PI6C2410 12345678901234567890123456789012123456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012123456789012 12345678901234567890123456789012123456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012123456789012 PCI-X Clock Buffers Product Features • • • • • • • • • • Product Description Four synchronous outputs Selectable divider/multiplier Output Enable control Low phase error < 150 ps Allows clock input to have spread spectrum modulation for EMI reduction Low output skew < 200 ps Low cycle jitter < 200 ps Industrial temperature (–40°C to 85°C) 3.3V supply Packages (Pb-free and Green available): 24-pin QSOP (Q) 24-pin TSSOP (L) PI6C2410 is a low skew, low jitter, PLL clock buffer with divider or multiplier designed for PCI-X application in servers and workstations. There are two selectable input ranges using HF# input: 10-40 MHz and 40-80 MHz. All outputs are synchronized to the input and to the other outputs. Each output can be independently turned off to reduce EMI and power consumption. Pin Configuration AGND 1 24 CLKIN VCC 2 23 AVCC HF# 3 22 VCC DIV0 4 21 OUT0 DIV1 5 20 OUT1 GND Block Diagram 6 24-Pin Q, L 19 GND GND 7 18 GND FBIN 8 17 OUT2 FBOUT 9 16 OUT3 VCC 10 15 VCC OE0 11 14 OE3 OE1 12 13 OE2 OUT0 OUT1 OUT2 OE[0:3] HF# OUT3 CLKIN FBIN PLL DIV FBOUT Clock Select Table DIV[0:1] HF# DIV1 DIV0 OUTx 1 1 1 CLKIN 1 1 0 2xCLKIN CLKIN OUTx 33MHz 66MHz 33MHz 1 0 1 3xCLKIN 100MHz 1 0 0 4xCLKIN 133MHz 0 1 1 CLKIN/2 33MHz 0 1 0 CLKIN 66MHz 66MHz 1 0 0 1 1.5xCLKIN 100MHz 0 0 0 2xCLKIN 133MHz PS8593B 01/12/05 PI6C2410 PCI-X Clock Buffers 12345678901234567890123456789012123456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012123456789012 12345678901234567890123456789012123456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012123456789012 Pin Description Pin Type Qty Symbol De s cription 21,20,17,16 O 4 OUT[0:3] Clock outputs. To achieve zero input to output delay, all outputs must have the same loading. 11, 12, 13, 14 I 4 OE[0:3] Active high Output Enable, pulled up. When OE is low, OUT [0:3] outputs are disabled at low state. 9 O 1 FBOUT Feedback output. To achieve zero input to output delay, FBOUT must have the same loading as OUT[0:3]. 8 I 1 FBIN 24 I 1 CLKIN 3 I 1 HF# 4,5 I 2 DIV[0,1] 2,10,15,22 P 4 VC C 3.3V power 6,7,18,19 P 4 GND Ground 23 P 1 AVC C 3.3V analog power 1 P 1 AGND Analog ground Feedback input. Input Clock. High Frequency range, pulled up. "1" = Low, "0" = High. Divider/Multiplier Select, pulled up. Absolute Maximum Ratings Supply Voltage (VCC, AVCC) ................................................ 0.5V to +4.6V Input Voltage ................................................................ –0.5V to Vcc+0.5V Industrial Operating Temperature ....................................... -40°C to +85°C Storage Temperature ........................................................ –65°C to +150°C Junction Temperature ....................................................................... 150°C Input ESD MIL-883, Method 3015, human body model ....................... 