INTEGRATED CIRCUITS DATA SHEET PCA2002 32 kHz watch circuit with programmable output period and pulse width Product specification Supersedes data of 2003 Feb 04 2004 Jan 20 Philips Semiconductors Product specification 32 kHz watch circuit with programmable output period and pulse width PCA2002 FEATURES GENERAL DESCRIPTION • 32 kHz quartz oscillator, amplitude regulated with excellent frequency stability and high immunity to leakage currents The PCA2002 is a CMOS integrated circuit for battery operated wrist watches with a 32 kHz quartz crystal as the timing element and a bipolar stepping motor. The crystal oscillator and the frequency divider are optimized for minimum current consumption. A timing accuracy of 1 ppm is achieved with a programmable, digital frequency adjustment. • Electrically programmable time calibration with 1 ppm resolution (stored in OTP memory) • The quartz crystal is the only external component required The output period and the output pulse width can be programmed. It can be selected between a full output pulse or a chopped output pulse with a duty cycle of 75 %. In addition, a stretching pulse can be added to the primary driving pulse. • Very low current consumption: typically 90 nA • Output pulses for bipolar stepping motors • Five different programmable output periods (1 s to 30 s) • Output pulse width programmable between 1 ms and 8 ms Pin RESET is used for stopping the motor, accurate time setting and for an accelerated testing of the watch. • Full or chopped motor pulse and pulse stretching, selectable • Stop function for accurate time setting and current saving during the shelf life • Test mode for accelerated testing of the mechanical parts of the watch. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME PCA2002U/AA PCA2002U/10AA PCA2002T PCA2002TK 2004 Jan 20 DESCRIPTION − bare die; chip in tray − bare die; chip on film frame carrier PMFP8 HVSON10 VERSION − − plastic micro flat package; 8 leads (straight) SOT144-1 plastic thermal enhanced very thin small outline package; no leads; 10 terminals; body 3 × 3 × 0.85 mm SOT650-1 2 Philips Semiconductors Product specification 32 kHz watch circuit with programmable output period and pulse width PCA2002 BLOCK DIAGRAM 32 Hz OSCIN 3 (3) 8 kHz ÷4 OSCILLATOR OSCOUT (10) 8 DIVIDER RESET 4 (4) reset TIMING ADJUSTMENT, INHIBITION VDD VSS RESET 5 (7) 1 (1) VOLTAGE DETECTOR, OTP-CONTROLLER OTP-MEMORY 1 Hz MOTOR CONTROL PCA2002U PCA2002T (PCA2002TK) (5) (2) 2 (6) 6 (8) 7 (9) MOT1 MOT2 n.c. n.c. i.c. mbl568 M The pin numbers in parenthesis represent the PCA2002TK. Fig.1 Block diagram. PINNING PAD PIN SYMBOL DESCRIPTION PCA2002U PCA2002T PCA2002TK VSS 1 1 1 ground i.c. 2 2 2 internally connected OSCIN 3 3 3 oscillator input OSCOUT 4 4 4 oscillator output n.c. − − 5 not connected n.c. − − 6 not connected VDD 5 5 7 supply voltage MOT1 6 6 8 motor 1 output MOT2 7 7 9 motor 2 output RESET 8 8 10 reset input 2004 Jan 20 3 Philips Semiconductors Product specification 32 kHz watch circuit with programmable output period and pulse width PCA2002 n.c. 5 6 n.c. OSCOUT 4 7 VDD 8 MOT1 MOT2 handbook, halfpage VSS 1 i.c. 2 8 RESET 7 MOT2 OSCIN 3 i.c. 2 9 VSS 1 10 RESET PCA2002TK PCA2002T OSCIN 3 6 MOT1 OSCOUT 4 5 VDD MBL569 terminal 1 index area Fig.2 Pin configuration PMFP8. 001aaa284 Bottom view Fig.3 Pin configuration HVSON10. FUNCTIONAL DESCRIPTION • Output periods of 1 s, 5 s, 10 s, 20 s and 30 s Motor pulse • Pulse width (tp) between 0.98 ms and 7.8 ms in steps of 0.98 ms The motor driver delivers pulses with an alternating polarity. The output waveform across the motor terminals is illustrated in Fig.4. Between the motor pulses, both terminals are connected to VDD which means that the motor is short-circuited. • Full or chopped (75 %) output pulse • Pulse stretching: an enlargement pulse is added to the primary motor pulse. This enlargement pulse has a duty cycle of 25 % and a width which is twice the programmed motor pulse width. The following parameters can be selected and are stored in a One Time Programmable (OTP) memory: period handbook, full pagewidth full pulse chopped pulse full pulse with stretching chopped pulse with stretching tp 2t p tp Fig.4 Motor output waveforms. 