STANLEY PP1191FB

PP1191FB
Surface Mount PIN Photodiode/Side Viewing Type
Features
Package
Product features
Side Viewing type, Black Visible Radiation Cut Filter epoxy
・Outer Dimension 3.0 x 2.0 x 1.0 mm ( L x W x H )
・Photo Current : 1.8μA TYP. (VR=5V,Ee=5mW/cm2)
・Visible Radiation Cut Filter under 700nm
・Lead–free soldering compatible
・RoHS compliant
Peak Sensitivity Wavelength
950nm
Half Intensity Angle
θx = 156 deg., θy = 132 deg.
Die materials
Si
Assembly method
Auto pick & place machine (Auto Mounter)
Soldering methods
Reflow soldering, and manual soldering
※Please refer to Soldering Conditions about soldering.
Taping and reel
3,000pcs per reel in a 8mm width tape. (Standard)
Reel diameter:φ180mm
ESD
2kV (HBM)
Recommended Applications
Electric Household Appliances, OA/FA, PC/Peripheral Equipment, Other General Applications
2010.12.15
Page : 1
PP1191FB
Surface Mount Photodiode/Side Viewing Type
(Ta=25℃)
Absolute Maximum Ratings
Item
Symbol
Absolute Maximum Ratings
Unit
Power Dissipation
Pd
15
mW
Reverse Voltage
VR
12
V
Operating Temperature
Topr
-30~ +85
℃
Storage Temperature
Tstg
-40~ +100
℃
Electro-Optical Characteristics
Item
Photo Current
Response Time
Capacity
Symbol
Conditions
VR =5V,
Ee=5mW/cm2
※1
VR =10V,
RL=1,000Ω
VR =5V,
f=1MHz
(Ta=25℃)
※3
Unit
Characteristics
MIN.
1.2
TYP.
1.8
MAX.
2.4
tr/tf
TYP.
60
ns
CT
TYP.
1.6
pF
TYP.
0.1
MAX.
20
TYP.
950
TYP.
156(θx)
TYP.
132(θy)
Ip
Dark Current
VR =10V
ID
Peak Sensitivity
Wavelength
VR =0V
λp
Spatial Half Width※ 2
VR =0V
2θ1/2
μA
nA
nm
deg.
※ 1 Color temperature is 2,856K. Employs a standard tungsten lamp.
※ 2 θx: Lens long side axis, θy : Lens short side axis
※ 3 Response time test circuit.
Laser
diode
2010.12.15
Page : 2
PP1191FB
Surface Mount Photodiode/Side Viewing Type
Technical Data
Relative Sensitivity vs. Wavelength
Spatial Distribution Example
Condition : Ta = 25℃, VR = 0V
120
Condition : Ta = 25℃
Relative Sensitivity (%)
100
80
60
40
20
0
300
400
500
600
700
800
900
1000
1100
Wavelength [nm]
Irradiance vs. Relative Photo Current
Ambient Temperature vs. Relative Photo Current
Condition : VR = 5V
Condition : VR=5V
1.5
10
1.4
Relative Photo Current
Relative Photo Current
1.3
1
0.1
1.2
1.1
1
0.9
0.8
0.7
0.6
0.01
0.1
1
Irradiance Ee(mW/cm2)
10
0.5
-30
-10
10
30
50
70
90
Ambient Temperature Ta(℃)
It is based on Ee=5mW/cm2.
Employs a standard tungsten lamp of 2,856K.
2010.12.15
Page : 3
PP1191FB
Surface Mount Photodiode/Side Viewing Type
Technical Data
Ambient Temperature vs. Power Dissipation
Reverse Voltage vs. Photo Current
Condition : Ee=1mW/cm2, Ta=25℃
20
2.40
2.20
2.00
Photo Current Ip [μA]
Power Dissipation Pd(mW)
15
10
5
1.80
1.60
1.40
1.20
0
-30 -20 -10
1.00
0
10
20
30
40
50
60
70
80
90 100
0
2
4
6
8
10
Ambient Temperature Ta(℃)
Reverse Voltage VR (V)
Ambient Temperature vs. Dark Current
Reverse Voltage vs. Dark Current
Condition : VR=10V
12
14
Condition : Ta=25℃
1.E+03
1
1.E+01
Dark Current : Id(nA)
Dark Current : Id(nA)
1.E+02
1.E+00
1.E-01
0.1
1.E-02
1.E-03
-30
0.01
-10
10
30
50
Ambient Temperature : Ta(℃)
2010.12.15
70
90
0
2
4
6
8
10
12
14
Reverse Voltage : VR (V)
Page : 4
PP1191FB
Surface Mount Photodiode/Side Viewing Type
Technical Data
Reverse Voltage vs. Capacitance
Condition : Ta=25℃ , f = 1MHz
Capacitance Ct [pF]
100
10
1
0.1
1
10
100
Reverse Voltage VR (V)
2010.12.15
Page : 5
PP1191FB
Surface Mount Photodiode/Side Viewing Type
Package Dimensions
(Unit: mm)
MASS: (8.5)mg
Recommended Soldering Pattern
Taping Specification
(Unit: mm)
(Unit: mm)
Quantity: 3,000pcs/ reel (standard)
2010.12.15
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PP1191FB
Surface Mount Photodiode/Side Viewing Type
Reflow Soldering Conditions
1) The above profile temperature gives the maximum temperature of the device resin surface.
