RICHTEK RT9193

RT9193
300mA, Ultra-Low Noise, Ultra-Fast CMOS LDO Regulator
General Description
Features
The RT9193 is designed for portable RF and wireless
applications with demanding performance and space
requirements. The RT9193 performance is optimized for
battery-powered systems to deliver ultra low noise and
low quiescent current. A noise bypass pin is available for
further reduction of output noise. Regulator ground current
increases only slightly in dropout, further prolonging the
battery life. The RT9193 also works with low-ESR ceramic
capacitors, reducing the amount of board space necessary
for power applications, critical in hand-held wireless
devices. The RT9193 consumes less than 0.01μA in
z
Ultra Low Noise for RF Application
z
shutdown mode and has fast turn-on time less than 50μs.
The other features include ultra low dropout voltage, high
output accuracy, current limiting protection, and high ripple
rejection ratio. Available in the SC-70-5, SOT-23-5,
TSOT-23-5, WDFN-6L 2x2 and MSOP-8 packages.
z
Ultra Fast Response in Line/Load Transient
Quick Start-Up (Typically 50us)
< 0.01uA Standby Current When Shutdown
Low Dropout : 220mV @ 300mA
Wide Operating Voltage Ranges : 2.5V to 5.5V
TTL-Logic-Controlled Shutdown Input
Low Temperature Coefficient
Current Limiting Protection
Thermal Shutdown Protection
Only 1μ
μF Output Capacitor Required for Stability
High Power Supply Rejection Ratio
Custom Voltage Available
RoHS Compliant and 100% Lead (Pb)-Free
z
z
z
z
z
z
z
z
z
z
z
Applications
z
Ordering Information
z
RT9193-
z
Package Type
U5 : SC-70-5
B : SOT-23-5
J5 : TSOT-23-5
QW : WDFN-6L 2x2 (W-Type)
F : MSOP-8
z
z
z
CDMA/GSM Cellular Handsets
Battery-Powered Equipment
Laptop, Palmtops, Notebook Computers
Hand-Held Instruments
PCMCIA Cards
Portable Information Appliances
Marking Information
Operating Temperature Range
P : Pb Free with Commercial Standard For marking information, contact our sales representative
G : Green (Halogen Free with Commer- directly or through a Richtek distributor located in your
cial Standard)
area, otherwise visit our website for detail.
Output Voltage
15 : 1.5V
16 : 1.6V
:
49 : 4.9V
50 : 5.0V
1H : 1.85V
2H : 2.85V
4G : 4.75V
Note :
Richtek Pb-free and Green products are :
`
Typical Application Circuit
RT9193
VIN
CIN
1uF/X7R
Chip Enable
VIN
VOUT
GND
EN
COUT
VOUT
1uF/X7R
BP
CBP
22nF
RoHS compliant and compatible with the current requirements of IPC/JEDEC J-STD-020.
`
Suitable for use in SnPb or Pb-free soldering processes.
DS9193-12 February 2009
www.richtek.com
1
RT9193
Pin Configurations
(TOP VIEW)
VOUT
BP
5
4
2
EN
GND
VIN
3
VIN GND EN
1
6
5
2
3
7
4
BP
NC
VOUT
WDFN-6L 2x2
NC
VIN
NC
VOUT
8
2
7
3
6
4
5
NC
EN
BP
GND
MSOP-8
SC-70-5/SOT-23-5/TSOT-23-5
Functional Pin Description
Pin Name
Pin Function
EN
Chip Enable (Active High). Note that this pin is high impedance. There should be a pull low 100kΩ
resistor connected to GND when the control signal is floating.
BP
Reference Noise Bypass.
GND
Ground.
VOUT
Output Voltage.
VIN
Power Input Voltage.
