PHILIPS PCA1673U

INTEGRATED CIRCUITS
DATA SHEET
PCA167x series
32 kHz watch circuits using a
silver-oxide or a 3 V lithium battery
Product specification
Supersedes data of 1997 Apr 22
File under Integrated Circuits, IC16
1998 Apr 03
Philips Semiconductors
Product specification
32 kHz watch circuits using a silver-oxide
or a 3 V lithium battery
PCA167x series
FEATURES
GENERAL DESCRIPTION
• 32 kHz oscillator, amplitude regulated with excellent
frequency stability
The PCA167x series devices are CMOS integrated circuits
specially suited for battery-operated,
quartz-crystal-controlled wrist-watches, with a bipolar
stepping motor.
• High immunity of the oscillator to leakage currents
• Very low current consumption; typically 150 nA
• Stop function for accurate timing
• Chopped motor pulses available
• Power-on reset for fast testing
• Various test modes for testing the mechanical parts of
the watch and the IC.
ORDERING INFORMATION
PACKAGE(1)
TYPE
NUMBER
NAME
DESCRIPTION
VERSION
PCA1672U
−
chip in tray
−
PCA1673U
−
chip in tray
−
PCA1675U
−
chip in tray
−
PCA1676U/10
−
chip on foil
−
PCA1677U
−
chip in tray
−
Note
1. Figure 1 and Chapter “Package outline” show details of standard package, available for large orders only.
Chapter “Chip dimensions and bonding pad locations” shows exact pad locations for other delivery formats.
PINNING
SYMBOL
PIN
DESCRIPTION
VSS
1
ground (0 V)
TEST
2
test output
OSC IN
3
oscillator input
OSC OUT
4
oscillator output
VDD
5
positive supply voltage
M1
6
motor 1 output
M2
7
motor 2 output
RESET
8
reset input
1998 Apr 03
VSS
1
TEST
2
8
RESET
7
M2
PCA167xT
OSC IN
3
6
M1
OSC OUT
4
5
V DD
MSA978
Fig.1 Pin configuration, PCA167xT, (PMFP8).
2
Philips Semiconductors
Product specification
32 kHz watch circuits using a silver-oxide
or a 3 V lithium battery
PCA167x series
FUNCTIONAL DESCRIPTION AND TESTING
Customer testing and stop mode
Motor pulse
An output frequency of 32 Hz is provided at RESET (pin 8)
to be used for exact frequency measurement.
The motor output pulse widths (tP) and the cycle times (tT)
are given in Chapter “Available types”.
Connecting the RESET to VDD stops the motor pulses
leaving them in a HIGH impedance 3-state condition and a
32 Hz signal is produced at the TEST pin. A debounce
circuit protects against accidental stoppages due to
mechanical shock to the watch (tDEB = 14.7 to 123.2 ms).
Power-on reset
For correct operation of the Power-on reset the rise time of
VDD from 0 V to 1.55 V should be less than 0.1 ms.
All resettable flip-flops are reset. Additionally the polarity of
the first motor pulse is positive: VM1 − VM2 ≥ 0 V.
Connecting RESET to VSS activates the test mode.
The motor pulse period is 31.25 ms instead of tT. Test and
stop mode are disabled by disconnecting RESET
(open-circuit).
AVAILABLE TYPES
Refer to Fig.2 and to Chapters “Ordering information” and “Functional description and testing”.
SPECIFICATIONS
SHORT
TYPE
NUMBER
DELIVERY
FORMAT(1)
PERIOD
tT
(s)
1672
U
1673
PULSE
WIDTH tP
(ms)
DRIVE
(%)
EEPROM
BATTERY
EOL
DETECTION
1
7.8
56
no
no
3 V Lithium
U
1
5.8
56
no
no
3 V Lithium
REMARKS
1675
U
1/16
5.8
100
no
no
no oscillator
1676
U/10
10
5.8
56
no
no
3 V Lithium
1677
U
10
7.8
100
no
no
1.5 V
Note
1. U = Chip in trays; U/10 = chip on foil.
V M1 - M2
tT
2t T
tP
MSA977
Fig.2 Motor output waveform (normal operation).
1998 Apr 03
3
Philips Semiconductors
Product specification
32 kHz watch circuits using a silver-oxide
or a 3 V lithium battery
PCA167x series
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
VDD
supply voltage
VI
all input voltages
CONDITIONS
VSS = 0 V; note 1
MIN.
MAX.
UNIT
−1.8
+6
V
VSS
VDD
V
output short-circuit duration
indefinite
Tamb
operating ambient temperature
−10
+60
°C
Tstg
storage temperature
−30
+100
°C
Note
1. Connecting the battery with reversed polarity does not destroy the circuit, but in this condition a large current flows,
which will rapidly discharge the battery.
HANDLING
Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is
advisable to take handling precautions appropriate to handling MOS devices. Advice can be found in
“Data Handbook IC16, General, Handling MOS Devices”.
CHARACTERISTICS
VDD = 1.55 V; VSS = 0 V; fosc = 32.768 kHz; Tamb = 25 °C; crystal: RS = 20 kΩ; C1 = 2 to 3 fF; CL = 8 to 10 pF;
C0 = 1 to 3 pF; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
VDD
supply voltage
Tamb = −10 to +60 °C
1.2
1.5
3.5
V
∆VDD
supply voltage variation
transient;
VDD = 1.2 to 3.5 V
−
−
0.25
V
IDD1
supply current
between motor pulses
−
150
250
nA
IDD2
supply current
between motor pulses;
VDD = 3.5 V
−
200
350
nA
IDD3
supply current
stop mode; pin 8
connected to VDD
−
180
300
nA
IDD4
supply current
stop mode; pin 8
connected to VDD;
VDD = 3.5 V
−
300
480
nA
1998 Apr 03
4
Philips Semiconductors
Product specification
32 kHz watch circuits using a silver-oxide
or a 3 V lithium battery
SYMBOL
PARAMETER
CONDITIONS
PCA167x series
MIN.
