INTEGRATED CIRCUITS DATA SHEET PCA153X series 32 kHz clock circuit Product specification Supersedes data of October 1988 File under Integrated Circuits, IC16 Philips Semiconductors January 1994 Philips Semiconductors Product specification 32 kHz clock circuit PCA153X series FEATURES GENERAL DESCRIPTION • 32 kHz oscillator frequency The PCA153X series are silicon-gate CMOS integrated circuits specially suited for battery-operated, quartz-crystal-controlled clocks, with a bipolar stepping motor. • Low current consumption; typically 2 µA, maximum 5 µA • Low minimum supply voltage: 1.1 V • Output for bipolar stepping motor – output frequency 1 Hz – pulse duration: see Table 1 Available types • Test mode speed-up with an input frequency up to 20 Hz (unchanged pulse duration). ORDERING INFORMATION EXTENDED TYPE NUMBER PACKAGE PINS PIN POSITION MATERIAL CODE PCA1532P 8 DIL plastic SOT97 PCA1534P 8 DIL plastic SOT97 PCA1532T 8 SO plastic SO8; SOT96C PCA1534T 8 SO plastic SO8; SOT96C PCA1532U/10 − chip on film frame carrier (FFC) − − PCA1534U/10 − chip on film frame carrier (FFC) − − Table 1 Available types. TYPE NUMBER PULSE WIDTH tp (ms) CAPACITANCE OUTPUT Co (pF) CAPACITANCE INPUT Ci (pF) PCA1532 23.4 24.0 3.0 PCA1534 46.8 24.0 3.0 January 1994 2 Philips Semiconductors Product specification 32 kHz clock circuit PCA153X series PINNING SYMBOL PIN DESCRIPTION OSC OUT 1 oscillator output VSS 2 ground (0 V) TEST IN 3 test input M1 4 M2 OSC OUT 1 VSS 2 motor 1 output TEST IN 3 5 motor 2 output M1 4 n.c. 6 not connected VDD 7 supply voltage OSC IN 8 oscillator input PCA153X SERIES 8 OSC IN 7 V DD 6 n.c. 5 M2 MGA932 Fig.1 Pin configuration. FUNCTIONAL DESCRIPTION AND TESTING Test mode Operating mode When testing the motor, a test frequency can be applied to TEST IN (pin 3) which allows the motor outputs to be accelerated up to 20 Hz. In the operating mode pin 3 must be left open-circuit or connected to VDD. M1 VDD V SS tp M2 VDD V SS tp T 2T Fig.2 Motor output waveforms. January 1994 3 MLB322 Philips Semiconductors Product specification 32 kHz clock circuit PCA153X series 1.5 V 32 kHz I OSC OUT V SS TEST IN M1 1 8 2 7 OSC IN VDD PCA153X SERIES 3 6 4 5 n.c. M2 RM MGA935 Fig.3 Test speed-up circuit. t t VDD TEST IN V SS VDD M2 tp V SS VDD M1 tp V SS MGA933 0.5 ms 0.5 ms Fig.4 Test speed-up signals. January 1994 4 Philips Semiconductors Product specification 32 kHz clock circuit PCA153X series LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC134). SYMBOL PARAMETER VSS supply voltage VI input voltage CONDITIONS VDD = 0 V; note 1 MIN. MAX. UNIT +1.8 −6.0 V VSS VDD V output short-circuit duration at pins 4 and 5 indefinite Tamb operating ambient temperature −10 +60 °C Tstg storage temperature −30 +125 °C Note to the “Limiting values” 1. Connecting the battery at 1.8 V maximum with reversed polarity does not destroy the circuit, but in this condition a large current flows, which will rapidly discharge the battery. HANDLING Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is advisable to take handling precautions appropriate to handling MOS devices (see 'Handling MOS Devices'). January 1994 5 Philips Semiconductors Product specification 32 kHz clock circuit PCA153X series CHARACTERISTICS VDD = 0 V; VSS = −1.4 V; fosc = 32.768 kHz; Tamb = 25 °C; crystal: RS = 20 kΩ; Ci = 2 to 3 fF; Co = 1 to 3 pF; CL = 10 pF; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply (pins 2 and 7) VSS1 supply voltage operating −1.1 − −1.8 V VSS2 supply voltage starting −1.2 − − V IDD supply current RL = ∞ − 2 5 µA − 1.0 − s PCA1532 − 23.4 − ms PCA1534 − 46.8 − ms Motor outputs (pins 4 and 5) T period tp pulse width IM current into load RM = 200 Ω; VSS = −1.2 V ±4 − − mA RO output resistance RM = 200 Ω − 60 − Ω TEST IN at VSS − 70 − µA 3 10 30 MΩ PCA1532 − 24.0 − pF PCA1534 − 24.0 − pF PCA1532 − 3.0 − pF PCA1534 − 3.0 − pF Test input (pin 3) II input current Oscillator (pins 1 and 8) Rp polarization resistance Co output capacitance (pin 1) note 1 Ci ∆f/f input capacitance (pin 8) frequency stability note 1 ∆VSS = 100 mV − Note to the “Characteristics” 