Function Block Diagram
EN
Shutdown
and
Logic Control
Quick
Start
BP
VIN
VREF
+
MOS Driver
Error
Amplifier
VOUT
Current-Limit
and
Thermal
Protection
GND
www.richtek.com
2
DS9193-12 February 2009
RT9193
Absolute Maximum Ratings
z
z
z
z
z
z
z
(Note 1)
Supply Input Voltage -----------------------------------------------------------------------------------------------------Power Dissipation, PD @ TA = 25°C
SC-70-5 ---------------------------------------------------------------------------------------------------------------------TSOT-23-5/SOT-23-5 -----------------------------------------------------------------------------------------------------WDFN-6L 2x2 -------------------------------------------------------------------------------------------------------------MSOP-8 --------------------------------------------------------------------------------------------------------------------Package Thermal Resistance (Note 2)
SOT-70-5, θJA --------------------------------------------------------------------------------------------------------------TSOT-23-5/SOT-23-5, θJA -----------------------------------------------------------------------------------------------TSOT-23-5/SOT-23-5, θJC ----------------------------------------------------------------------------------------------WDFN-6L 2x2, θJA --------------------------------------------------------------------------------------------------------WDFN-6L 2x2, θJC -------------------------------------------------------------------------------------------------------MSOP-8 θJA ---------------------------------------------------------------------------------------------------------------MSOP-8 θJC ---------------------------------------------------------------------------------------------------------------Junction Temperature ----------------------------------------------------------------------------------------------------Lead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------------------Storage Temperature Range -------------------------------------------------------------------------------------------ESD Susceptibility (Note 3)
HBM (Human Body Mode) ---------------------------------------------------------------------------------------------MM (Machine Mode) ------------------------------------------------------------------------------------------------------
Recommended Operating Conditions
z
z
z
z
6V
300mW
400mW
606mW
625mW
333°C/W
250°C/W
25°C/W
165°C/W
20°C/W
160°C/W
55°C/W
150°C
260°C
−65°C to 150°C
2kV
200V
(Note 4)
Supply Input Voltage -----------------------------------------------------------------------------------------------------EN Input Voltage ----------------------------------------------------------------------------------------------------------Junction Temperature Range -------------------------------------------------------------------------------------------Ambient Temperature Range --------------------------------------------------------------------------------------------
2.5V to 5.5V
0V to 5.5V
−40°C to 125°C
−40°C to 85°C
Electrical Characteristics
(VIN = VOUT + 1V, CIN = COUT = 1uF, CBP = 22nF, TA = 25°C, unless otherwise specified)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Output Voltage Accuracy
ΔVOUT
IOUT = 1mA
−2
--
2
%
Current Limit
ILIM
RLOAD = 1Ω
360
400
--
mA
Quiescent Current
IQ
VEN
≥
--
90
130
μA
170
200
Dropout Voltage
(Note 5)
VDROP
1.2V, IOUT = 0mA
IOUT = 200mA, VOUT > 2.8V
IOUT = 300mA, VOUT > 2.8V
--
220
300
mV
Line Regulation
ΔVLINE
VIN = (VOUT + 1V) to 5.5V,
IOUT = 1mA
--
--
0.3
%
Load Regulation
ΔVLOAD
1mA < IOUT < 300mA
--
--
0.6
%
Standby Current
ISTBY
VEN = GND, Shutdown
--
0.01
1
μA
EN Input Bias Current
IIBSD
VEN = GND or VIN
--
0
100
nA
Logic-Low
VIL
VIN = 3V to 5.5V, Shutdown
--
--
0.4
Logic-High
VIH
VIN = 3V to 5.5V, Start-Up
1.2
--
--
EN Threshold Voltage
V
To be continued
DS9193-12 February 2009
www.richtek.com
3
RT9193
Parameter
Symbol
Output Noise Voltage
Power Supply
Rejection Rate
eNO
f = 100Hz
f = 10kHz
PSRR
Test Conditions
10Hz to 100kHz, I OUT = 200mA
COUT = 1uF
COUT = 1uF, IOUT = 10mA
Min
Typ
Max
Unit
--
100
--
uVRMS
--
−70
--
--
−50
--
dB
Thermal Shutdown Temperature
TSD
--
165
--
°C
Thermal Shutdown Temperature
ΔTSD
--
30
--
°C
Note 1. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. θ JA is measured in the natural convection at T A = 25°C on a low effective thermal conductivity test board
(Single Layer, 1S) of JEDEC 51-3 thermal measurement standard.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Note 5. The dropout voltage is defined as VIN − VOUT, which is measured when VOUT is VOUT(NORMAL) − 100mV.