2kV Operating Condition Symbol VCC, AVCC TA De s cription M in. M ax. Units I/O Supply, Analog Core Supply 3.0 3.6 V Industrial Ambient Temperature –40 +85 °C 2 PS8593B 01/12/05 PI6C2410 PCI-X Clock Buffers 12345678901234567890123456789012123456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012123456789012 12345678901234567890123456789012123456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012123456789012 DC Electrical Characteristics Over Operating Conditions Symbol Parame te r Conditions M in. Typ. M ax. VIL Low Input Voltage VIH High Input Voltage IIL Low Input Current VIN = 0V 50 IIH High Input Current VIN = VCC 200 VOL Low Output Voltage VCC = 3.0V, Iol = 12mA 0.4 VOH High Output Voltage VCC = 3.0V, Ioh = –12mA Idd_33 Supply Current CL = 15pF, FOUT = 33MHz 25 Idd_66 Supply Current CL = 15pF, FOUT = 66MHz 35 Idd_100 Supply Current CL = 15pF, FOUT = 100MHz 45 Idd_133 Supply Current CL = 15pF, FOUT = 133MHz 60 Units 0.8 V 2.0 uA V 2.4 tbd mA CO Output Capacitance 6 CI Input Capacitance 6 Pin Inductance 7 nH Units pF LPIN Switching Characteristics (TA = 25°C, VCC = 3.3V ±0.3V, Cl = 15pF, FOUT = 66.67 MHz) Symbol FIN Parame te r Te s t Conditions M in. Typ. M ax. Low Freq., HF# = "1" 10 33 40 High Freq., HF# = "0" 40 66 80 Input frequency FOUT Output frequency TPD Propagation delay CLKIN to FBIN rising edges @VDD/2 TSK Output skew @1.4V, rising edges 200 TSKPP Pkg to pkg skew @VDD/2, rising edges, same CLKIN 400 TJC Cycle jitter TDC Duty cycle @1.4V TR/TF Rise/Fall time 0.8V~2.0V MHz 160 –150 150 ps 200 35 50 65 % 1. 5 ns Note: Tjc = Tp(n+1) –Tp(n) Tdc = Th/Tp Tp(n) = Period of the nth cycle Tp = Period cycle time Tp(n+1) = Period of nth+1 cycle Th = High time @1.4V 3 PS8593B 01/12/05 PI6C2410 PCI-X Clock Buffers 12345678901234567890123456789012123456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012123456789012 12345678901234567890123456789012123456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012123456789012 2.0V T1 2.0V 0.8V 0.8V Tr 1.4V Tf Tp Figure 1. Rise/Fall time OUTx OUTy Figure 2. Duty cycle 1.4V Tp(n) 1.65V 1.4V Device2 OUTy Tp(n+1) Figure 4. Cycle jitter Figure 3. Output skew Device1 OUTx 1.65V Tsk 1.65V CLKIN Tskp2p 1.65V FBIN 1.65V Tpd 1.65V Figure 6. Propagation Delay Figure 5. Pkg.-to-Pkg. skew DUT OUTx 15pF Figure 7. Test load 4 PS8593B 01/12/05 PI6C2410 PCI-X Clock Buffers 12345678901234567890123456789012123456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012123456789012 12345678901234567890123456789012123456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012123456789012 Packaging Mechanical: 24-pin QSOP (Q) 24 .008 0.20 MIN. .150 .157 .008 .013 0.20 0.33 3.81 3.99 Guage Plane .010 0.254 Detail A 1 .337 .344 0˚-6˚ .016 .035 0.41 0.89 .041 1.04 REF 8.56 8.74 .033 0.84 .053 .069 .015 x 45˚ 0.38 1.35 1.75 Detail A .007 .010 SEATING PLANE .025 typical 0.635 .008 0.203 .012 0.305 .016 .050 .004 0.101 .010 0.254 0.178 0.254 0.406 1.27 .228 .244 5.79 6.20 X.XX DENOTES DIMENSIONS X.XX IN MILLIMETERS Packaging Mechanical: 24-Pin TSSOP (L) 24 .169 .177 4.3 4.5 .004 .008 1 .303 .311 7.7 7.9 .0256 BSC 0.65 0.45 0.75 .047 1.20 Max .007 .012 0.19 0.30 .002 .006 0.09 0.20 .018 .030 .252 BSC 6.4 SEATING PLANE 0.05 0.15 5 PS8593B 01/12/05 PI6C2410 PCI-X Clock Buffers 12345678901234567890123456789012123456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012123456789012 12345678901234567890123456789012123456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012123456789012 Ordering Information Orde ring Code Package Name Package Type PI6C2410Q Q 24- pin, 150- mil QSOP PI6C2410QE Q Pb- free & Green, 24- pin, 150- mil QSOP PI6C2410L L 24- pin, 173- mil TSSOP PI6C2410LE L Pb- free & Green, 24- pin, 173- mil TSSOP Notes: 1. Thermal characteristics can be found on the company web site at http://www.pericom.com/packaging/ Pericom Semiconductor Corporation • 1-800-435-2336 • http://www.pericom.com 6 PS8593B 01/12/05