ON NUF2220XV6T1 2 line emi filter with esd protection Datasheet

NUF2220XV6
2 Line EMI Filter with ESD
Protection
This device is a 2 line EMI filter array for wireless applications.
Greater than −20 dB attenuation is obtained at frequencies from
800 MHz to 2.4 GHz. It also offers ESD protection−clamping
transients from static discharges. ESD protection is provided across all
capacitors.
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Features
• EMI Filtering and ESD Protection
• Integration of 10 Discrete Components
• Compliance with IEC61000−4−2 (Level 4)
Pin 6
Output(1)
Pin 5
GND
Pin 4
Output(2)
Pin 1
Input(1)
Pin 2
GND
Pin 3
Input(2)
> 8.0 kV (Contact)
• SOT−563 Package
• Moisture Sensitivity Level 1
• ESD Ratings:
Machine Model = C
•
Human Body Model = 3B
These are Pb−Free Devices
Benefits
MARKING
DIAGRAM
• Reduces EMI/RFI Emissions on a Data Line
• Integrated Solution Offers Cost and Space Savings in a
•
•
SOT−563 Package
Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass
Filter Response
Integrated Solution Improves System Reliability
Applications
•
•
•
•
•
EMI Filtering and ESD Protection for Data Lines
Wireless Phones
PDAs and Handheld Products
Notebook Computers
LCD Displays
SOT−563
CASE 463A
6
1
1
20 M G
G
20 = Specific Device Code
M = Month Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Package
Shipping †
SOT−563
4000/Tape & Reel
NUF2220XV6T1G SOT−563
4000/Tape & Reel
Device
NUF2220XV6T1
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2005
July, 2005 − Rev.2
1
Publication Order Number:
NUF2220XV6/D
NUF2220XV6
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter
Symbol
ESD Discharge IEC61000−4−2
Value
VPP
Unit
kV
Air Discharge
Contact Discharge
15
8.0
Steady−State Power per Resistor
PR
mW
Steady−State Power per Package
PT
mW
Operating Temperature Range
TOP
−40 to 85
°C
Storage Temperature Range
TSTG
−55 to 150
°C
TL
260
°C
Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 seconds)
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
Parameter
Maximum Reverse Working Voltage
Breakdown Voltage
Symbol
Test Conditions
Min
Typ
VRWM
Unit
5.0
V
1.0
A
115
VBR
IR = 1.0 mA
Leakage Current
IR
VRWM = 3.0 V
Resistance
RA
IR = 20 mA
Capacitance (Notes 1 and 2)
Cd
VR = 2.5 V, f = 1.0 MHz
7.0
pF
Cut−Off Frequency (Note 3)
f3dB
Above this frequency,
appreciable attenuation occurs
275
MHz
1. Measured at 25°C, VR = 2.5 V, f = 1.0 MHz.
2. Total line capacitance is 2 times the Diode Capacitance (Cd).
3. 50 source and 50 load termination.
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2
6.0
Max
85
7.0
100
V
NUF2220XV6
2
NORMALIZED CAPACITANCE
0
−5
−15
−20
−25
−30
1.E+06
1
0.5
0
1.E+07
1.E+08
1.E+09
FREQUENCY (MHz)
1.E+10
0
1
2
108
106
104
102
100
98
96
94
92
−20
4
Figure 2. Typical Capacitance vs.
Reverse Biased Voltage
(Normalized Capacitance, Cd @ 2.5 V)
110
90
−40
3
REVERSE VOLTAGE (V)
Figure 1. Insertion Loss Characteristic
(50 W Source and 50 W Lead Termination)
RESISTANCE ()
S21 (dB)
−10
1.5
0
20
40
60
80
TEMPERATURE (°C)
Figure 3. Typical Resistance over Temperature
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3
5
NUF2220XV6
PACKAGE DIMENSIONS
SOT−563, 6 LEAD
CASE 463A−01
ISSUE F
D
−X−
6
5
1
e
2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE MATERIAL.
A
L
4
3
E
−Y−
DIM
A
b
C
D
E
e
L
HE
HE
b 65 PL
0.08 (0.003)
C
M
X Y
MILLIMETERS
MIN
NOM MAX
0.50
0.55
0.60
0.17
0.22
0.27
0.08
0.12
0.18
1.50
1.60
1.70
1.10
1.20
1.30
0.5 BSC
0.10
0.20
0.30
1.50
1.60
1.70
INCHES
NOM MAX
0.021 0.023
0.009 0.011
0.005 0.007
0.062 0.066
0.047 0.051
0.02 BSC
0.004 0.008 0.012
0.059 0.062 0.066
MIN
0.020
0.007
0.003
0.059
0.043
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.35
0.0531
1.0
0.0394
0.5
0.5
0.0197 0.0197
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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Phone: 81−3−5773−3850
Email: [email protected]
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Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
NUF2220XV6/D
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