OSRAM SFH4250_12

IR-Lumineszenzdiode (850 nm) mit hoher Ausgangsleistung
High Power Infrared Emitter (850 nm)
Lead (Pb) Free Product - RoHS Compliant
SFH 4250
Wesentliche Merkmale
Features
• Infrarot LED mit sehr hoher Ausgangsleistung
• Hohe Bestromung bei hohen Temperaturen
möglich
• Kurze Schaltzeiten
• High Power Infrared LED
• High forward current allowed at high
temperature
• Short switching times
Anwendungen
Applications
• Infrarotbeleuchtung für CMOS Kameras
• IR-Datenübertragung
• Sensorik
• Infrared Illumination for CMOS cameras
• IR Data Transmission
• Optical sensors
Sicherheitshinweise
Safety Advices
Je nach Betriebsart emittieren diese Bauteile
hochkonzentrierte, nicht sichtbare InfrarotStrahlung, die gefährlich für das menschliche
Auge sein kann. Produkte, die diese Bauteile
enthalten, müssen gemäß den Sicherheitsrichtlinien der IEC-Normen 60825-1 und 62471
behandelt werden.
Depending on the mode of operation, these
devices emit highly concentrated non visible
infrared light which can be hazardous to the
human eye. Products which incorporate these
devices have to follow the safety precautions
given in IEC 60825-1 and IEC 62471.
Typ
Type
Bestellnummer
Ordering Code
Strahlstärkegruppierung1) (IF = 100 mA, tp = 20 ms)
Radiant Intensity Grouping1)
Ie (mW/sr)
SFH 4250
Q65110A2465
≥ 10 (typ. 15)
1)
gemessen bei einem Raumwinkel Ω = 0.01 sr / measured at a solid angle of Ω = 0.01 sr
2009-05-14
1
SFH 4250
Grenzwerte (TA = 25 °C)
Maximum Ratings
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Betriebs- und Lagertemperatur
Operating and storage temperature range
Top , Tstg
– 40 … + 100
°C
Sperrspannung
Reverse voltage
VR
5
V
Vorwärtsgleichstrom
Forward current
IF
100
mA
Stoßstrom, tp = 100 μs, D = 0
Surge current
IFSM
1.5
A
Verlustleistung
Power dissipation
Ptot
180
mW
300
K/W
140
K/W
Wärmewiderstand Sperrschicht - Umgebung bei RthJA
Montage auf FR4 Platine, Padgröße je 16 mm2
Thermal resistance junction - ambient mounted
on PC-board (FR4), padsize 16 mm2 each
Wärmewiderstand Sperrschicht - Lötstelle bei
RthJS
Montage auf Metall-Block
Thermal resistance junction - soldering point,
mounted on metal block
Kennwerte (TA = 25 °C)
Characteristics
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Wellenlänge der Strahlung
Wavelength at peak emission
IF = 100 mA
λpeak
860
nm
Centroid-Wellenlänge der Strahlung
Centroid wavelength
IF = 100 mA
λcentroid
850
nm
Spektrale Bandbreite bei 50% von Imax
Spectral bandwidth at 50% of Imax
IF = 100 mA
Δλ
42
nm
Abstrahlwinkel
Half angle
ϕ
± 60
Grad
deg.
Aktive Chipfläche
Active chip area
A
0.09
mm2
2009-05-14
2
SFH 4250
Kennwerte (TA = 25 °C)
Characteristics (cont’d)
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Abmessungen der aktiven Chipfläche
Dimension of the active chip area
L×B
L×W
0.3 × 0.3
mm²
Schaltzeiten, Ie von 10% auf 90% und von 90%
auf 10%, bei IF = 100 mA, RL = 50 Ω
Switching times, Ιe from 10% to 90% and from
90% to 10%, IF = 100 mA, RL = 50 Ω
tr , tf
12
ns
VF
VF
1.5 (< 1.8)
2.4 (< 3.0)
V
V
Sperrstrom
Reverse current
IR
not designed for μA
reverse
operation
Gesamtstrahlungsfluss
Total radiant flux
IF = 100 mA, tp = 20 ms
Φe typ
45
mW
Temperaturkoeffizient von Ie bzw. Φe,
TCI
IF = 100 mA
Temperature coefficient of Ie or Φe, IF = 100 mA
– 0.5
%/K
Temperaturkoeffizient von VF, IF = 100 mA
Temperature coefficient of VF, IF = 100 mA
TCV
– 0.7
mV/K
Temperaturkoeffizient von λ, IF = 100 mA
Temperature coefficient of λ, IF = 100 mA
TCλ
+ 0.3
nm/K
Durchlassspannung
Forward voltage
IF = 100 mA, tp = 20 ms
IF = 1 A, tp = 100 µs
2009-05-14
3
SFH 4250
Strahlstärke Ie in Achsrichtung1)
gemessen bei einem Raumwinkel Ω = 0.01 sr
Radiant Intensity Ie in Axial Direction
at a solid angle of Ω = 0.01 sr
Bezeichnung
Parameter
Symbol
Werte
Values
SFH 4250-R
Einheit
Unit
SFH 4250-S
Strahlstärke
Radiant intensity
IF = 100 mA, tp = 20 ms