2004 Jan 20 4 2t p MGU718 Philips Semiconductors Product specification 32 kHz watch circuit with programmable output period and pulse width Time calibration together with the calibration period in the OTP memory; see Section “Programming procedure”. The crystal oscillator has an integrated load capacitance of 5 pF, which is lower than the specified load capacitance of 8.2 pF for the quartz crystal. The oscillator frequency can be measured at pad RESET, where a square wave signal with the frequency of 1 ------------- × f osc is provided. 1024 It oscillates therefore, at a frequency which is typically 60 ppm higher than 32.768 kHz. This positive frequency offset is then compensated by removing, every minute or every two minutes, the appropriate number of 8192 Hz pulses (maximum 127 pulses) of the divider chain. The timing correction is given in Table 1. This frequency shows a jitter every minute or every two minutes, depending on the programmed calibration period, which originates from the time calibration. Details on how to measure the oscillator frequency and the programmed inhibition time are given in Section “Programming procedure”. After measuring the effective oscillator frequency, the number of correction pulses must be calculated and stored Table 1 Timing correction CORRECTION PER STEP (N = 1) CALIBRATION PERIOD (min) CORRECTION PER STEP (N = 127) ppm s/day ppm s/day 1 2.03 0.176 258 22.3 2 1.017 0.088 129 11.15 polarity to the last pulse before stopping. The debounce time for the reset function is between 31 ms and 62 ms. Reset At pin RESET an output signal with a frequency of 1 ------------- × f osc = 32 Hz is provided. 1024 Connecting pin RESET to VSS activates the test mode. In this mode the motor output frequency is 32 Hz, which can be used to test the mechanical function of the watch. Connecting pin RESET to VDD stops the motor drive and opens the motor switches. Programming possibilities After releasing pin RESET, the first motor pulse is generated exactly one period later with the opposite Table 2 PCA2002 The programming data is stored in two words; see Table 2. Words and bits BIT WORD 1 A B 2004 Jan 20 2 3 4 5 6 7 number of 8192 Hz pulses to be removed pulse width output period 5 8 calibration period duty cycle pulse stretching Philips Semiconductors Product specification 32 kHz watch circuit with programmable output period and pulse width Table 3 BIT Description of word A bits General start up sequence VALUE You must follow the next sequence to ensure the correct operation at start up: DESCRIPTION Inhibit time − 1 to 7 1. Apply the supply voltage to the circuit. the number of the 8192 Hz pulses to be removed (binary coded; MSB = A1, LSB = A7) 2. Wait at least two seconds. 3. Connect pin RESET to pin VDD for a minimum of 62 ms (this activates the stop mode). Calibration period 8 Table 4 BIT 0 1 minute 1 2 minutes 4. Disconnect pin RESET from pin VDD (this resets the circuit to normal operating mode). After this sequence the memory contents are read immediately and the programmed options are set. This sequence also resets all major circuit blocks and ensures that they function correctly. Description of word B bits VALUE DESCRIPTION To ensure that the oscillator starts up correctly you must execute a reset sequence (see Fig.5). Pulse width tp (ms) 1 to 3 000 0.98 001 1.95 010 2.9 011 3.9 100 4.9 101 5.9 110 6.8 111 7.8 t p(stop) VDD VP(stop) t (start) > 500 ms VDD(nom) Output period (s) 4 to 6 PCA2002 000 1 001 5 010 10 011 20 100 30 VSS 001aaa285 Fig.5 Supply voltage at start up. Programming procedure For a watch it is essential that the timing calibration can be made after the watch is fully