Please set the temperature so as to avoid exceeding this range.
2) Total times of reflow soldering process shall be no more than 2 times.
When the second reflow soldering process is performed, intervals between the first
and second reflow should be short as possible (while allowing some time for the
component to return to normal temperature after the first reflow) in order to prevent the
device from absorbing moisture.
3) Temperature fluctuation to the device during the pre-heating process shall be minimized.
Manual Soldering Conditions
Iron tip temp.
Soldering time and frequency
2010.12.15
350 ℃
3 s
1 time
(MAX.)
(MAX.)
Page : 7
PP1191FB
Surface Mount Photodiode/Side Viewing Type
Reliability Testing Result
Testing Conditions
Test Item
Applicable Standard
Duration
Failure
Operating Life
EIAJ ED4701/100(101)
Ta=25℃ Maximum Voltage (Dark condition)
1,000 h
0/15
High Temperature
Operating Life
EIAJ ED4701/100(101)
Ta=85℃ VR=5V(Dark condition)
1,000 h
0/15
Low Temperature
Operating Life
EIAJ ED4701/100(101)
Ta=30℃ VR=5V(Dark condition)
1,000 h
0/15
Wet High Temperature
Operating Life
EIAJ ED4701/100(102)
Ta=60℃ Rh=90% VR=5V(Dark condition)
1,000 h
0/15
High Temperature
Storage Life
EIAJ ED4701/200(201)
Ta = Tstg MAX. Maximum Storage Temperature
1,000 h
0/15
Low Temperature
Storage Life
EIAJ ED4701/200(202)
Ta = Tstg MIN. Minmum Storage Temperature
1,000 h
0/15
Wet High Temperature
Storage Life
EIAJ ED4701/100(101)
Ta=60℃ Rh=90%
1,000 h
0/15
Thermal Shock
EIAJ ED4701/100(105)
Ta = Tstg MAX. ~ Tstg MIN. (each 15min)
5 cycles
0/15
Resistance to Reflow
Soldering
EIAJ ED4701/300(301)
Moisture Soak:30℃ 70% 72h
Preheating:150 ~180℃ 120sec MAX.
Soldering:260℃ 5sec
2 times
0/15
Failure Criteria
Items
Symbols
Conditions
Relitive Photocurrent
Ip
VR=5V, Ee=5mW/cm
Dark Current
ID
VR=10V
2010.12.15
Failure criteria
2
Testing Max. Value ≧Initial Value x 1.3
Testing Min. Value < Initial Value x 0.7
Testing Max. Value ≧ 20mA x 2.5
Page : 8
PP1191FB
Surface Mount Photodiode/Side Viewing Type
Special Notice to Customers Using the Products and
Technical Information Shown in This Data Sheet
1) The technical information shown in the data sheets are limited to the typical characteristics and circuit
examples of the referenced products. It does not constitute the warranting of industrial property nor the
granting of any license.
2) For the purpose of product improvement, the specifications, characteristics and technical data described in
the data sheets are subject to change without prior notice. Therefore it is recommended that the most
updated specifications be used in your design.
3) When using the products described in the data sheets, please adhere to the maximum ratings for operating
voltage, heat dissipation characteristics, and other precautions for use. We are not responsible for any
damage which may occur if these specifications are exceeded.
4) The products that have been described to this catalog are manufactured so that they will be used for the
electrical instrument of the benchmark (OA equipment, telecommunications equipment, AV machine, home
appliance and measuring instrument).
The application of aircrafts, space borne application, transportation equipment, medical equipment and
nuclear power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrong
operation might influence the life or the human body. Please consult us beforehand if you plan to use our
product for the usages of aircrafts, space borne application, transportation equipment, medical equipment
and nuclear power control equipment, etc. except OA equipment, telecommunications equipment, AV
machine, home appliance and measuring instrument.
5) In order to export the products or technologies described in this data sheet which are under the
“Foreign Exchange and Foreign Trade Control Law,” it is necessary to first obtain an export permit from the
Japanese government.
6) No part of this data sheet may be reprinted or reproduced without prior written permission from Stanley
Electric Co., Ltd.
7) The most updated edition of this data sheet can be obtained from the address below:
http://www.stanley-components.com
2010.12.15
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