www.richtek.com
4
DS9193-12 February 2009
RT9193
Typical Operating Characteristics
Output Voltage vs. Temperature
1.8
RT9193-15xU5
VIN = 3.3V
CIN = COUT = 1uF X7R
RT9193-15xU5
VIN = 3.3V
CIN = COUT = 1uF X7R
90
Quiescent Current (uA)
1.7
Output Voltage (V)
Quiescent Current vs. Temperature
95
1.6
1.5
1.4
1.3
85
80
75
70
65
1.2
60
-50
-25
0
25
50
75
100
125
-50
-25
0
Dropout Voltage vs. Load Current
200
TJ = 25°C
150
TJ = -40°C
100
50
-40
ILoad = 100mA
0.15
0.2
0.25
0.3
ILoad = 10mA
10
0.01
100
0.1
1K
1
10K
10
100K
100
Load Current (A)
Frequency (kHz)
(Hz)
EN Pin Shoutdown Threshold vs. Temperature
EN Pin Shutdown Response
1.5
RT9193-15xU5
VIN = 3.3V
CIN = COUT = 1uF X7R
EN Pin Voltage
(V)
1.75
1.25
Output Voltage
(V)
EN Pin Shoutdown Threshold (V)
-20
-80
0
0.1
125
VIN = 4V to 5V
CIN = COUT = 1uF, X7R
-60
0.05
100
0
PSRR (dB)
Dropout Voltage (mV)
TJ = 125°C
0
75
PSRR
20
RT9193-33xB
CIN = COUT = 1uF
250
50
Temperature (°C)
Temperature (°C)
300
25
1
0.75
10
VIN = 5V
CIN = COUT = 1uF
1M
1000
RT9193-28xU5
No Load
5
0
2
1
0
0.5
-50
-25
0
25
50
75
100
125
Time (500μs/Div)
Temperature (°C)
DS9193-12 February 2009
www.richtek.com
5
RT9193
Load Transient Response
ILoad = 1mA to 60mA
50
Output Voltage
Deviation (mV)
0
20
0
-20
200
0
50
0
-50
Line Transient Response
Line Transient Response
VIN = 4V to 5V
COUT = 1uF
RT9193-25xB
ILoad = 1mA
5
4
10
0
-10
6
VIN = 4V to 5V
COUT = 1uF
RT9193-25xB
ILoad = 100mA
5
4
10
0
-10
Time (50μs/Div)
Time (100μs/Div)
Noise
Noise
RT9193-30xB
ILoad = 50mA
VIN = 4.5V
CIN = COUT = 1uF, X7R
200
100
100
Noise (μV)
200
0
-100
-200
RT9193-15xU5
ILoad = 50mA
0
-100
-200
f = 10Hz to 100kHz
Time (10ms/Div)
www.richtek.com
6
ILoad = 1mA to 250mA
Time (500μs/Div)
VIN = 4.5V
CIN = COUT = 1uF, X7R
Noise (μV)
VIN = 5V, VOUT = 2.8V
400 CIN = COUT = 1uF
Time (500μs/Div)
Input Voltage
Deviation (V)
6
Load Current
(mA)
VIN = 5V, VOUT = 2.8V
100 CIN = COUT = 1uF
Output Voltage
Deviation (mV)
Output Voltage
Deviation (mV)
Input Voltage
Deviation (V)
Output Voltage
Deviation (mV)
Load Current
(mA)
Load Transient Response
f = 10Hz to 100kHz
Time (10ms/Div)
DS9193-12 February 2009
RT9193
Output Voltage
(V)
EN Pin Voltage
(V)
Start Up
10
VIN = 5V
CIN = COUT = 1uF
RT9193-28xU5
No Load
5
0
2
1
0
Time (10μs/Div)
DS9193-12 February 2009
www.richtek.com
7
RT9193
Applications Information
Like any low dropout regulator, the external capacitors
used with the RT9193 must be carefully selected for
regulator stability and performance. Using a capacitor
whose value is > 1μF on the RT9193 input and the amount
of capacitance can be increased without limit. The input
capacitor must be located a distance of not more than 0.5
inch from the input pin of the IC and returned to a clean
analog ground. Any good quality ceramic or tantalum can
be used for this capacitor. The capacitor with larger value
and lower ESR (equivalent series resistance) provides
better PSRR and line-transient response. The output
capacitor must meet both requirements for minimum
amount of capacitance and ESR in all LDOs application.
