Yamaichi NP291-05658 Fine ball grid array (fbga, 0.75mm pitch) Datasheet

NP291 Series (Open Top) Fine Ball Grid Array (FBGA, 0.75mm Pitch)
Specifications
Part Number (Details)
1,000MW min. at 100V DC
Insulation Resistance:
Dielectric Withstanding Voltage: 100V AC for 1 minute
100m W max. at 10mA/20mV max.
Contact Resistance:
Operating Temperature Range: –55°C to +170°C
15g /pin (approx.)
Contact Force:
10,000 insertions
Mating Cycles:
NP291 - 048 05 - 3 -(G4-BF) - *
Materials and Finish
Series No.
No. of Contact Pins
Design Number
G = Contact Plating (Gold)
4 = Contact Style (180° TH)
Housing: Polyethersulphone (PES), glass-filled and
Polyetherimide (PEI), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
Contact Area - Au (0.3µm min. over Ni)
Terminal Area - Au (0.05µm min. over Ni)
Features
í Open top type sockets for FBGA packages
í Contacting structure to nip the sides of solder balls to lower
damages of coplanarity of solder balls
Positioning Pin Identification:
No Mark = Without Positioning Pins 'A' and 'B'
With Mark = For various Positioning Pin Options
(Please contact Yamaichi)
Outline IC Dimensions
Outline Socket Dimensions
C
A
NP291-03617-*
NP291-04805-3* AC-16001
NP291-04002-2 AC-11318
NP291-04002-2-G4-BF-*
NP291-04009-2-G4-BF-*
NP291-04013-*
NP291-04019
NP291-04414-*
NP291-04808-*AC-13177
NP291-04812 AC-15741
NP291-04812-2-* AC-14680
NP291-04805-1*
NP291-04805-3*
NP291-04805-4*
NP291-04805-5*
NP291-04805-8*-*
NP291-04808-2-G4-BF-*
NP291-04812-2-G4-BF-*
NP291-04842-*
NP291-04843-*
NP291-04848-*
NP291-04851-*-*
NP291-04852-*-*
NP291-04878
NP291-07210-2 AC-08904
NP291-05658-*-*
NP291-07210-2 AC-08338
NP291-05670
NP291-07210-2-G4-BF-*
NP291-07428-*
NP291-07773-*-*
NP291-28807-*
36
36
40
40
40
40
40
44
45
46
46
48
48
48
48
48
48
48
48
48
48
48
48
48
54
56
56
56
72
74
77
288
Pitch
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.75
Grid
Size
6x6
6x8
5x8
5x8
5x8
6x11
6x11
6x11
6x8
6x8
6x8
6x8
6x8
6x8
6x8
6x8
6x8
6x8
6x8
6x8
6x8
6x8
6x8
6x8
8x9
7x8
8x9
7x8
8x9
7x16
7x11
22x22
IC Dimensions
AxB
Socket Dimensions
CxD
6.5x10.50
6x8
7.628x9.228
5.74x7.48
5.857x7.508
5.55x9.10
6.15x10.65
7.75x14.35
7.45x7.55
6.50x7.91
6.50x7.91
9x15
6x8
7.20x11.65
6.20x13.15
6.94x14.40
7.58x9.81
6.50x7.91
7x7
6x8
8x10
7x11
9x12
7x8.50
7.67x16.37
7.25x12
7.67x16.37
10x6.5
7.67x16.37
6.80x12.40
7x10
18x18
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER
28.5x27.3
64x64
27.5x22.5
27.5x22.5
27.5x22.5
18x24
16x19
18x24
28.3x27.3
28.3x27.3
28.3x27.3
32x32
32x32
32x32
32x32
32x32
28.3x27.3
28.3x27.3
20x20
20x20
20x20
20x20
20x20
20x20
28.4x33.9
20x20
28.4x33.9
20x26
28.4x33.9
16.8x22.0
20x26
40x40
Test & Burn-In
Arrays
Pin
Count
Part Number
B
E
0.75
D
0.75
D-63
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