TYP.
MAX.
UNIT
Motor output
Vsat
saturation voltage Σ (P + N)
RL = 2 kΩ;
Tamb = −10 to +60 °C
−
150
200
mV
Rsc
short-circuit resistance Σ (P + N)
Itransistor < 1 mA
−
200
300
Ω
tT
cycle time
note 1
tP
pulse width
note 2
Oscillator
VOSC ST
starting voltage
gm
transconductance
tosc
start-up time
∆f/f
frequency stability
Ci
Co
−
−
V
6
15
−
µS
−
1
−
1.2
Vi(p-p) = 50 mV
∆VDD = 100 mV
10−6
0.3 ×
s
10−6
−
0.05 ×
input capacitance
−
3
−
pF
output capacitance
19
24
29
pF
Reset input
fo
output frequency
−
32
−
Hz
∆Vo
output voltage swing
R = 1 MΩ; C = 10 pF
1.4
−
−
V
tedge
edge time
R = 1 MΩ; C = 10 pF
−
1
−
µs
Iim
peak input current
note 3
−
320
−
nA
Ii(av)
average input current
−
10
−
nA
tT1
cycle time
−
31.25
−
ms
tDEB
debounce time
14.7
−
123.2
ms
Test mode
RESET = VDD
Notes
1. Cycle time can be changed to one of the following values: 1, 5, 10, 12 or 20 s (see Chapter “Available types”).
2. Pulse width can be varied from 2 ms to 15.7 ms in steps of 1 ms (see Chapter “Available types”).
3. Duty factor is 1 : 32 and RESET = VDD or VSS.
1998 Apr 03
5
Philips Semiconductors
Product specification
32 kHz watch circuits using a silver-oxide
or a 3 V lithium battery
PCA167x series
CHIP DIMENSIONS AND BONDING PAD LOCATIONS
y
OSC OUT
OSC IN
TEST
V SS
PCA167xU
SERIES
1.44 mm
0
0
x
VDD
M1
M2
RESET
2.02 mm
MSA979
Chip area: 2.91 mm2.
Bonding pad dimensions: 110 µm × 110 µm.
Chip thickness: 200 ±25 µm, with bumps: 270 ±25 µm.
Fig.3 Bonding pad locations, PCA167xU series; 8 terminals.
Table 1 Bonding pad locations (dimensions in µm)
All x/y coordinates are referenced to the centre of pad (VDD), see Fig.3.
PAD
x
y
1290
1100
TEST
940
1100
OSC IN
481
1100
OSC OUT
−102
1100
VDD
0
0
M1
578
0
M2
930
0
VSS
RESET
chip corner (max. value)
1998 Apr 03
1290
0
−497.5
−170
6
Philips Semiconductors
Product specification
32 kHz watch circuits using a silver-oxide
or a 3 V lithium battery
PCA167x series
APPLICATION INFORMATION
1.55 V
VSS
TEST
CT
15 pF
1
8
2
7
PCA167x
SERIES
(1)
OSC IN
OSC OUT
RESET
M2
M
3
6
4
5
M1
VDD
MSA980
(1) Quartz crystal case should be connected to VDD. Stray capacitance and leakage resistance from RESET, M1 or M2 to OSC IN should be less than
0.5 pF or larger than 20 MΩ.
Fig.4 Typical application circuit diagram.
1998 Apr 03
7
Philips Semiconductors
Product specification
32 kHz watch circuits using a silver-oxide
or a 3 V lithium battery
PCA167x series
PACKAGE OUTLINE
PMFP8: plastic micro flat package; 8 leads (straight)
SOT144-1
E
D
X
c
m
t
n
HE
8
5
Q2
A2
Q1
pin 1 index
L
detail X
1
4
e
w M
b
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A2
b
c
D (1)
E (1)
e
HE
L
m
max.
n
max.
Q1
Q2
t
w
mm
0.90
0.70
0.40
0.25
0.19
0.12
3.1
2.9
3.1
2.9
0.80
4.6
4.4
0.75
0.26
0.3
0.40
0.30
0.40
0.30
0.95
0.1
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
94-01-25
95-01-24
SOT144-1
1998 Apr 03
EUROPEAN
PROJECTION
8
Philips Semiconductors
Product specification
32 kHz watch circuits using a silver-oxide
or a 3 V lithium battery
PCA167x series
SOLDERING
Wave soldering
Introduction
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Reflow soldering
Reflow soldering techniques are suitable for all SO
packages.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Repairing soldered joints
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
1998 Apr 03
9
Philips Semiconductors
Product specification
32 kHz watch circuits using a silver-oxide
or a 3 V lithium battery
PCA167x series
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1998 Apr 03
10
Philips Semiconductors
Product specification
32 kHz watch circuits using a silver-oxide
or a 3 V lithium battery
NOTES
1998 Apr 03
11
PCA167x series
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Internet: http://www.semiconductors.philips.com
© Philips Electronics N.V. 1998
SCA59
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
415108/1200/03/pp12
Date of release: 1998 Apr 03
Document order number:
9397 750 03604