assembled. In this situation, the supply pins are often the only terminals which are still accessible. Duty cycle of motor pulse 7 0 75 % 1 100 % Pulse stretching 8 2004 Jan 20 0 no pulse stretching 1 a pulse width of 2tp and a duty factor of 25 % is added Writing to the OTP cells and performing the related functional checks is achieved in the PCA2002 by modulating the supply voltage. The necessary control circuit consists basically of a voltage level detector, an instruction state counter (which determines the function to be performed) and an 8-bit shift register which allows writing the OTP cells of an 8-bit word in one step and which acts as data pointer for checking the OTP content. 6 Philips Semiconductors Product specification 32 kHz watch circuit with programmable output period and pulse width PCA2002 MEASUREMENT OF OSCILLATOR FREQUENCY AND INHIBIT TIME There are four different instruction states: • State 1; measurement of the crystal oscillator frequency (divided by 1024) The output of the two measuring states can either be monitored directly at pin RESET or as a modulation of the supply current (a modulating resistor of 30 kΩ is connected between VDD and VSS when the signal at pin RESET is HIGH): • State 2; measurement of the inhibition time • State 3; write/check word A • State 4; write/check word B. • State 1; crystal oscillator frequency divided by 1024; state 1 starts with a pulse to VP(start) and ends with a second pulse to VP(stop) Each instruction state is switched on with a pulse to VP(start). After this large pulse, an initial waiting time of t0 is required. The programming instructions are then entered by modulating the supply voltage with small pulses of an amplitude VP(mod) and pulse width tmod. The first small pulse defines the start time, the following pulses perform three different functions, depending on the time delay (td) from the preceding pulse (see Fig.6): • State 2; inhibition time (see Fig.7); a frequency with the period of (31.25 + n × 0.122) ms appears at pin RESET and as current modulation at the supply pin. • td = t1 (0.7 ms); increments the instruction counter handbook, halfpage • td = t2 (1.7 ms); clocks the shift register with D = 0 at the input VDD VSS • td = t3 (2.7 ms); clocks the shift register with D = 1 at the input. MGU720 Fig.7 VDD handbook, halfpage t p(stop) t p(start) t0 Applying the two-stage programming pulse (see Fig.8) transfers the stored data in the shift register to the OTP cells. t1 Perform the following to programme a memory word: VP(mod) VDD(nom) 1. Starting with a VP(start) pulse, wait for the time period t0 then set the instruction counter to the word to be written (td = t1) VSS MGU719 Fig.6 2. Enter the data to be stored into the shift register (td = t2 or t3), LSB first (bit 8) and MSB last (bit 1) Supply voltage modulation for start and stop of instruction state 2. 3. Applying the two-stage programming pulse Vpre-store followed by Vstore stores the word. The delay between the last data bit and the pre-store pulse Vpre-store is td = t4. Store the word by raising the supply voltage to Vstore (9.9 V for 100 ms); the delay between the last data bit and the store pulse is td = t4 (0.2 ms). The programming procedure requires a stable oscillator, which means that a waiting time, determined by the start-up time of the oscillator, is necessary after power-up of the circuit. The example shown in Fig.8 performs the following functions: start, setting the instruction counter to state 4 (word B), entering data word 110101 into the shift register (sequence: LSB first and MSB last) and writing the OTP cells for word B. After the VP(start) pulse, the instruction counter is in state 1 and the data shift register is cleared. The instruction state ends with a second pulse to VP(start) or with the pulse to Vstore. In any event the instruction states are terminated automatically 2 seconds after the last VP(mod) pulse. 