ON NTSB30100CTG Very low forward voltage trench-based schottky rectifier Datasheet

NTST30100CT,
NTSB30100CT-1G,
NTSJ30100CTG,
NTSB30100CTG
Very Low Forward Voltage
Trench-based Schottky
Rectifier
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PIN CONNECTIONS
1
Exceptionally Low VF = 0.455 V at IF = 5 A
2, 4
3
Features
• Fine Lithography Trench−based Schottky Technology for Very Low
•
•
•
•
•
•
Forward Voltage and Low Leakage
Fast Switching with Exceptional Temperature Stability
Low Power Loss and Lower Operating Temperature
Higher Efficiency for Achieving Regulatory Compliance
Low Thermal Resistance
High Surge Capability
Pb−Free and Halide−Free Packages are Available
4
1
2
3
Typical Applications
ATX and Flat Panel Display
High Frequency and DC−DC Converters
Freewheeling and OR−ing diodes
Reverse Battery Protection
Instrumentation
1
Mechanical Characteristics
• Case: Epoxy, Molded
• Epoxy Meets Flammability Rating UL 94−0 @ 0.125 in
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• Lead Temperature for Soldering Purposes: 260°C Maximum for
12
3
I2PAK
CASE 418D
STYLE 3
4
• Switching Power Supplies including Notebook / Netbook Adapters,
•
•
•
•
TO−220AB
CASE 221A
STYLE 6
4
2
TO−220FP
CASE 221AH
D2PAK
CASE 418B
3
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
10 sec
© Semiconductor Components Industries, LLC, 2013
January, 2013 − Rev. 5
1
Publication Order Number:
NTST30100CT/D
NTST30100CT, NTSB30100CT−1G, NTSJ30100CTG, NTSB30100CTG
MAXIMUM RATINGS
Rating
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
(Rated VR, TC = 115°C)
Per device
Per diode
Peak Repetitive Forward Current
(Rated VR, Square Wave, 20 kHz, TC = 110°C)
Per device
Per diode
Nonrepetitive Peak Surge Current
(Surge applied at rated load conditions halfwave, single phase, 60 Hz)
Symbol
Value
Unit
VRRM
VRWM
VR
100
V
IF(AV)
A
30
15
IFRM
A
60
30
IFSM
160
A
TJ
−40 to +150
°C
Storage Temperature
Tstg
−40 to +150
°C
Voltage Rate of Change (Rated VR)
dv/dt
10,000
V/ms
Operating Junction Temperature
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
THERMAL CHARACTERISTICS
Rating
Symbol
NTST30100CTG,
NTSB30100CT−1G
NTSB30100CTG
NTSJ30100CTG
Unit
Maximum Thermal Resistance per Diode
Junction−to−Case
Junction−to−Ambient
RqJC
RqJA
2.5
70
1.14
46.6
4.09
105
°C/W
°C/W
ELECTRICAL CHARACTERISTICS (Per Leg unless otherwise noted)
Rating
Symbol
Maximum Instantaneous Forward Voltage (Note 1)
(IF = 5 A, TJ = 25°C)
(IF = 7.5 A, TJ = 25°C)
(IF = 15 A, TJ = 25°C)
vF
(IF = 5 A, TJ = 125°C)
(IF = 7.5 A, TJ = 125°C)
(IF = 15 A, TJ = 125°C)
Maximum Instantaneous Reverse Current (Note 1)
(VR = 70 V, TJ = 25°C)
(VR = 70 V, TJ = 125°C)
IR
(Rated dc Voltage, TJ = 25°C)
(Rated dc Voltage, TJ = 125°C)
Typ
Max
0.516
0.576
0.734
−
−
0.85
0.455
0.522
0.627
−
−
0.68
7.2
8.0
65
20
1. Pulse Test: Pulse Width = 300 ms, Duty Cycle v 2.0%
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2
Unit
V
mA
mA
500
35
mA
mA
NTST30100CT, NTSB30100CT−1G, NTSJ30100CTG, NTSB30100CTG
100
100
TA = 150°C
TA = 25°C
I R , REVERSE CURRENT (mA)
