SMT POWER INDUCTORS For Use with Volterra's Chipset Two package sizes Height: .125" and .177" Max Footprint: .276" x .250" and .340" x .250" Max Current Range: up to 15 Arms Typical Energy Storage Density: 1450 µJ/in3 Frequency Range: 300 kHz to 2 MHz Electrical Specifications @ 25°C — Operating Temperature -40°C to 125°C Part Number Inductance @Irated (nH ± 20%) Irated (ADC) P1681T P2005T P2004T 95 142.5 190 15 15 15 DCR Ω) (mΩ 1 Typical .31 .45 .45 Max .39 .56 .56 Inductance @0ADC (nH ± 20%) 100 150 200 Saturation Current 2 (A) -40°C 18.2 18.2 17 25°C 18 18 16.8 125°C 16.2 16.2 15.12 Heating Current 3 (A) Trise Factor K0 4 (cm2) 15 15 15 1.0032 2.2458 2.2458 P2004T/P2005T P1681T .130 3,30 .250 MAX 6,35 P2004/5T Date Code Country of Origin (Volta 2) .010 0,25 2X.065 1,65 .110 2,80 .250 MAX 6,35 .177 MAX 4,50 .125 MAX 3,18 .010 0,25 Factor K2 .07381 .05961 .07949 .340 MAX 8,64 .276 MAX 7,01 Date Code Country of Origin Factor K1 .00319 .00638 .00638 Schematic Mechanicals P1681T (Volta 1) Core Loss 4 P1681T P2004T & P2005T Weight ................0.464 grams ................0.945 grams Tape & Reel.............1500/reel .....................1000/reel 2X.079 2,01 .150 3,81 .135 3,43 .100 2,54 .150 3,81 .280 7,11 .350 8,89 SUGGESTED PAD LAYOUT SUGGESTED PAD LAYOUT Dimensions: Inches mm Unless otherwise specified, all tolerances are ± .010 0,25 US 858 674 8100 • UK 44 1483 401 700 • France 33 3 84 35 04 04 • Singapore 65 287 8998 • Taiwan 886 2 2698 0228 • Hong Kong 852 2788 6588 • http://www.pulseeng.com PC500.B (5/02) 28 SMT POWER INDUCTORS For Use with Volterra's Chipset Notes from Tables 1. The rated current as listed is either the saturation current or the heating current depending on which value is lower. 2. The saturation current is the current which causes the inductance to drop by 10% at the stated ambient temperatures (-40°C, 25°C, 125°C). This current is determined by placing the component in the specified ambient environment and applying a short duration pulse current (to eliminate self-heating effects) to the component. 3. The heating current is the dc current which causes the temperature of the part to increase by approximately 30°C. This current is determined by mounting the component on a PCB with .25" wide, 3 oz. equivalent copper traces, and applying the current to the device for 30 minutes. 4. In high volt*time applications, additional heating in the component can occur due to core losses in the inductor which may neccessitate derating the current in order to limit the temperature rise of the component. In order to determine the approximate total losses (or temperature rise) for a given application both copper losses and core losses should be taken into account. Estimated Temperature Rise: .833 Trise = Coreloss (mW) + DCRloss (mW) (°C) K0 Coreloss = K1 * (Fsw(kHz))1.6688 * (K2 * dI)2.17 (mW) DCRloss = Irms2 * DCR(mΩ) (mW) Irms = IDC2 + dI 2 ½ (Arms) 2 Fsw(kHz) = switching frequency (kHz) dI = delta I across the component (A) The temperature of the component (ambient temperature + temperature rise) should be within the listed operating temperature range. Inductance vs Current Characteristics Percentage of Initial Inductance P2 P1 120 P3 100 80 60 40 20 0 0 0.2 0.4 0.6 0.8 1.0 Normalized IDC 1.2 1.4 1.6 1.8 P1 - Initial Inductance, Lo (.1Vrms, 1MHz, 0ADC, 25C) P2 - Inductance (typically 95% Lo) at Rated IDC. P3 - Inductance (typically 90% Lo) at Ipk. Normalized Inductance US 858 674 8100 • UK 44 1483 401 700 • France 33 3 84 35 04 04 • Singapore 65 287 8998 • Taiwan 886 2 2698 0228 • Hong Kong 852 2788 6588 • http://www.pulseeng.com 29 PC500.B (5/02)