ON NSQA6V8AW5T2G Low capacitance quad array for esd protection Datasheet

NSQA6V8AW5T2 Series
Low Capacitance
Quad Array for
ESD Protection
This integrated transient voltage suppressor device (TVS) is
designed for applications requiring transient overvoltage protection. It
is intended for use in sensitive equipment such as computers, printers,
business machines, communication systems, medical equipment, and
other applications. Its integrated design provides very effective and
reliable protection for four separate lines using only one package.
These devices are ideal for situations where board space is at a
premium.
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1
5
2
3
Features
4
• ESD Protection: IEC61000−4−2: Level 4
MILSTD 883C − Method 3015−6: Class 3
Four Separate Unidirectional Configurations for Protection
Low Leakage Current < 1 A
Power Dissipation: 380 mW
Small SC−88A SMT Package
Low Capacitance
Pb−Free Package is Available
SC−88A/SOT−323
CASE 419A
MARKING DIAGRAM
Benefits
• Provides Protection for ESD Industry Standards: IEC 61000, HBM
• Protects the Line Against Transient Voltage Conditions in Either
•
•
5
6x
Direction
Minimize Power Consumption of the System
Minimize PCB Board Space
1
x
Typical Applications
•
•
•
•
•
4
Instrumentation Equipment
Serial and Parallel Ports
Microprocessor Based Equipment
Notebooks, Desktops, Servers
Cellular and Portable Equipment
D
2
D
•
•
•
•
•
•
3
= H for NSQA6V8AW5T2
X for NSQA12VAW5T2
= One Digit Date Code
ORDERING INFORMATION
Device
Package
Shipping†
NSQA6V8AW5T2
SC−88A
3000/Tape & Reel
NSQA6V8AW5T2G
NSQA12VAW5T2
NSQA12VAW5T2G
SC−88A 3000/Tape & Reel
(Pb−Free)
SC−88A
3000/Tape & Reel
SC−88A 3000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
 Semiconductor Components Industries, LLC, 2004
November, 2004 − Rev. 3
1
Publication Order Number:
NSQA6V8AW5T2/D
NSQA6V8AW5T2 Series
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Peak Power Dissipation
8 20 sec Double Exponential Waveform (Note 1)
PPK
20
W
Steady State Power − 1 Diode (Note 2)
PD
380
mW
327
3.05
°C/W
mW/°C
Thermal Resistance −
Junction−to−Ambient
Above 25°C, Derate
RJA
Operating Junction Temperature Range
TJ
−40 to +125
°C
Storage Temperature Range
Tstg
−55 to +150
°C
Lead Solder Temperature − Maximum 10 Seconds Duration
TL
260
°C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. Non−repetitive current pulse per Figure 1.
2. Only 1 diode under power. For all 4 diodes under power, PD will be 25%. Mounted on FR4 board with min pad.
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
NSQA6V8AW5T2
Characteristic
Symbol
Min
Typ
Max
Unit
VBR
6.4
6.8
7.1
V
Leakage Current (VRWM = 5.0 V)
IR
−
−
1.0
A
Clamping Voltage 1 (IPP = 1.6 A, 8 20 sec Waveform)
VC
−
−
13
V
Maximum Peak Pulse Current (8 20 sec Waveform)
IPP
−
−
1.6
A
Junction Capacitance − (VR = 0 V, f = 1 MHz)
− (VR = 3.0 V, f = 1 MHz)
CJ
−
−
12
6.7
15
9.5
pF
VBR
11.4
12.0
12.7
V
Leakage Current (VRWM = 9.0 V)
IR
−
−
0.05
A
Zener Impedence (IT = 5 mA)
ZZ
−
−
30
Clamping Voltage 1 (IPP = 0.9 A, 8 20 sec Waveform)
VC
−
−
23
V
Maximum Peak Pulse Current (8 20 sec Waveform)
IPP
−
−
0.9
A
Junction Capacitance − (VR = 0 V, f = 1 MHz)
CJ
−
−
15
pF
Breakdown Voltage (IT = 1 mA) (Note 3)
NSQA12VAW5T2
Breakdown Voltage (IT = 5 mA) (Note 3)
3. VBR is measured at pulse test current IT.
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2
NSQA6V8AW5T2 Series
110
100
% OF RATED POWER OR IPP
Ppk, PEAK SURGE POWER (W)
100
10
10
100
80
70
60
50
40
30
20
10
0
1
1
90
1000
50
75
100
Figure 2. Power Derating Curve
150
14
0.14
0.12
0.10
0.08
0.06
0.04
0.02
12
TA = 25°C
10
8
6V
6
4
12 V
2
0
0
−60 −40
0
20
40
60
80
100
0
3
4
Figure 3. Reverse Leakage versus
Temperature
Figure 4. Capacitance
70
60
HALF VALUE IRSM/2 @ 20 s
50
5
6
1
PULSE WIDTH (tP) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAY = 8 s
40
tP
20
2
BIAS VOLTAGE (V)
80
30
1
T, TEMPERATURE (°C)
PEAK VALUE IRSM @ 8 s
tr
90
−20
IF, FORWARD CURRENT (A)
100
0.1
0.01
10
0
125
Figure 1. Pulse Width
TYPICAL CAPACITANCE (pF)
1 MHz FREQUENCY
IR, REVERSE LEAKAGE (A)
25
TA, AMBIENT TEMPERATURE (°C)
0.16
% OF PEAK PULSE CURRENT
0
t, TIME (s)
TA = 25°C
0.001
0
20
40
60
0.6
80
0.8
1.0
1.2
1.4
t, TIME (s)
VF, FORWARD VOLTAGE (V)
Figure 5. 8 × 20 s Pulse Waveform
Figure 6. Forward Voltage
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1.6
1.8
NSQA6V8AW5T2 Series
PACKAGE DIMENSIONS
SC−88A/SOT−323
5−LEAD PACKAGE
CASE 419A−02
ISSUE G
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
G
5
4
−B−
S
1
2
3
D 5 PL
0.2 (0.008)
B
M
DIM
A
B
C
D
G
H
J
K
N
S
M
N
J
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
−−−
0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
−−−
0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
C
K
H
SOLDERING FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
mm inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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NSQA6V8AW5T2/D
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