free and are RoHS Compliant
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
IN A1
1
8
VCC
OUT Y3
2
7
OUT Y1
IN A2
3
6
IN A3
GND
4
5
OUT Y2
L7 MG
G
US8
US SUFFIX
CASE 493
L7
M
G
1
= Device Code
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending upon
manufacturing location.
PIN ASSIGNMENT
Pin
Function
1
IN A1
2
OUT Y3
3
IN A2
4
GND
5
OUT Y2
6
IN A3
7
OUT Y1
8
VCC
FUNCTION TABLE
A Input
Y Output
L
L
H
Z
ORDERING INFORMATION
Figure 1. Pinout
IN A1
1
OUT Y1
IN A2
1
OUT Y2
IN A3
1
OUT Y3
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
Figure 2. Logic Symbol
© Semiconductor Components Industries, LLC, 2012
April, 2012 − Rev. 8
1
Publication Order Number:
NL37WZ07/D
NL37WZ07
MAXIMUM RATINGS
Symbol
Value
Units
DC Supply Voltage
−0.5 to +7.0
V
VI
DC Input Voltage
−0.5 to +7.0
V
VO
DC Output Voltage
−0.5 to +7.0
V
IIK
DC Input Diode Current
VI < GND
−50
IOK
DC Output Diode Current
VO < GND
−50
IO
DC Output Sink Current
±50
mA
ICC
DC Supply Current per Supply Pin
±100
mA
IGND
DC Ground Current per Ground Pin
±100
mA
TSTG
Storage Temperature Range
VCC
Parameter
mA
mA
−65 to +150
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature under Bias
+150
°C
qJA
Thermal Resistance (Note 1)
250
°C/W
PD
Power Dissipation in Still Air at 85°C
250
mW
MSL
FR
VESD
Moisture Sensitivity
Level 1
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
V
> 2000
> 150
N/A
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
VCC
Supply Voltage
Operating
Data Retention Only
1.65
1.5
5.5
5.5
Units
V
VI
Input Voltage (Note 5)
0
5.5
V
VO
Output Voltage (HIGH or LOW State)
0
5.5
V
TA
Operating Free−Air Temperature
−55
+125
°C
Dt/DV
Input Transition Rise or Fall Rate
VCC = 2.5 V ±0.2 V
VCC = 3.0 V ±0.3 V
VCC = 5.0 V ±0.5 V
0
0
0
20
10
5
5. Unused inputs may not be left open. All inputs must be tied to a high− or low−logic input voltage level.
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2
ns/V
NL37WZ07
DC ELECTRICAL CHARACTERISTICS
VCC
Symbol
Parameter
VIH
TA = 25°C
−55°C 3 TA 3 125°C
(V)
Min
High−Level Input Voltage
1.65 to 1.95
2.3 to 5.5
0.75 VCC
0.7 VCC
VIL
Low−Level Input Voltage
1.65 to 1.95
2.3 to 5.5
0.25 VCC
0.3 VCC
0.25 VCC
0.3 VCC
V
ILKG
Z−State Output Leakage
Current
VIN = VIL
VOUT = VCC or GND
1.65 to 5.5
±5.0
±10.0
mA
VOL
Low−Level Output
Voltage
VIN = VIH or VIL
IOL = 100 mA
1.65 to 5.5
0.0
0.1
0.1
V
IOL = 4 mA
1.65
0.08
0.24
0.24
IOL = 8 mA
2.3
0.20
0.3
0.3
IOL = 12 mA
2.7
0.22
0.4
0.4
IOL = 16 mA
3.0
0.28
0.4
0.4
IOL = 24 mA
3.0
0.38
0.55
0.55
IOL = 32 mA
4.5
0.42
0.55
0.55
IIN
Input Leakage Current
Condition
Typ
Max
Min
Max
0.75 VCC
0.7 VCC
Units
V
VIN = 5.5 V or GND
0 to 5.5
±0.1
±1.0
mA
IOFF
Power Off
Leakage Current
VIN = 5.5 V or
VOUT = 5.5 V
0
1
10
mA
ICC
Quiescent Supply
Current
VIN = 5.5 V or GND
5.5
1
10
mA
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns; CL = 50 pF; RL = 500 W
TA = 25°C
Symbol
tPZL
