REF1004 1.2V and 2.5V Micropower VOLTAGE REFERENCE FEATURES DESCRIPTION ● INITIAL ACCURACY: REF1004-1.2 ±4mV REF1004-2.5 ±20mV ● MINIMUM OPERATING CURRENT: REF1004-1.2 10µA REF1004-2.5 20µA ● EXCELLENT LONG TERM TEMPERATURE STABILITY ● VERY LOW DYNAMIC IMPEDANCE ● OPERATES UP TO 20mA ● PACKAGE: 8-Lead SOIC The REF1004-1.2 and REF1004-2.5 are two terminal bandgap reference diodes designed for high accuracy with outstanding temperature characteristics at low operating currents. Prior to the introduction of the REF1004 Micropower Voltage References, accuracy and stability specifications could only be attained by expensive screening of standard devices. The REF1004 is a cost effective solution when reference voltage accuracy, low power, and long term temperature stability are required. REF1004 is a drop-in replacement for the LT1004 as well as an upgraded replacement of the LM185/385 series references. The REF1004C is characterized for operation from 0°C to 70°C and the REF1004I is characterized for operation from –40°C to +85°C. The REF1004 is offered in an 8-lead Plastic SOIC package and shipped in anti-static rails or tape and reel. APPLICATIONS ● BATTERY POWERED TEST EQUIPMENT ● PORTABLE MEDICAL INSTRUMENTATION ● PORTABLE COMMUNICATIONS DEVICES ● A/D AND D/A CONVERTERS ● NOTEBOOK AND PALMTOP COMPUTERS Typical Operating Circuit NC 1 8 Cathode NC 2 7 NC NC 3 6 Cathode Anode 4 5 NC (Top View) International Airport Industrial Park • Mailing Address: PO Box 11400 Tel: (520) 746-1111 • Twx: 910-952-1111 • Cable: BBRCORP • © SBVS002 1992 Burr-Brown Corporation • Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd. • Tucson, AZ 85706 Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132 PDS-1172 Printed in U.S.A. October, 1993 SPECIFICATIONS ELECTRICAL TA = +25°C unless otherwise noted. REF1004-1.2 PARAMETER REFERENCE VOLTAGE REF1004C(1) REF1004I(2) AVERAGE TEMPERATURE COEFFICIENT MIN TYP MAX MIN TYP MAX UNITS IR = 100µA 1.231 1.229 1.225 1.235 1.235 1.235 1.239 1.239 1.239 2.490 2.487 2.480 2.500 2.500 2.500 2.511 2.511 2.511 V IMIN ≤ IR ≤ 20mA 20 MINIMUM OPERATION CURRENT(3) 8 IMIN ≤ IR ≤ 1mA REVERSE BREAKDOWN VOLTAGE CHANGE WITH CURRENT IR = 100µA WIDE BAND NOISE (RMS) 10Hz ≤ IR ≤ 10kHz IR = 100µA LONG TERM STABILITY TA = 25°C ± 0.1°C IR = 100µA 20 10 ppm/°C 12 1 1.5(3) 10 20(3) 1mA ≤ IR ≤ 20mA REVERSE DYNAMIC IMPEDANCE(3) REF1004-2.5 CONDITIONS 0.2 0.6 0.2 20 µA 1 1.5(3) 10 20(3) mV 0.6 Ω 60 120 µV 20 20 ppm/KHr NOTES: (1) This specification applies over the full operating temperature range of 0°C ≤ TA ≤ 70°C. (2) This specification applies over the full operating temperature range of 40°C ≤ TA ≤ +85°C. (3) Denotes the specifications which apply over the full operating temperature range. ORDERING INFORMATION MODEL REF1004C-1.2 REF1004C-2.5 REF1004I-1.2 REF1004I-2.5 TA VZ 0°C to +70°C 0°C to +70°C –40°C to +85°C –40°C to +85°C 1.2V 2.5V 1.2V 2.5V PACKAGE 8-Lead 8-Lead 8-Lead 8-Lead SOIC SOIC SOIC SOIC NOTE: Available in Tape and Reel, Add –TR to Model Number. ORDERING INFORMATION ABSOLUTE MAXIMUM RATINGS Reverse Breakdown Current ........................................................... 