PREPARED APPROVED BY: DATE: BY: DATE: 1 ELECTRONIC COMPONENTS GROUP SHARP CORPORATION I I SPECIFICATION DEVICE SPEC. No. I SPECIFICATION FOR Business ED-97123A REPRESENTATIVE DMSION OPTO-ELECTRONIC dealing DEVICES name PHOTOCOUPLER MODEL No. PC3H7 1. These Please specification sheets include do not reproduce or cause 2. When using this product, please observe the absolute maximum ratings and the instructions in these specification sheets, as well as the precautions mentioned below. Sharp assumes for any damage resulting from use of the product which does not comply with the absolute and the instructions included in these specification sheets, and the precautions mentioned (Precautions) (1) This l product materials protected anyone to reproduce is designed OA equipment l for use in the Audio * Telecommunication visual equipment under them following copyright without equipment application areas * Home appliances CTerminal) * Measuring machines * Computers i * Tooling If the use of the product in the above application (2) or (3). please be sure to observe the precautions (2) - Traffic signals [ * Other (3) (4) 3. Please safety control and safety * Gas leakage equipment equipment sensor equipment [ * Nuclear power * Telecommunication control equipment CUSTOMER’S and consult APPROVAL with a Sharp sales train, * Rescue require automobile trunk for any equipment high questions DATE PRESENTED BY reliability 1 1 lines) if there reliability and etc.) and security extremely equipment (for * Medical equipment representative 1 redundant design considering should b-e taken to ensure which demands high reliability Please contact and consult with a Sharp sales representative regarding interpretation of the above three paragraphs. contact for use outlined no responsibility maximum ratings below. : equipment (aircraft, breakers Please do not use this product for equipment which and safety in function and precision, such as ; . Space (“Sharp”). areas is for equipment listed in paragraphs given in those respective paragraphs. Appropriate measures, such as fail-safe design and the safety design of the overall system and equipment, and safety when this product is used for equipment safety in function and precision, such as : * Transportation of Sharp Corporation Sharp’s consent. are any about questions this product. c-yf I ) L \ ‘h T. MatsumLua. DATE Department Engineering Opto-Electronic BY ELECOM Group SHARP CORPORATION General Manager Dept. ,I1 Devices Div. of DN. ED-97123A SHARP CORPORATION MODEL 1 September No. PC3H7 1. Application This specification applies to the outline and characteristics Model No. PC3H7. of photocoupler; 2. Outline Refer to the attached drawing No. CY8375K02. 3. Ratings and characteristics Refer to the attached sheet, page 4 to 6. 4. Reliability Refer to the attached sheet, page 7. 5. Incoming inspection Refer to the attached sheet, page 8. 6. Supplement 6.1 Isolation voltage shall be measured in the foIlowing method. (1) Short between anode and cathode on the primary side and between collector and emitter on the secondary side. (2) The dielectric withstand tester with zero-cross circuit shaIl be used. (3) The wave form of applied voltage shall be a sine wave. 6.2 This product is not designed against irradiation. This product is assembled with electrical input and output. This product incorporates non-coherent light emitting diode. 6.3 Packaging specifications Refer to the attached sheet, page 9 to 11. 30, 1998 PAG E l/11 SHARP CORPORATION ED-97123A MODEL 1September 30, 199( No. PAGE PC3H7 Collector current (Ic) Delivery rank table (,,G” mark indicates business dealing name of ordered product) 6.4 6.5 ODS materials This product shall not contain the following materials. Also, the following materials shall not be used in the production for this product. Materials 6.6 Brominated for ODS flame : CFC,, Halon, Carbon 1.1.1 -Trichloroethane process tetrachloride. (Methylchloroform) retardants Speclf?c bromlnated flame retardants such as the PBBO, and PBB, are not used in this device at all. 7. Notes Refer to the attached sheet- 1- 1, 2. 