i F , INSTANTANEOUS FORWARD CURRENT (AMPS)
TYPICAL CHARACTERISITICS
10
TA = 125°C
1.0
0.1
TA = 150°C
10
TA = 125°C
1.0
0.1
TA = 25°C
0.01
0.001
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
20
30
CJ, JUNCTION CAPACITANCE (pF)
10000
TJ = 25°C
1000
100
10
0.1
1
10
VR, REVERSE VOLTAGE (VOLTS)
100
25
20
15
SQUARE WAVE
10
5
0
0
20
35
30
25
SQUARE WAVE
20
15
10
5
0
20
40
60
80
100
120
TC, CASE TEMPERATURE (°C)
PF(AV), AVERAGE FORWARD
POWER DISSIPATION (W)
IF(AV), AVERAGE FORWARD CURRENT (A)
40
60
80
100
120
TC, CASE TEMPERATURE (°C)
30
RqJC = 1.3°C/W
45
40
0
RqJC = 1.3°C/W
dc
140
Figure 4. Current Derating per Leg
60
dc
100
30
Figure 3. Typical Junction Capacitance
55
50
90
Figure 2. Typical Reverse Current
IF(AV), AVERAGE FORWARD CURRENT (A)
Figure 1. Typical Forward Voltage
50
70
40
60
80
VR, REVERSE VOLTAGE (VOLTS)
25
IPK/IAV = 5
IPK/IAV = 20
20
SQUARE
WAVE
15
10
dc
5
0
140
IPK/IAV = 10
TA = 150°C
0
2
4
6
8
10
12
14
16
IF(AV), AVERAGE FORWARD CURRENT (A)
Figure 5. Current Derating
Figure 6. Forward Power Dissipation
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3
18
NTST30100CT, NTSB30100CT−1G, NTSJ30100CTG, NTSB30100CTG
TYPICAL CHARACTERISITICS
R(t), TYPICAL TRANSIENT THERMAL
RESISTANCE (°C/W)
10
1 50% Duty Cycle
20%
10%
0.1 5%
2%
1%
0.01
0.000001
Single Pulse
0.00001
0.0001
0.001
0.01
0.1
t, Pulse Time (sec)
1
10
100
1000
Figure 7. Typical Transient Thermal Response, Junction−to−Case for NTST30100CT and NTSB30100CT−1G
R(t), TYPICAL TRANSIENT THERMAL
RESISTANCE (°C/W)
10
50% Duty Cycle
1
20%
0.1
10%
5%
2%
1%
0.01
Single Pulse
0.001
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
100
1000
t, Pulse Time (sec)
R(t), TYPICAL TRANSIENT THERMAL
RESISTANCE (°C/W)
Figure 8. Typical Transient Thermal Response, Junction−to−Case for NTSJ30100CTG
1
50% Duty Cycle
0.1 20%
10%
5%
2%
0.01 1%
0.000001
Single Pulse
0.00001
0.0001
0.001
0.01
0.1
t, Pulse Time (sec)
1
10
Figure 9. Typical Transient Thermal Response, Junction−to−Case for NTSB30100CTG
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4
NTST30100CT, NTSB30100CT−1G, NTSJ30100CTG, NTSB30100CTG
ORDERING INFORMATION
Package
Shipping
NTST30100CTG
Device
TO−220AB
(Pb−Free)
50 Units / Rail
NTSB30100CT−1G
I2PAK
(Pb−Free)
50 Units / Rail
NTSJ30100CTG
TO−220FP
(Halide−Free)
50 Units / Rail
NTSB30100CTG
D2PAK
(Pb−Free)
50 Units / Rail
NTSB30100CTT4G
D2PAK
(Pb−Free)
800 / Tape & Reel
MARKING DIAGRAMS
AYWW
TS30100Cx
AKA
AYWW
TS30100CG
AKA
TO−220AB
TO−220FP
A
Y
WW
AKA
x
G
H
AYWW
TS30100CG
AKA
I2PAK
= Assembly Location
= Year
= Work Week
= Polarity Designator
= G or H
= Pb−Free Package
= Halide−Free Package
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5
AYWW
TS30100CG
AKA
D2PAK
NTST30100CT, NTSB30100CT−1G, NTSJ30100CTG, NTSB30100CTG
PACKAGE DIMENSIONS
TO−220
CASE 221A−09
ISSUE AF
−T−
B
F
SEATING
PLANE
C
T
S
4
DIM
A
B
C
D
F
G
H
J
K
L
N
Q
R
S
T
U
V
Z
A
Q
U
1 2 3
H
K
Z
L
R
V
J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION Z DEFINES A ZONE WHERE ALL
BODY AND LEAD IRREGULARITIES ARE
ALLOWED.