2004 Jan 20 Output waveform at pin RESET for instruction state 2. PROGRAMMING THE MEMORY CELLS VP(stop) VP(start) 31.25 ms + Inhibtion time 7 Philips Semiconductors Product specification 32 kHz watch circuit with programmable output period and pulse width PCA2002 tpre-store handbook, full pagewidth VDD(mod) Vstore t p(start) VP(start) Vpre-store t0 t1 t1 t1 t3 t2 t3 t2 t3 t3 t4 t store VP(mod) VDD VSS MGW356 Fig.8 Supply voltage modulation for programming. CHECKING THE MEMORY CONTENT The stored data of the OTP array can be checked bit-wise by measuring the supply current. The array word is selected by the instruction state, the bit is addressed by the shift register. To read a word, the word is first selected (td = t1) and a logic 1 is written into the first cell of the shift register (td = t3). This logic 1 is then shifted through the entire shift register (td = t2, so that it points with each clock pulse to the next bit. If the addressed OTP cell contains a logic 1, a 30 kΩ resistor is connected between VDD and VSS; this increases the supply current accordingly. VDD(mod) t p(start) t p(stop) VP(start) VP(stop) t0 t1 t1 t1 t3 t2 t2 t2 t2 t2 VP(mod) VDD VSS I DD (1) mgw357 V DD (1) ∆I DD = --------------30 kΩ The corresponding supply current variation for B = 110101 (the sequence is MSB first and LSB last). Fig.9 Supply voltage modulation for reading word B. 2004 Jan 20 8 Philips Semiconductors Product specification 32 kHz watch circuit with programmable output period and pulse width PCA2002 Frequency tuning at assembled watch Figure 10 shows the test set-up for frequency tuning the assembled watch. handbook, full pagewidth 32 kHz M PCA200x FREQUENCY COUNTER motor PROGRAMMABLE DC POWER SUPPLY battery PC INTERFACE PC MGW568 Fig.10 Frequency tuning the assembled watch. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS VSS = 0 V; notes 1 and 2 MIN. MAX. UNIT −1.8 +7 V VSS − 0.5 VDD + 0.5 V VDD supply voltage VI all input voltages tsc short-circuit duration time Tamb ambient temperature −10 +60 °C Tstg storage temperature −30 +100 °C indefinite Notes 1. When writing to the OTP cells, the supply voltage (VDD) can be raised to a maximum of 12 V for a time period of 1 s. 2. Connecting the battery with reversed polarity does not destroy the circuit, but in this condition a large current flows which rapidly discharges the battery. HANDLING Inputs and outputs are protected against electrostatic discharge in normal handling. However it is good practice to take normal precautions appropriate to handling MOS devices (see “Handling MOS devices” ). 2004 Jan 20 9 Philips Semiconductors Product specification 32 kHz watch circuit with programmable output period and pulse width PCA2002 CHARACTERISTICS VDD = 1.55 V; VSS = 0 V; fosc = 32.768 kHz; Tamb = 25 °C; quartz crystal; Rs = 40 kΩ; C1 = 2 to 3 fF; CL = 8.2 pF; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supplies VDD supply voltage normal operating mode; Tamb = −10 °C to +60 °C ∆VDD supply voltage variation ∆V/∆t = 1 V/µs IDD supply current between motor pulses 1.1 1.55 3.6 V − − 0.25 V − 90 120 nA between motor pulses at VDD = 3.5 V − 120 180 nA Tamb = −10 °C to +60 °C − − 200 nA stop mode; pin RESET connected − to VDD 100 135 nA − 150 200 mV Motor output Vsat saturation voltage ∑(P + N) RM = 2 kΩ; Tamb = −10 °C to +60 °C Zo(sc) short-circuit impedance between motor pulses; Imotor < 1 mA − 200 300 Ω Vstart starting voltage 1.1 − − V gm transconductance 5 10 − µS − 0.3 0.9 s − 0.05 0.2 ppm 4.3 5.2 6.3 pF allowed resistance between adjacent pins 20 − − MΩ Oscillator tsu start-up time ∆f/f frequency stability CL integrated load capacitance Rpar parasitic resistance VOSCIN ≤ 50 mV (p-p) ∆VDD = 100 mV Reset fo output frequency − 32 − Hz ∆Vo output voltage swing RL = 1 MΩ; CL = 10 pF 1.4 − − V tr rise time RL = 1 MΩ; CL = 10 pF − 1 − µs tf fall time RL = 1 MΩ; CL = 10 pF − 1 − µs Ii(av) average input current pin RESET connected to VDD or VSS − 10 20 nA 2004 Jan 20 10 Philips Semiconductors Product specification 32 kHz watch circuit with programmable output period and pulse width PCA2002 OTP PROGRAMMING CHARACTERISTICS SYMBOL PARAMETER(1) MIN. TYP. MAX. UNIT VDD supply voltage during programming procedure 1.5 − 3.0 V VP(start) supply voltage for starting programming procedure 6.6 − 6.8 V VP(stop) supply voltage for stopping programming procedure 6.2 − 6.4 V VP(mod) supply voltage modulation for entering instructions 320 350 380 mV Vpre-store supply voltage for pre-store pulse 6.2 − 6.4 V Vstore supply voltage for writing to the OTP cells 9.9 10.0 10.1 V Istore supply current for writing to the OTP cells − − 10 mA tp(start) pulse width of start pulse 8 10 12 ms tp(stop) pulse width of stop pulse 0.05 − 0.5 ms tmod modulation pulse width 25 30 40 µs tpre-store pulse width of pre-store pulse 0.05 − 0.5 ms tstore pulse width for writing to the OTP cells 95 100 110 ms t0 waiting time after start pulse 20 − 30 ms t1 pulse distance for incrementing the state counter 0.6 0.7 0.8 ms t2 pulse distance for clocking the data register with data = logic 0 1.6 1.7 1.8 ms t3 pulse distance for clocking the data register with data = logic 1 2.6 2.7 2.8 ms t4 waiting time for writing to the OTP cells 0.1 0.2 0.3 ms SR slew rate for modulation of the supply voltage 0.5 − 5 V/µs Rread read out resistor for supply current modulation 18 30 45 kΩ Note 1. Programme each word once only. 2004 Jan 20 11 Philips Semiconductors Product specification 32 kHz watch circuit with programmable output period and pulse width PCA2002 BONDING PAD LOCATIONS COORDINATES(1) SYMBOL y 1 −480 +330 i.c.(3) 2 −480 +160 OSCIN 3 −480 −160 OSCOUT 4 −480 −330 VDD 5 +480 −330 MOT1 6 +480 −160 MOT2 7 +480 +160 RESET 8 +480 +330 VSS VSS 1 i.c. 2 y x 0.90 mm 0 OSCIN 3 OSCOUT 4 8 RESET 7 MOT2 PC2002 x (2) 1.20 mm handbook, halfpage PAD 0 6 MOT1 5 VDD MBL574 Fig.11 Bonding pad locations. Notes 1. All coordinates are referenced, in µm, to the centre of the die (see Fig.11). Table 5 2. The substrate (rear side of the chip) is connected to VSS. Therefore, the die pad must be either floating or connected to VSS. Mechanical chip data; note 1 PARAMETER VALUE Bonding pad: 3. Pad i.c. is used for factory tests; in normal operation it should be left open-circuit, and it has an internal pull-down resistance to VSS. metal 96 × 96 µm opening 86 × 86 µm Note 1. The substrate of the chip is connected to VSS. The pad i.c. is used for factory test, in normal operation it should be left open-circuit. The pad i.c. has an internal pull-down resistor connected to VSS. 2004 Jan 20 12 Philips Semiconductors Product specification 32 kHz watch circuit with programmable output period and pulse width PCA2002 TRAY INFORMATION handbook, full pagewidth A x G C H y 1,1 2,1 1,2 2,2 3,1 x,1 D B 1,3 F x,y 1,y A A E M J SECTION A-A MGU653 Fig.12 Tray details. Table 6 Tray dimensions DIMENSION DESCRIPTION VALUE pocket pitch; x direction 2.15 mm B pocket pitch; y direction 2.43 mm C pocket width; x direction 1.01 mm D pocket width; y direction 1.39 mm E tray width; x direction 50.67 mm F tray width; y direction 50.67 mm G distance from cut corner to pocket (1 and 1) centre 4.86 mm H distance from cut corner to pocket (1 and 1) centre 4.66 mm handbook, halfpage PCA2002 A MBL573 J tray thickness 3.94 mm M pocket depth 0.61 mm x number of pockets in x direction 20 The orientation of the IC in a pocket is indicated by the position of the IC type name on the surface of the die, with respect to the cut corner on the upper left of the tray. y number of pockets in y direction 18 Fig.13 Tray alignment. 