1. Sum of Ci and Co limited to 40 pF. January 1994 6 0.4 x 10-6 − Philips Semiconductors Product specification 32 kHz clock circuit PCA153X series Bonding pad locations (dimensions in µm). All x/y coordinates are referenced to bottom left pad (M1), see Fig.5. CHIP DIMENSIONS AND BONDING PAD LOCATIONS y PAD OSC OUT OSC IN V SS VDD 1.20 mm PCA153X SERIES TEST IN 0 M1 M2 0 x y OSC OUT 0 880 VSS 0 670 TEST IN 0 380 M1 0 0 M2 675 94 VDD 675 575 OSC IN 675 785 −180 −180 chip corner (max. value) x 1.00 mm MGA936 Chip area: 1.20 µm2. Bonding pad dimensions: 120 µm x 120 µm. Fig.5 Bonding pad locations; 7 pins. APPLICATION INFORMATION 1.4 V 32 kHz 5 pF to 25 pF CT OSC OUT V SS TEST IN M1 1 8 2 7 PCA153X SERIES 3 6 4 5 OSC IN VDD n.c. M2 M MGA934 Fig.6 Typical application circuit diagram. January 1994 7 Philips Semiconductors Product specification 32 kHz clock circuit PCA153X series PACKAGE OUTLINES 8.25 7.80 9.8 9.2 seating plane handbook, full pagewidth 3.2 max 4.2 max 0.51 min 3.60 3.05 2.54 (3x) 1.15 max 0.53 max 0.254 M 0.38 max 7.62 1.73 max 8 10.0 8.3 5 6.48 6.20 1 4 Dimensions in mm. Fig.7 8-lead dual in-line; plastic (SOT97). January 1994 8 MSA252 - 1 Philips Semiconductors Product specification 32 kHz clock circuit PCA153X series 4.0 3.8 5.0 4.8 A 6.4 6.2 0.7 0.3 5 8 0.7 0.6 1.45 1.25 1 0.25 0.19 4 detail A pin 1 index 1.27 0.49 0.36 0.25 M (8x) Dimensions in mm. Fig.8 8-lead small outline; plastic (SO8; SOT96C). January 1994 9 MBC181 Philips Semiconductors Product specification 32 kHz clock circuit PCA153X series SOLDERING BY SOLDER PASTE REFLOW Plastic dual in-line packages Reflow soldering requires the solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the substrate by screen printing, stencilling or pressure-syringe dispensing before device placement. BY DIP OR WAVE The maximum permissible temperature of the solder is 260 °C; this temperature must not be in contact with the joint for more than 5 s. The total contact time of successive solder waves must not exceed 5 s. Several techniques exist for reflowing; for example, thermal conduction by heated belt, infrared, and vapour-phase reflow. Dwell times vary between 50 and 300 s according to method. Typical reflow temperatures range from 215 to 250 °C. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified storage maximum. If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 min. at 45 °C. REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING IRON OR PULSE-HEATED SOLDER TOOL) REPAIRING SOLDERED JOINTS Fix the component by first soldering two, diagonally opposite, end pins. Apply the heating tool to the flat part of the pin only. Contact time must be limited to 10 s at up to 300 °C. When using proper tools, all other pins can be soldered in one operation within 2 to 5 s at between 270 and 320 °C. (Pulse-heated soldering is not recommended for SO packages.) Apply the soldering iron below the seating plane (or not more than 2 mm above it). If its temperature is below 300 °C, it must not be in contact for more than 10 s; if between 300 and 400 °C, for not more than 5 s. Plastic small outline BY WAVE For pulse-heated solder tool (resistance) soldering of VSO packages, solder is applied to the substrate by dipping or by an extra thick tin/lead plating before package placement. During placement and before soldering, the component must be fixed with a droplet of adhesive. After curing the adhesive, the component can be soldered. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder bath is 10 s, if allowed to cool to less than 150 °C within 6 s. Typical dwell time is 4 s at 250 °C. A modified wave soldering technique is recommended using two solder waves (dual-wave), in which a turbulent wave with high upward pressure is followed by a smooth laminar wave. Using a mildly-activated flux eliminates the need for removal of corrosive residues in most applications. January 1994 10 Philips Semiconductors Product specification 32 kHz clock circuit PCA153X series DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 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