2/11 SHARP CORPORATION ED-97123A MODEL No. 1 September 30, 199f PAG E PC3H7 3/11 2. Outline Date code Rankmark Anode mark Pin Nos. and internal connection diagram ll I 4. Emitter Collector \ 4-to. 0.2 2 0 0 Cathode Anode Epoxy resin Product mass : Approx. 0.05g *1 ) 2 -digit number shall be marked according to DIN standard. *21 Dimensions in parenthesis are shown for reference. *3) Marking is laser marking UNIT: l/l Name Drawing No. mm PC3H7 Outline Dimensions (Business dealing name : PC3H71 CY8375K02 SHARP CORPORATION ED-97 MODEL 123A 1 September 30, 199( No. PAG E PC3H7 4/11 3. Ratings and characteristics 3.1 Absolute maximum ratings Ta=25% VEC0 6 V Collector current Ic 50 mA *l Collector power dissipation PC 150 mW *l Total power dissipation Ptot 170 mW Operating temperature Topr -30 to +lOO “C Storage temperature Tstg -40 to +125 “C *3 Isolation voltage vi.50 2.5 kVrms l 4 Soldering temperature Tsol 260 “C Emitter-collector voltage output *l The derating factors of absolute maximum ratings due to ambient temperature are shown in Fig. 1 to 4. *2 Pulse widths100 ps, Duty ratio : 0.001 (Refer to Fig. 5) *3 AC for 1 min. 40 to 6O%RH, f=GOHz *4 ForlOs SHARP CORPORATlON ED-97123A MODEL 1 September No. PC3H7 3.2 Electra-optical 30. 1998 PAGE 5/11 characteristics Ta=25C output Collector-emitter breakdown voltage Emitter-collector breakdown voltage Collector current Transfer charac terlstics IF=0 BvECO Ic Collector-emitter saturation voltage V CEbat) Isolation resistance * Rlso I,=10 /LA, I,=0 I,=lmA, vc,=5v 6 - - V 0.2 - 4 mA 0.1 0.2 v 10” - Q 0.6 1.0 pF 4 18 /IS 3 18 ps 1,=2omA Ic=lmA DC500V 40 to 6O%RH Floating capacitance cf v=o, f=lMHz Response time (Rise) tr Response time (Fall) tf vc,=2v Ic=2mA R,=lOO R 5XlO’O SHflRP CORPORATION (Fig. 1) Forward ambient (Fig. 2) Diode power dissipation current vs. temperature vs. ambient temperature 50 2 CT. 4o 3i2 30 2 e 2o EE 10 0 u -30 0 25 55 75 Ambient temperature 100 -30 125 2ool+l+l+i 3 g 3 200 150 8 F: 170 150 100 & 8 100 50 g& 50 0 ;ii 5 c- -30 0 25 50 75 Ambient temperature 2 125 Ta ( “C) 01111111 -30 0 75 25 50 75 Ambient temperature (Fig. 5) Peak forward current vs. duty ratio Pulse widths100 Ta=25”C Duty ratio 55 100 125 Ta ( “C1 (Fig. 4) Total power dissipation vs. ambient temperature g 100 25 Ambient temperature Ta (“C) (Fig. 31 Collector power dissipation vs. ambient temperature 5 0 p!s 100 Ta ( ‘C1 125 SHARP CORPORATION ED-97123A MODEL 1 September No. 30, 199; PAGE PC3H7 7/ 1 I 4. Reliability The reliability of products items listed below. Confidence level : 90% LTPD: 10%/20% shall satis@ Test Conditions Test Items Failure ‘1 Solderability I I 230%, 5s I 260%, 10 s v,>ux Terminal strength (Bending) *4 Weight : 1N 1 time/each terminal I,>UX2 Mechanical 15000m/s2, 0.5ms 3 times/ tX, tY, +Z direction Soldering *2 Judgement Criteria heat *3 1.2 n=ll, C=O I I n=ll, C=O I EEO >UX2 Variable vibration shock Ic <LXO.7 100 to 2000 to 1ooHz/4min 200m/s2 4 times/ X, Y, 2 direction frequency Temperature cycling 1 cycle -40 “C to + 125C (30mi.n) (30mir-i) 20 cycles test High temp. and high humidity storage +85%, V CE(sat) High temp. storage I +125’C, Low temp. storage I -40-C, Operation life 500h lOOOh 1OOOh ’ *2 n=22 ,C=O U 85%RH, > ux Upper specification limit L : Lower specification limit *1 Test method, conforms to JIS C 7021. *2 Solder shall adhere at the area of 95% or more of immersed portion of lead, and pin hole or other holes shall not be concentrated on one portion. *3 The lead pm depth dipped into solder shall be 0.2mm away from the root of lead pins. *4 Terminal bending d irection is shown below. 90’ 90° Weight : IN n=22,C=O n=22,C=O n=22 ,C=O 1,=5OmA, Ptot= 170mW Ta=25”C, 1OOOh 3 Y- n=22 ,C=O 0.2mm or more SHARP CORPORATION MODEL No. PAG E PC3H7 5. Incoming inspection 5.1 Inspection items (1) Electrical characteristics V,, I,, I,, , Vc,,st,, Ic, Riso, Viso (2) Appearance 5.2 Sampling method and Inspection level A single sampling plan, normal inspection level II based on IS0 2859 is applied. The AQL according to the inspection items are shown below. Minor defect Appearance defect except the above mentioned. 