The RT9193 is designed specifically to work with low ESR
ceramic output capacitor in space-saving and performance
consideration. Using a ceramic capacitor whose value is
at least 1μF with ESR is > 25mΩ on the RT9193 output
ensures stability. The RT9193 still works well with output
capacitor of other types due to the wide stable ESR range.
Figure 1 shows the curves of allowable ESR range as a
function of load current for various output capacitor values.
Output capacitor of larger capacitance can reduce noise
and improve load transient response, stability, and PSRR.
The output capacitor should be located not more than 0.5
inch from the VOUT pin of the RT9193 and returned to a
clean analog ground.
Region of Stable COUT ESR vs. Load Current
100.00
100
Instable
C OUT ESR (Ω)
Stable
0.01
Simulation Verify
100
The RT9193 features an LDO regulator enable/disable
function. To assure the LDO regulator will switch on, the
EN turn on control level must be greater than 1.2 volts.
The LDO regulator will go into the shutdown mode when
the voltage on the EN pin falls below 0.4 volts. For to
protecting the system, the RT9193 have a quick-discharge
function. If the enable function is not needed in a specific
application, it may be tied to VIN to keep the LDO regulator
in a continuously on state.
Thermal Considerations
Thermal protection limits power dissipation in RT9193.
When the operation junction temperature exceeds 165°C,
the OTP circuit starts the thermal shutdown function turn
the pass element off. The pass element turn on again
after the junction temperature cools by 30°C.
For continue operation, do not exceed absolute maximum
operation junction temperature 125°C. The power
dissipation definition in device is :
PD(MAX) = ( TJ(MAX) − TA ) /θJA
RT9193-15xU5
CIN = COUT = 1uF, X7R
0.00
50
Enable Function
The maximum power dissipation depends on the thermal
resistance of IC package, PCB layout, the rate of
surroundings airflow and temperature difference between
junction to ambient. The maximum power dissipation can
be calculated by following formula :
1
1.00
0
Connecting a 22nF between the BP pin and GND pin
significantly reduces noise on the regulator output, it is
critical that the capacitor connection between the BP pin
and GND pin be direct and PCB traces should be as short
as possible. There is a relationship between the bypass
capacitor value and the LDO regulator turn on time. DC
leakage on this pin can affect the LDO regulator output
noise and voltage regulation performance.
PD = (VIN − VOUT) x IOUT + VIN x IQ
10.00
10
0.10
Bypass Capacitor and Low Noise
150
200
Load Current (mA)
250
300
Where T J(MAX) is the maximum operation junction
temperature 125°C, TA is the ambient temperature and
the θJA is the junction to ambient thermal resistance.
Figure 1
www.richtek.com
8
DS9193-12 February 2009
RT9193
For recommended operating conditions specification of
RT9193, where T J(MAX) is the maximum junction
temperature of the die (125°C) and TA is the maximum
ambient temperature. The junction to ambient thermal
resistance (θJA is layout dependent) for TSOT-23-5/
SOT-23-5 package is 250°C/W, SC-70-5 package is
333°C/W, WDFN-6L 2x2 package is 165°C/W and MSOP8 package is 160°C/W on standard JEDEC 51-3 thermal
test board. The maximum power dissipation at TA = 25°C
can be calculated by following formula :
PD(MAX) = (125°C − 25°C) / 333 = 300mW for
SC-70-5
PD(MAX) = (125°C − 25°C) / 250 = 400mW for
TSOT-23-5/SOT-23-5
PD(MAX) = (125°C − 25°C) / 165 = 606mW for
WDFN-6L 2x2
PD(MAX) = (125°C −25°C) / 160 = 625mW for
MSOP-8
The maximum power dissipation depends on operating
ambient temperature for fixed T J(MAX) and thermal
resistance θJA. For RT9193 packages, the Figure 2 of
derating curves allows the designer to see the effect of
rising ambient temperature on the maximum power
allowed.