30mA Forward Current ................................................................................ 10mA Operating Temperature Range REF1004C ........................................................................ 0°C to +70°C REF1004I ...................................................................... –40°C to +85°C Storage Temperature REF1004C .................................................................. –65°C to +150°C REF1004I .................................................................... –65°C to +150°C Lead Temperature (soldering, 10s) ............................................... +300°C MODEL REF1004C-1.2 REF1004C-2.5 REF1004I-1.2 REF1004I-2.5 PART MARKING BBREF0412 BBREF0425 BBREF0412 BBREF0425 PACKAGE INFORMATION MODEL PACKAGE REF1004C-1.2 REF1004C-2.5 REF1004I-1.2 REF1004I-2.5 8-Pin 8-Pin 8-Pin 8-Pin SOIC SOIC SOIC SOIC PACKAGE DRAWING NUMBER(1) 182 182 182 182 NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix D of Burr-Brown IC Data Book. The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support devices and/or systems. ® REF1004 2 TYPICAL PERFORMANCE CURVES 1.2V TA = +25°C unless otherwise noted. REVERSE CHARACTERISTICS FORWARD CHARACTERISTICS 100 1.2 TA = 25°C Forward Voltage (V) Reverse Current (µA) –40°C ≤ TA ≤ +85°C 10 1 0.8 0.4 0.1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0.0 0.01 1.4 0.1 TEMPERATURE DRIFT 10 100 REVERSE VOLTAGE CHANGE 1.245 16 Output Voltage Change (mV) Reverse Voltage (V) 1 Forward Current (mA) Reverse Voltage (V) 1.240 1.235 1.230 –40°C ≤ TA ≤ +85°C 12 8 4 0 1.225 –55 –35 –15 5 25 45 65 Temperature (°C) 85 105 –4 0.01 125 100 REVERSE DYNAMIC IMPEDANCE REVERSE DYNAMIC IMPEDANCE 10k f = 25Hz –40°C to +85°C Dynamic Impedance (Ω) Reverse Impedance (Ω) 10 1 Reverse Current (mA) 100 10 1 0.1 0.01 0.1 TA = +25°C IREF = 100µA 1k 100 10 1 0.1 0.1 1 10 10 100 Reverse Current (mA) 100 1k 10k 100k 1M Frequency (Hz) ® 3 REF1004 TYPICAL PERFORMANCE CURVES 1.2V (CONT) TA = +25°C unless otherwise noted. FILTERED OUTPUT NOISE NOISE VOLTAGE 700 70 60 500 Integrated Noise (µV) IREF = 100µA TA = 25°C 400 300 200 100 IREF = 100µA 100µA R 50 40 C 30 20 10 0 0 10 100 1k 10k 100k 100 1k RESPONSE TIME 1.5 Output 1.0 0.5 36kΩ VOUT VIN 0.0 5 Input 2.5 0 0 100 200 300 Time (µSec) ® REF1004 10k Cutoff Frequency (Hz) Frequency (Hz) Voltage (V) Noise (nV/√Hz) 600 4 400 500 600 100k TYPICAL PERFORMANCE CURVES 2.5V TA = +25°C unless otherwise noted. REVERSE VOLTAGE CHANGE REVERSE CHARACTERISTICS 6 100 Output Voltage Change (mV) Reverse Current (µA) –40°C ≤ TA ≤ +85°C 10 1 5 –40°C ≤ TA ≤ +85°C 4 3 2 1 0 –1 0.1 0.0 0.5 1.0 1.5 2.0 2.5 –2 0.01 3.0 0.1 1 10 100 Reverse Current (mA) Reverse Voltage (V) TEMPERATURE DRIFT FORWARD CHARACTERISTICS 1.2 2.520 TA = +25°C 2.515 Reference Voltage (V) Forward Voltage (V) 1.0 0.8 0.6 0.4 2.510 2.505 2.500 2.495 2.490 2.485 0.2 2.480 0.0 0.01 2.475 0.1 1 10 –55 100 –35 –15 Forward Current (mA) REVERSE DYNAMIC IMPEDANCE 