2004 Jan 20 13 Philips Semiconductors Product specification 32 kHz watch circuit with programmable output period and pulse width PCA2002 PACKAGE OUTLINE PMFP8: plastic micro flat package; 8 leads (straight) SOT144-1 E D X c m t n HE 8 5 Q2 A2 Q1 pin 1 index L detail X 1 4 e w M b 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A2 b c D (1) E (1) e HE L m max. n max. Q1 Q2 t w mm 0.9 0.7 0.40 0.25 0.19 0.12 3.1 2.9 3.1 2.9 0.8 4.6 4.4 0.75 0.26 0.3 0.4 0.3 0.4 0.3 0.95 0.1 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEITA ISSUE DATE 95-01-24 03-03-12 SOT144-1 2004 Jan 20 EUROPEAN PROJECTION 14 Philips Semiconductors Product specification 32 kHz watch circuit with programmable output period and pulse width PCA2002 HVSON10: plastic thermal enhanced very thin small outline package; no leads; 10 terminals; body 3 x 3 x 0.85 mm SOT650-1 0 1 2 mm scale X A B D A A1 E c detail X terminal 1 index area C e1 terminal 1 index area e 5 y y1 C v M C A B w M C b 1 L Eh 6 10 Dh DIMENSIONS (mm are the original dimensions) UNIT A(1) max. A1 b c D(1) Dh E(1) Eh e e1 L v w y y1 mm 1 0.05 0.00 0.30 0.18 0.2 3.1 2.9 2.55 2.15 3.1 2.9 1.75 1.45 0.5 2 0.55 0.30 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT650-1 --- MO-229 --- 2004 Jan 20 15 EUROPEAN PROJECTION ISSUE DATE 01-01-22 02-02-08 Philips Semiconductors Product specification 32 kHz watch circuit with programmable output period and pulse width If wave soldering is used the following conditions must be observed for optimal results: SOLDERING Introduction to soldering surface mount packages • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. Typical reflow peak temperatures range from 215 to 270 °C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. • below 225 °C (SnPb process) or below 245 °C (Pb-free process) Manual soldering – for all BGA, HTSSON-T and SSOP-T packages Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. – for packages with a thickness ≥ 2.5 mm – for packages with a thickness < 2.5 mm and a volume ≥ 350 mm3 so called thick/large packages. • below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. 2004 Jan 20 PCA2002 16 Philips Semiconductors Product specification 32 kHz watch circuit with programmable output period and pulse width PCA2002 Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE(1) WAVE REFLOW(2) BGA, HTSSON..T(3), LBGA, LFBGA, SQFP, SSOP..T(3), TFBGA, USON, VFBGA not suitable suitable DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS not suitable(4) suitable PLCC(5), SO, SOJ suitable suitable not recommended(5)(6) suitable SSOP, TSSOP, VSO, VSSOP not recommended(7) suitable CWQCCN..L(8), PMFP(9), WQCCN..L(8) not suitable LQFP, QFP, TQFP not suitable Notes 1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. 4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 8. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. 9. Hot bar or manual soldering is suitable for PMFP packages. 2004 Jan 20 17 Philips Semiconductors Product specification 32 kHz watch circuit with programmable output period and pulse width PCA2002 DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) PRODUCT STATUS(2)(3) Development DEFINITION I Objective data II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Production This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2004 Jan 20 18 Philips Semiconductors Product specification 32 kHz watch circuit with programmable output period and pulse width Bare die All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of ninety (90) days from the date of Philips' delivery. If there are data sheet limits not guaranteed, these will be separately indicated in the data sheet. There are no post packing tests performed on individual die or wafer. Philips Semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die. Accordingly, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing, handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify their application in which the die is used. 2004 Jan 20 19 PCA2002 Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: [email protected]. SCA76 © Koninklijke Philips Electronics N.V. 2004 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R15/03/pp20 Date of release: 2004 Jan 20 Document order number: 9397 750 11671