ON NSR0240P2T5G Schottky barrier diode Datasheet

NSR0240P2T5G
Schottky Barrier Diode
Schottky barrier diodes are optimized for very low forward voltage
drop and low leakage current and are used in a wide range of dc−dc
converter, clamping and protection applications in portable devices.
NSR0240P2 in a SOD−923 miniature package enables designers to
meet the challenging task of achieving higher efficiency and meeting
reduced space requirements.
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Features
40 V SCHOTTKY
BARRIER DIODE
Very Low Forward Voltage Drop − 460 mV @ 100 mA
Low Reverse Current − 0.2 mA @ 25 V VR
200 mA of Continuous Forward Current
Power Dissipation of 240 mW with Minimum Trace
Very High Switching Speed
Low Capacitance − CT = 7 pF
This is a Pb−Free Device
1
CATHODE
Typical Applications
•
•
•
•
•
LCD and Keypad Backlighting
Camera Photo Flash
Buck and Boost dc−dc Converters
Reverse Voltage and Current Protection
Clamping & Protection
1
SOD−923
CASE 514AB
PLASTIC
2
ORDERING INFORMATION
MAXIMUM RATINGS
Symbol
Value
Unit
Reverse Voltage
VR
40
V
Forward Current (DC)
IF
200
mA
Non−Repetitive Peak Forward Surge Current
IFSM
2.0
A
ESD Rating:
ESD
Human Body Model
Machine Model
1
MG
G
P = Specific Device Code
M = Month Code
G = Pb−Free Package
(Note: Microdot may be in either location)
Mobile Handsets
MP3 Players
Digital Camera and Camcorders
Notebook PCs & PDAs
GPS
Rating
MARKING
DIAGRAM
2
Markets
•
•
•
•
•
2
ANODE
P
•
•
•
•
•
•
•
Device
Package
Shipping†
NSR0240P2T5G
SOD−923
2 mm Pitch
8000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Class 1C
Class A
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
© Semiconductor Components Industries, LLC, 2009
August, 2009 − Rev. 1
1
Publication Order Number:
NSR0240P2/D
NSR0240P2T5G
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance
Junction−to−Ambient (Note 1)
Total Power Dissipation @ TA = 25°C
Thermal Resistance
Junction−to−Ambient (Note 2)
Total Power Dissipation @ TA = 25°C
Symbol
Junction and Storage Temperature Range
Min
Typ
Max
Unit
RqJA
PD
520
240
°C/W
mW
RqJA
PD
175
710
°C/W
mW
TJ, Tstg
−55 to +150
°C
Typ
Max
Unit
0.2
0.8
0.55
5.0
0.365
0.50
0.60
1. Mounted onto a 4 in square FR−4 board 10 mm sq. 1 oz. Cu 0.06” thick single sided. Operating to steady state.
2. Mounted onto a 4 in square FR−4 board 1 in sq. 1 oz. Cu 0.06” thick single sided. Operating to steady state.
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Reverse Leakage
(VR = 25 V)
(VR = 40 V)
IR
Forward Voltage (IF = 10 mA)
(IF = 100 mA)
(IF = 200 mA)
VF
0.34
0.46
0.54
Total Capacitance
(VR = 1.0 V, f = 1 MHz)
CT
7.0
Ir, REVERSE CURRENT (mA)
100
125°C
10
150°C
1
0.1
0.01
0.001
V
pF
1000
85°C
0
25°C
0.1
−40°C
0.2
0.3
0.4
0.5
150°C
100 125°C
1
25°C
0.1
0.01
0.001
0.0001 −40°C
0.00001
0.6
85°C
10
0
5
10
15
20
25
VF, FORWARD VOLTAGE (V)
VR, REVERSE VOLTAGE (V)
Figure 1. Forward Voltage
Figure 2. Leakage Current
14
CT, TOTAL CAPACITANCE (pF)
IF, FORWARD CURRENT (mA)
1000
mA
12
TA = 25°C
10
8
6
4
2
0
0
5
10
15
20
25
30
35
VR, REVERSE VOLTAGE (V)
Figure 3. Total Capacitance
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2
40
45
30
35
NSR0240P2T5G
PACKAGE DIMENSIONS
SOD−923
CASE 514AB−01
ISSUE B
−X−
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
−Y−
E
1
b
2
2X
0.08 (0.0032) X Y
DIM
A
b
c
D
E
HE
L
A
c
L
HE
MILLIMETERS
MIN
NOM MAX
0.34
0.37
0.40
0.15
0.20
0.25
0.07
0.12
0.17
0.75
0.80
0.85
0.55
0.60
0.65
0.95
1.00
1.05
0.05
0.10
0.15
MIN
0.013
0.006
0.003
0.030
0.022
0.037
0.002
INCHES
NOM
0.015
0.008
0.005
0.031
0.024
0.039
0.004
MAX
0.016
0.010
0.007
0.033
0.026
0.041
0.006
SOLDERING FOOTPRINT*
0.90
0.40
0.30
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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NSR0240P2/D
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