RFM SF2109D

SF2109D
•
•
•
•
Low Insertion Loss
3.8 X 3.8 X 1.2 mm Surface-Mount Case
Differential 750 Ohm IN and 900 Ohm OUT
Complies with Directive 2002/95/EC (RoHS)
305.00 MHz
SAW Filter
Pb
Absolute Maximum Ratings
Rating
Value
Units
Maximum Incident Power in Passband
+10
dBm
Max. DC voltage between any 2 terminals
30
VDC
Storage Temperature Range
-40 to +85
°C
Operating Temperature
-15 to +85
°C
Suitable for lead-free soldering - Max Soldering Profile
260°C for 30 s
SM3838-8
Electrical Characteristics
Characteristic
Center Frequency
Insertion Loss
Amplitude Ripple (p-p)
fc-4.0 to fc+4.0 MHz
Low Side Attenuation (fc-9.28 MHz)
Low Side Attenuation (fc-5.78 MHz)
High Side Attenuation (fc+5.78 MHz)
High Side Attenuation (fc+9.28 MHz)
Delay Ripple (p-p)
fc-4.0 to fc+4.0 MHz
Group Delay in Passband
Case Style
Lid Symbolization (Y=year, WW=week, S=shift) See note 4
Sym
fC
IL
Notes
Min
Typ
30
25
20
30
305
7
1.2
35
35
26
35
1
1, 2
1, 2, 3
6
Max
Units
10
2.0
MHz
dB
dB
dB
300
ns
500
SM3838-8 3.8 x 3.8 mm Nominal Footprint
607 YWWS
CAUTION: Electrostatic Sensitive Device. Observe precautions for handling.
Notes:
1.
2.
3.
4.
5.
6.
7.
8.
Unless noted otherwise, all specifications apply over the operating temperature range with filter soldered to the specified demonstration board with impedance
matching to 50 Ω and measured with 50 Ω network analyzer.
Unless noted otherwise, all frequency specifications are referenced to the nominal center frequency, fc.
Rejection is measured as attenuation below the minimum IL point in the passband. Rejection in final user application is dependent on PCB layout and external
impedance matching design. See Application Note No. 42 for details.
The design, manufacturing process, and specifications of this filter are subject to change.
Tape and Reel Standard Per ANSI / EIA 481.
US and international patents may apply.
RFM, stylized RFM logo, and RF Monolithics, Inc. are registered trademarks of RF Monolithics, Inc.
©Copyright 1999, RF Monolithics Inc.
www.RFM.com
E-mail: [email protected]
©2008 by RF Monolithics, Inc.
Page 1 of 6
SF2109D - 9/18/08
3 Mar 2006 13:02:04
CH1
S11
1 U FS
3 . 1523
1 : 37 . 277
305 . 000
000
MHz
SF2109D 50 ohm demo
1 . 6450
CH3
S22
1 : 52 . 984
305 . 000
000
nH
1 U FS
7 . 2871
MHz
3 . 8026
nH
1
1
PRm
Cor
Cor
Full
CENTR
CH2
304 . 000
S21
MHz
SPAN
LOG
80 . 000
10 dB/
MHz
CENTR
REF -7.046 dB
304 . 000
1 : 0 . 0000
MHz
SPAN
dB
80 . 000
0 . 000
000
MHz
MHz
CH2
Max
BW :
Cor
Full
cent
1
:
Markers
REF=1
7 . 378194
MHz
305 . 380082
MHz
Q: 41 . 390
PRm
2
3
CENTER
304 . 000
000
4
1_ loss
MHz
SPAN
80 . 000
000
: -7 . 0214
dB
MHz
3 Mar 2006 13:05:41
CH1
S21
DEL
100 ns/
3 : 22 . 793
REF 500 ns
ns
-8 . 000
000
MHz
SF2109D 50 ohm demo
CH1
Smo
C
: 262 . 50
s . dev
: 39 . 617
ns
: 179 . 82
ns
p-p
3
Markers
REF=2
mean
ns
PRm
2
Full
1
CH2
S21
LOG
1 dB/
3 : - . 37930
REF -7.046 dB
dB
-8 . 000
000
MHz
CH2
C
Full
: -7 . 4435
s . dev
: . 32180
dB
: 1 . 4982
dB
p-p
3
PRm
Markers
REF=2
mean
dB
1
2
CENTER
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E-mail: [email protected]
©2008 by RF Monolithics, Inc.
305 . 400
000
MHz
SPAN
10 . 000
000
MHz
Page 2 of 6
SF2109D - 9/18/08
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E-mail: [email protected]
©2008 by RF Monolithics, Inc.
Page 3 of 6
SF2109D - 9/18/08
www.RFM.com
E-mail: [email protected]
©2008 by RF Monolithics, Inc.
Page 4 of 6
SF2109D - 9/18/08
SM3838-8 Case
8-Terminal Ceramic Surface-Mount Case
3.8 X 3.8 mm Nominal Footprint
Case Dimensions
0.050 TYP.
(1.27)
0.029 TYP.
(O.74)
mm
Inches
Dimension
Min
Nom
Max
Min
Nom
Max
A
B
C
D
E
F
G
H
3.6
3.6
1.05
0.95
0.90
0.50
2.39
1.40
3.8
3.8
1.20
1.10
1.00
0.60
2.54
1.75
4.0
4.0
1.35
1.25
1.10
0.70
2.69
2.05
0.142
0.142
0.041
0.037
0.035
0.020
0.090
0.055
0.150
0.150
0.047
0.043
0.040
0.024
0.100
0.069
0.157
0.157
0.053
0.049
0.043
0.028
0.110
0.080
0.066
(1.68)
Electrical Connections
0.090
(2.29)
Terminals
Differential Input
Differential Output
Ground
Single Ended Operation
Differential Operation
Dot Indicates Pin 1
0.033
(0.84)
0.002
(0.05)
Connection
Port 1
Port 2
1, 2
5, 6
All Others
Return is Ground
Return is Hot
Materials
0.055 TYP.
(1.40)
Solder Pad Ter- Au plating 30 - 60 uInches (76.2-152 uM) over 80-200
mination
uInches (203-508 uM) Ni.
PCB Footprint
Lid
Fe-Ni-Co Alloy Electroless Nickel Plate (8-11% Phosphorus) 100-200 uInches Thick
Body
Al2O3 Ceramic
Pb Free
TOP VIEW
BOTTOM VIEW
A
2
3
607
YWWS
1
E
C
B
8
8
7
H 7
1
6
6
2
5
5
3
4
4
D
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E-mail: [email protected]
©2008 by RF Monolithics, Inc.
G
F
Page 5 of 6
SF2109D - 9/18/08
Tape and Reel Specifications
“B “
"B" REF.
100 REF.
Inches
Quantity Per Reel
millimeters
7
178
500
13
330
3000
See Detail "A"
13.
0
12.0
20
.2
2.0
COMPONENT ORIENTATION and DIMENSIONS
Carrier Tape Dimensions
2.0
4.25 mm
Bo
4.25 mm
Ko
1.30 mm
Pitch
8.0 mm
W
12.0 mm
4.0
PIN #1
A
1.50
1.75
0.3 ± 0.05
Ao
Bo
B
Ao
12.0
5.5
RO.3
(MAX.)
B
Pitch
A
Ko
R0.5
(MAX.)
1.5
SECTION A-A
SECTION B-B
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E-mail: [email protected]
©2008 by RF Monolithics, Inc.
USER DIRECTION OF FEED
Page 6 of 6
SF2109D - 9/18/08