8/11 SHARP CORPORATION ED-97123A MODEL 1September 30, 1998 No. 1 PAGE PC3H7 6.3 Package 6.3.1 9/11 specifications Taping conditions (11 Tape structure and Dimensions The tape shall have a structure the carrier tape. (2) Reel structure (Refer to the attached in which and Dimensions (31 Direction of product insertion Product direction in carrier hole side on the tape. Page 10) a cover tape is sealed heat-pressed (Refer to the attached The taping reel shall be of plastic with as shown in the attached drawing. sheet, sheet, on Page 11) its dimensions (Refer to the attached tape shall direct sheet, Page 11) to the anode mark at the (4) Joint of tape The cover tape and carrier tape in one reel shall be jointless. (5) The way to repair taped failure The way to repair taped failure after replacing to good devices, 6.3.2 Adhesiveness l 6.3.3 6.3.4 of cover tape method Wind the tape back on the reel so that the cover tape will be outside the tape. Attach more than 20cm of blank tape to the trailer and the leader of the tape and 6.x the both ends with adhesive tape. One reel shall contain 3OOOpcs. The outer packaging * Model No. Storage l 6.3.6 and quantity Marking l 6.3.5 devices cut a bottom of carrier tape with a cutter, and the cut portion shall be sealed with adhesive tape. The exfoliation force between carrier tape and cover tape shall be 0.2N to 0.7N for the angle from 160’ to 180’ . Rolling l devices of pieces delivered with following * Production information. date condition Taped products shall be stored at the temperature 5 to 30°C and the humidities lower than 7O%RH. Safety protection l * Number case shall be marked during shipping There shall be no deformation of component characteristics due to shipping. or degradation of electrical SHARP CORPORFITION ED-97123A MODEL No. 1 September PC3H7 Carrier tape structure lO/ll and Dimensions F _ G D E (_.-.-.Q&.-Q I /-T C -.-.?#i&) .-.-.-.@ .-.-.-.-6 -.-.-.-.& i -I- 1 / A K to.3 null 12.0 5Omax . k-o.1 5.5 to.1 1.75 co.1 8.0 to.1 K. +O.l -0.0 mm + 1.5 fO.1 7.5 f0.05 0.3 ko.1 2.3 to.1 3.1 to. 4.0 2.0 307 1998 PAGE L +O.l -0.0 p 1.6 1 SHARP CORPORATION ED-97123A MODEL 1 September No. PC3H7 Reel structure ll/ll and Dimensions a Check a mm Direction 330 of product b 13.5t1.5 C 1OOt1 word d 13t0.5 e 23+1 f 2.0C0.5 g 2.0 kO.5 insertion Pull-out 30, 199 PAGE direction SHARP CORPORATION ED-97123A MODEL 1September 30. 1998 No. PC3H7 1 PAGE Attach I Precautions for Photocouplers 1 For cleaning (1) Solvent cleaning : Solvent temperature 45°C or less Immersion for 3 min or less (2) Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs by cleaning bath size, ultrasonic power output, cleaning time, PWB sire or device mounting condition etc. Please test it in actual using condition and confirm that doesn’t occur any defect before starting the ultrasonic cleaning. (31 Applicable solvent : Ethyl alcohol, Methyl alcohol, Isopropyl alcohol In case when the other solvent is used, there are cases that the packaging resin is eroded. Please use the other solvent after thorough confirmation is performed in actual using condition. 2. The LED used in the Photocoupler generally decreases the light emission power by operation. In case of long operation time, please design the circuit with considering the degradation of the light emission power of the LED. (50%/5years) I ED-97123A MODEL No. SHARP CORPORATION 1 September PC3H7 3. Precautions for Soldering ( 11 If solder reflow Photocouplers : It is recommended that only one soldering be done at the temperature and the time within the temperature profile as shown in the figure below. 230°C 25C Since, influence to the device is different according to reflow equipment and its condition, please use the device after confirming no damage in the actual using condition. (2 1 Other precautions An inii-ared lamp used to heat up for soldering may cause a localized temperature rise in the resin. So keep the package temperature within that specified in Item (1). Also avoid immersing the resin part in the solder. 30. 1998 PAGE Attach sheet- l-2