Ie min
Ie max
10
20
16
32
mW/sr
mW/sr
Strahlstärke
Radiant intensity
IF = 1 A, tp = 100 μs
Ie typ
100
140
mW/sr
1)
Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner 2:1) /
Only one group in one packing unit (variation lower 2:1)
Abstrahlcharakteristik
Radiation Characteristics Irel = f (ϕ)
40˚
30˚
20˚
10˚
0˚
ϕ
50˚
OHL01660
1.0
0.8
0.6
60˚
0.4
70˚
0.2
80˚
0
90˚
100˚
1.0
2009-05-14
0.8
0.6
0.4
0˚
20˚
40˚
60˚
80˚
4
100˚
120˚
SFH 4250
Relative Spectral Emission
Irel = f (λ)
Single pulse, tp = 20 μs
OHF04135
100
Ie
= f (IF)
Ie 100 mA
Radiant Intensity
10
Max. Permissible Forward Current
IF = f (TA), RthJA = 300 K/W
OHL01716
120
OHL01715
1
mA
Ie
I rel %
I F 100
I e (100 mA)
80
100
80
5
60
60
10-1
5
40
40
10-2
20
0
700
20
5
750
800
nm 950
850
10-3 0
10
0
5 10 1
5 10 2
IF
λ
Forward Current IF = f (VF)
Single pulse, tp = 20 μs
IF
10
A
1.6
IF A
1.4
OHF02505
t
1.2
10 -1
5
0.005
0.01
0.02
0.033
0.05
0.1
0.2
0.5
1
0.8
5
0.6
10
-3
0.4
5
10 -4
IF
T
D=
1.0
10 -2
tP
D = TP
0.2
0
0.5
1
1.5
2
2.5 V 3
VF
0 -5
10 10-4 10-3 10-2 10-1 100 101 s 102
tp
2009-05-14
5
0
20
40
60
80
˚C 120
TA
Permissible Pulse Handling
Capability IF = f (τ), TA = 25 °C,
duty cycle D = parameter
OHL01713
0
mA 10 3
SFH 4250
Maßzeichnung
Package Outlines
2.1 (0.083)
3.0 (0.118)
2.6 (0.102)
2.3 (0.091)
2.1 (0.083)
0.1 (0.004) (typ.)
A
Package marking
0.5 (0.020)
C
1.1 (0.043)
A
3.7 (0.146)
3.3 (0.130) 4˚±1
A
3.4 (0.134)
3.0 (0.118)
0.6 (0.024)
0.9 (0.035)
0.7 (0.028)
(2.4) (0.095)
0.8 (0.031)
1.7 (0.067)
0.18 (0.007)
0.12 (0.005)
0.6 (0.024)
0.4 (0.016)
A
A
A
C
GPLY6084
Maße in mm (inch) / Dimensions in mm (inch).
Gehäuse / Package
Power TOPLED®, klarer Verguss / Power TOPLED®, clear resin
Anschlussbelegung
Pin configuration
Kathode: abgeschrägte Ecke
Cathode: beveled edge
2009-05-14
6
SFH 4250
Empfohlenes Lötpaddesign
Recommended Solder Pad Design
Reflow Löten
Reflow Soldering
Padgeometrie für
verbesserte Wärmeableitung
3.3 (0.130)
Paddesign for
improved heat dissipation
3.3 (0.130)
2.3 (0.091)
11.1 (0.437)
1.5 (0.059)
1.1 (0.043)
3.7 (0.146)
0.8 (0.031)
0.7 (0.028)
Cu Fläche / <_ 16 mm 2 per pad
Cu-area
Lötstoplack
Solder resist
Empfohlenes Lötpaddesign
Recommended Solder Pad Design
OHFP3021
Wellenlöten TTW
TTW Soldering
2 (0.079)
6.1 (0.240)
Bewegungsrichtung
der Platine
PCB-direction
1 (0.039)
2 (0.079)
2 (0.079)
3 (0.118)
6 (0.236)
2.8 (0.110)
2.8 (0.110)
0.5 (0.020)
Cu Fläche / > 16 mm 2 per pad
Cu-area
Padgeometrie für
verbesserte Wärmeableitung
Lötstoplack
Solder resist
Paddesign for
improved heat dissipation
2009-05-14
7
OHPY3040
SFH 4250
Lötbedingungen
Soldering Conditions
Reflow Lötprofil für bleifreies Löten
Reflow Soldering Profile for lead free soldering
Vorbehandlung nach JEDEC Level 2
Preconditioning acc. to JEDEC Level 2
(nach J-STD-020C)
(acc. to J-STD-020C)
OHLA0687
300
Maximum Solder Profile
Recommended Solder Profile
Minimum Solder Profile
˚C
255 ˚C
240 ˚C
T 250
˚C
260 ˚C +0
-5 ˚C
245 ˚C ±5 ˚C
˚C
235 ˚C +5
-0 ˚C
217 ˚C
10 s min
200
30 s max
Ramp Down
6 K/s (max)
150
100 s max
120 s max
100
Ramp Up
3 K/s (max)
50
25 ˚C
0
0
50
100
150
200
250
s
300
t
Wellenlöten (TTW)
TTW Soldering
(nach CECC 00802)
(acc. to CECC 00802)
OHLY0598
300
C
T
10 s
250
Normalkurve
standard curve
235 C ... 260 C
Grenzkurven
limit curves
2. Welle
2. wave
200
1. Welle
1. wave
150
ca 200 K/s
2 K/s
5 K/s
100 C ... 130 C
100
2 K/s
50
Zwangskühlung
forced cooling
0
0
50
100
150
200
t
2009-05-14
8
s
250
SFH 4250
Published by
OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com
© All Rights Reserved.
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1
A critical component is a component usedin a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2
Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
2009-05-14
9
Mouser Electronics
Related Product Links
720-SFH4250-Z - Osram Opto Semiconductor SFH 4250-Z