tPLZ
Parameter
Propagation Delay
(Figure 3 and 4)
Propagation Delay
(Figure 3 and 4)
Min
Typ
−55°C 3 TA 3 125°C
Max
Min
Max
Units
7.8
ns
Condition
VCC (V)
RL = R1 = 500 W, CL = 50 pF
1.8 ± 0.15
RL = R1 = 500 W, CL = 50 pF
2.5 ± 0.2
1.2
3.7
5.8
1.2
6.4
RL = R1 = 500 W, CL = 50 pF
3.3 ± 0.3
0.8
2.9
4.4
0.8
4.8
RL = R1 = 500 W, CL = 50 pF
5.0 ± 0.5
0.5
2.3
3.5
0.5
3.9
RL = R1 = 500 W, CL = 50 pF
1.8 ± 0.15
RL = R1 = 500 W, CL = 50 pF
2.5 ± 0.2
1.2
2.8
5.8
1.2
6.4
RL = R1 = 500 W, CL = 50 pF
3.3 ± 0.3
0.8
2.1
4.4
0.8
4.8
RL = R1 = 500 W, CL = 50 pF
5.0 ± 0.5
0.5
1.4
3.5
0.5
3.9
7.8
7.8
7.8
ns
CAPACITIVE CHARACTERISTICS
Symbol
CIN
Parameter
Condition
Typical
Units
Input Capacitance
VCC = 5.5 V, VI = 0 V or VCC
2.5
pF
COUT
Output Capacitance
VCC = 5.5 V, VI = 0 V or VCC
4.0
pF
CPD
Power Dissipation Capacitance (Note 6)
10 MHz, VCC = 5.5 V, VI = 0 V or VCC
4.0
pF
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin ) ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin ) ICC VCC.
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3
NL37WZ07
A
VCC
50%
GND
tPZL
Y
tPLZ
50% VCC
HIGH
IMPEDANCE
VOL +0.3 V
Figure 3. Switching Waveforms
VCC
R1
PULSE
GENERATOR
DUT
RT
CL
VCC x 2
RL
RT = ZOUT of pulse generator (typically 50 W)
Figure 4. Test Circuit
DEVICE ORDERING INFORMATION
Package
Shipping†
NL37WZ07USG
US8
(Pb−Free)
3000 / Tape & Reel
NLV37WZ07USG*
US8
(Pb−Free)
3000 / Tape & Reel
Device Order Number
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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4
NL37WZ07
PACKAGE DIMENSIONS
US8
CASE 493−02
ISSUE B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION “A” DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURR.
MOLD FLASH. PROTRUSION AND GATE
BURR SHALL NOT EXCEED 0.140 MM
(0.0055”) PER SIDE.
4. DIMENSION “B” DOES NOT INCLUDE
INTER−LEAD FLASH OR PROTRUSION.
INTER−LEAD FLASH AND PROTRUSION
SHALL NOT E3XCEED 0.140 (0.0055”) PER
SIDE.
5. LEAD FINISH IS SOLDER PLATING WITH
THICKNESS OF 0.0076−0.0203 MM.
(300−800 “).
6. ALL TOLERANCE UNLESS OTHERWISE
SPECIFIED ±0.0508 (0.0002 “).
−X−
A
8
J
−Y−
5
DETAIL E
B
L
1
4
R
S
G
P
U
C
−T−
SEATING
PLANE
H
0.10 (0.004) T
K
D
N
0.10 (0.004)
M
R 0.10 TYP
T X Y
V
M
F
DETAIL E
MILLIMETERS
MIN
MAX
1.90
2.10
2.20
2.40
0.60
0.90
0.17
0.25
0.20
0.35
0.50 BSC
0.40 REF
0.10
0.18
0.00
0.10
3.00
3.20
0_
6_
5_
10 _
0.23
0.34
0.23
0.33
0.37
0.47
0.60
0.80
0.12 BSC
DIM
A
B
C
D
F
G
H
J
K
L
M
N
P
R
S
U
V
INCHES
MIN
MAX
0.075
0.083
0.087
0.094
0.024
0.035
0.007
0.010
0.008
0.014
0.020 BSC
0.016 REF
0.004
0.007
0.000
0.004
0.118
0.126
0_
6_
5_
10 _
0.010
0.013
0.009
0.013
0.015
0.019
0.024
0.031
0.005 BSC
SOLDERING FOOTPRINT*
3.8
0.15
0.50
0.0197
1.8
0.07
0.30
0.012
1.0
0.0394
SCALE 8:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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NL37WZ07/D
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