G
D
N
INCHES
MIN
MAX
0.570
0.620
0.380
0.405
0.160
0.190
0.025
0.035
0.142
0.161
0.095
0.105
0.110
0.155
0.014
0.025
0.500
0.562
0.045
0.060
0.190
0.210
0.100
0.120
0.080
0.110
0.045
0.055
0.235
0.255
0.000
0.050
0.045
----0.080
STYLE 6:
PIN 1.
2.
3.
4.
MILLIMETERS
MIN
MAX
14.48
15.75
9.66
10.28
4.07
4.82
0.64
0.88
3.61
4.09
2.42
2.66
2.80
3.93
0.36
0.64
12.70
14.27
1.15
1.52
4.83
5.33
2.54
3.04
2.04
2.79
1.15
1.39
5.97
6.47
0.00
1.27
1.15
----2.04
ANODE
CATHODE
ANODE
CATHODE
I2PAK (TO−262)
CASE 418D
ISSUE D
C
E
V
−B−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
4
A
W
1
2
DIM
A
B
C
D
E
F
G
H
J
K
S
V
W
3
F
−T−
SEATING
PLANE
K
S
J
G
D 3 PL
0.13 (0.005) M T B
H
M
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6
INCHES
MIN
MAX
0.335
0.380
0.380
0.406
0.160
0.185
0.026
0.035
0.045
0.055
0.122 REF
0.100 BSC
0.094
0.110
0.013
0.025
0.500
0.562
0.390 REF
0.045
0.070
0.522
0.551
MILLIMETERS
MIN
MAX
8.51
9.65
9.65
10.31
4.06
4.70
0.66
0.89
1.14
1.40
3.10 REF
2.54 BSC
2.39
2.79
0.33
0.64
12.70
14.27
9.90 REF
1.14
1.78
13.25
14.00
NTST30100CT, NTSB30100CT−1G, NTSJ30100CTG, NTSB30100CTG
PACKAGE DIMENSIONS
TO−220 FULLPACK, 3−LEAD
CASE 221AH
ISSUE B
A
E
B
P
E/2
0.14
M
B A
M
SEATING
PLANE
A
H1
A1
4
Q
D
C
NOTE 3
1 2 3
L
L1
3X
3X
b2
c
b
0.25
M
B A
M
C
A2
e
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7
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. CONTOUR UNCONTROLLED IN THIS AREA.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH
AND GATE PROTRUSIONS. MOLD FLASH AND GATE
PROTRUSIONS NOT TO EXCEED 0.13 PER SIDE. THESE
DIMENSIONS ARE TO BE MEASURED AT OUTERMOST
EXTREME OF THE PLASTIC BODY.
5. DIMENSION b2 DOES NOT INCLUDE DAMBAR
PROTRUSION. LEAD WIDTH INCLUDING PROTRUSION
SHALL NOT EXCEED 2.00.
DIM
A
A1
A2
b
b2
c
D
E
e
H1
L
L1
P
Q
MILLIMETERS
MIN
MAX
4.30
4.70
2.50
2.90
2.50
2.70
0.54
0.84
1.10
1.40
0.49
0.79
14.70
15.30
9.70
10.30
2.54 BSC
6.70
7.10
12.70
14.73
--2.80
3.00
3.40
2.80
3.20
NTST30100CT, NTSB30100CT−1G, NTSJ30100CTG, NTSB30100CTG
PACKAGE DIMENSIONS
D2PAK 3
CASE 418B−04
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 418B−01 THRU 418B−03 OBSOLETE,
NEW STANDARD 418B−04.
C
E
V
W
−B−
4
1
2
A
S
3
−T−
SEATING
PLANE
K
J
G
D
W
H
3 PL
0.13 (0.005)
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
S
V
M
T B
VARIABLE
CONFIGURATION
ZONE
M
N
R
MILLIMETERS
MIN
MAX
8.64
9.65
9.65 10.29
4.06
4.83
0.51
0.89
1.14
1.40
7.87
8.89
2.54 BSC
2.03
2.79
0.46
0.64
2.29
2.79
1.32
1.83
7.11
8.13
5.00 REF
2.00 REF
0.99 REF
14.60 15.88
1.14
1.40
P
U
L
M
INCHES
MIN
MAX
0.340 0.380
0.380 0.405
0.160 0.190
0.020 0.035
0.045 0.055
0.310 0.350
0.100 BSC
0.080
0.110
0.018 0.025
0.090
0.110
0.052 0.072
0.280 0.320
0.197 REF
0.079 REF
0.039 REF
0.575 0.625
0.045 0.055
L
M
L
M
F
F
F
VIEW W−W
1
VIEW W−W
2
VIEW W−W
3
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NTST30100CT/D
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