85 105 125 10k Dynamic Impedance (Ω) f = 25Hz –40°C to +85°C Reverse Impedance (Ω) 25 45 65 Temperature (°C) REVERSE DYNAMIC IMPEDANCE 1000 100 10 1 0.1 0.01 5 TA = +25°C IREF = 100µA 1k 100 10 1 0.1 0.1 1 10 100 10 100 1k 10k 100k 1M Frequency (Hz) Reverse Current (mA) ® 5 REF1004 TYPICAL PERFORMANCE CURVES 2.5V (CONT) TA = +25°C unless otherwise noted. NOISE VOLTAGE FILTERED OUTPUT NOISE 1400 120 1200 100 Integrated Noise (µV) 800 600 400 R 80 C 60 40 20 200 0 10 100 1k 10k 0 100 100k 1k RESPONSE TIME 4.0 3.0 Output 2.0 24kΩ 1.0 VOUT VIN 0.0 5.0 Input 0.0 0 100 200 300 Time (µSec) ® REF1004 10k Cutoff Frequency (Hz) Frequency (Hz) Voltage (V) Noise (nV/√Hz) IREF = 100µA 1000 IREF = 100µA 100µA 6 400 500 600 100k 1.5V (see Note) VI ≥ 5V 3kΩ 100µA 1.235V 22Ω Output + REF1004-1.2 REF1004-1.2 5µF NOTE: Output regulates to 1.285V for IO = 0. FIGURE 1. Low-Noise Reference. FIGURE 3. 1.2V Reference from 1.5V Battery. 9V 5V 510kΩ 50kΩ 1.235V 2.5V REF1004-1.2 REF1004-2.5 FIGURE2. Micropower Reference from 9V Battery. FIGURE 4. 2.5V Reference. Battery Output R1(1) 1% 12V 1MΩ TLC271 LO = Battery Low 133kΩ 1% REF1004-1.2 NOTE: (1) R1 sets trip point, 60.4kΩ per cell for 1.8V per cell. FIGURE 5. Lead-Acid Low-Battery-Voltage Detector. ® 7 REF1004 PACKAGE OPTION ADDENDUM www.ti.com 7-May-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty REF1004C-1.2 ACTIVE SOIC D 8 REF1004C-1.2/2K5 ACTIVE SOIC D REF1004C-1.2/2K5E4 ACTIVE SOIC REF1004C-1.2E4 ACTIVE REF1004C-2.5 75 Lead/Ball Finish MSL Peak Temp (3) Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR REF1004C-2.5/2K5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR REF1004C-2.5/2K5E4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR REF1004C-2.5E4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR REF1004I-1.2 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR REF1004I-1.2/2K5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR REF1004I-1.2/2K5E4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR REF1004I-1.2E4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR REF1004I-2.5 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR REF1004I-2.5/2K5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR REF1004I-2.5/2K5E4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR REF1004I-2.5E4 ACTIVE SOIC D 8 CU NIPDAU Level-3-260C-168 HR 75 Green (RoHS & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 7-May-2008 (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant REF1004C-1.2/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 REF1004C-2.5/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 REF1004I-1.2/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 REF1004I-2.5/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) REF1004C-1.2/2K5 SOIC D 8 2500 346.0 346.0 29.0 REF1004C-2.5/2K5 SOIC D 8 2500 346.0 346.0 29.0 REF1004I-1.2/2K5 SOIC D 8 2500 346.0 346.0 29.0 REF1004I-2.5/2K5 SOIC D 8 2500 346.0 346.0 29.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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