700
MSOP-8
WDFN-6L 2x2
Power Dissipation (mW)
600
500
TSOT-23-5/
SOT-23-5
400
SC 70-5
300
200
100
0
0
25
50
75
100
125
Ambient Temperature (°C)
Figure 2. Derating Curve for Packages
DS9193-12 February 2009
www.richtek.com
9
RT9193
Outline Dimension
H
D
L
B
C
b
A
A1
e
Symbol
Dimensions In Millimeters
Dimensions In Inches
Min
Max
Min
Max
A
0.800
1.100
0.031
0.044
A1
0.000
0.100
0.000
0.004
B
1.150
1.350
0.045
0.054
b
0.150
0.400
0.006
0.016
C
1.800
2.450
0.071
0.096
D
1.800
2.250
0.071
0.089
e
0.650
0.026
H
0.080
0.260
0.003
0.010
L
0.210
0.460
0.008
0.018
SC-70-5 Surface Mount Package
www.richtek.com
10
DS9193-12 February 2009
RT9193
H
D
L
B
C
b
A
A1
e
Symbol
Dimensions In Millimeters
Dimensions In Inches
Min
Max
Min
Max
A
0.700
1.000
0.028
0.039
A1
0.000
0.100
0.000
0.004
B
1.397
1.803
0.055
0.071
b
0.300
0.559
0.012
0.022
C
2.591
3.000
0.102
0.118
D
2.692
3.099
0.106
0.122
e
0.838
1.041
0.033
0.041
H
0.080
0.254
0.003
0.010
L
0.300
0.610
0.012
0.024
TSOT-23-5 Surface Mount Package
DS9193-12 February 2009
www.richtek.com
11
RT9193
H
D
L
B
C
b
A
A1
e
Symbol
Dimensions In Millimeters
Dimensions In Inches
Min
Max
Min
Max
A
0.889
1.295
0.035
0.051
A1
0.000
0.152
0.000
0.006
B
1.397
1.803
0.055
0.071
b
0.356
0.559
0.014
0.022
C
2.591
2.997
0.102
0.118
D
2.692
3.099
0.106
0.122
e
0.838
1.041
0.033
0.041
H
0.080
0.254
0.003
0.010
L
0.300
0.610
0.012
0.024
SOT-23-5 Surface Mount Package
www.richtek.com
12
DS9193-12 February 2009
RT9193
D2
D
L
E
E2
1
e
b
A
A1
SEE DETAIL A
2
1
2
1
A3
DETAIL A
Pin #1 ID and Tie Bar Mark Options
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
Symbol
Dimensions In Millimeters
Dimensions In Inches
Min
Max
Min
Max
A
0.700
0.800
0.028
0.031
A1
0.000
0.050
0.000
0.002
A3
0.175
0.250
0.007
0.010
b
0.200
0.350
0.008
0.014
D
1.950
2.050
0.077
0.081
D2
1.000
1.450
0.039
0.057
E
1.950
2.050
0.077
0.081
E2
0.500
0.850
0.020
0.033
e
L
0.650
0.300
0.026
0.400
0.012
0.016
W-Type 6L DFN 2x2 Package
DS9193-12 February 2009
www.richtek.com
13
RT9193
D
L
E1
E
e
A2
A
A1
b
Symbol
Dimensions In Millimeters
Dimensions In Inches
Min
Max
Min
Max
A
0.810
1.100
0.032
0.043
A1
0.000
0.150
0.000
0.006
A2
0.750
0.950
0.030
0.037
b
0.220
0.380
0.009
0.015
D
2.900
3.100
0.114
0.122
e
0.650
0.026
E
4.800
5.000
0.189
0.197
E1
2.900
3.100
0.114
0.122
L
0.400
0.800
0.016
0.031
8-Lead MSOP Plastic Package
Richtek Technology Corporation
Richtek Technology Corporation
Headquarter
Taipei Office (Marketing)
5F, No. 20, Taiyuen Street, Chupei City
8F, No. 137, Lane 235, Paochiao Road, Hsintien City
Hsinchu, Taiwan, R.O.C.
Taipei County, Taiwan, R.O.C.
Tel: (8863)5526789 Fax: (8863)5526611
Tel: (8862)89191466 Fax: (8862)89191465
Email: [email protected]
Information that is provided by Richtek Technology Corporation is believed to be accurate and reliable. Richtek reserves the right to make any change in circuit
design, specification or other related things if necessary without notice at any time. No third party intellectual property infringement of the applications should be
guaranteed by users when integrating Richtek products into any application. No legal responsibility for any said applications is assumed by Richtek.
www.richtek.com
14
DS9193-12 February 2009