IR-Lumineszenzdiode (850 nm) mit hoher Ausgangsleistung High Power Infrared Emitter (850 nm) Lead (Pb) Free Product - RoHS Compliant SFH 4252 Vorläufige Daten / Preliminary Data Wesentliche Merkmale Features • Infrarot LED mit sehr hoher Ausgangsleistung • Emissionswellenlänge typ. 850 nm • High Power Infrared LED • Peak wavelength typ. 850 nm Anwendungen Applications • Infrarotbeleuchtung für CMOS Kameras • IR-Datenübertragung • Sensorik • Infrared Illumination for CMOS cameras • IR Data Transmission • Optical sensors Sicherheitshinweise Safety Advices Je nach Betriebsart emittieren diese Bauteile hochkonzentrierte, nicht sichtbare InfrarotStrahlung, die gefährlich für das menschliche Auge sein kann. Produkte, die diese Bauteile enthalten, müssen gemäß den Sicherheitsrichtlinien der IEC-Normen 60825-1 und 62471 behandelt werden. Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 60825-1 and IEC 62471. Typ Type Bestellnummer Ordering Code Strahlstärkegruppierung1) (IF = 100 mA, tp = 20 ms) Radiant Intensity Grouping1) Ie (mW/sr) SFH 4252 Q65110A2468 >10 (typ. 16) 1) gemessen bei einem Raumwinkel Ω = 0.01 sr / measured at a solid angle of Ω = 0.01 sr ATTENTION - Observe Precautions For Handling - Electrostatic Sensitive Device 2007-04-25 1 SFH 4252 Grenzwerte (TA = 25 °C) Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range Top , Tstg – 40 … + 100 °C Sperrspannung Reverse voltage VR 5 V Vorwärtsgleichstrom Forward current IF 100 mA Stoßstrom, tp = 200 µs, D = 0 Surge current IFSM 1 A Verlustleistung Power dissipation Ptot 180 mW 450 K/W 200 K/W Wärmewiderstand Sperrschicht - Umgebung bei RthJA Montage auf FR4 Platine, Padgröße je 16 mm2 Thermal resistance junction - ambient mounted on PC-board (FR4), padsize 16 mm2 each Wärmewiderstand Sperrschicht - Lötstelle bei RthJS Montage auf Metall-Block Thermal resistance junction - soldering point, mounted on metal block Kennwerte (TA = 25 °C) Characteristics Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Wellenlänge der Strahlung Wavelength at peak emission IF = 100 mA λpeak 850 nm Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 100 mA ∆λ 35 nm Abstrahlwinkel Half angle ϕ ± 60 Grad deg. Aktive Chipfläche Active chip area A 0.09 mm2 Abmessungen der aktiven Chipfläche Dimension of the active chip area L×B L×W 0.3 × 0.3 mm² 2007-04-25 2 SFH 4252 Kennwerte (TA = 25 °C) Characteristics (cont’d) Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 100 mA, RL = 50 Ω Switching times, Ιe from 10% to 90% and from 90% to 10%, IF = 100 mA, RL = 50 Ω tr , tf 12 ns VF VF 1.5 (< 1.8) 2.4 (< 3.0) V V Sperrstrom Reverse current VR = 5 V IR not designed for µA reverse operation Gesamtstrahlungsfluss Total radiant flux IF = 100 mA, tp = 20 ms Φe typ 40 mW Temperaturkoeffizient von Ie bzw. Φe, TCI IF = 100 mA Temperature coefficient of Ie or Φe, IF = 100 mA – 0.5 %/K Temperaturkoeffizient von VF, IF = 100 mA Temperature coefficient of VF, IF = 100 mA TCV – 0.7 mV/K Temperaturkoeffizient von λ, IF = 100 mA Temperature coefficient of λ, IF = 100 mA TCλ + 0.2 nm/K Durchlassspannung Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 µs 2007-04-25 3 SFH 4252 Strahlstärke Ie in Achsrichtung1) gemessen bei einem Raumwinkel Ω = 0.01 sr Radiant Intensity Ie in Axial Direction at a solid angle of Ω = 0.01 sr Bezeichnung Parameter Symbol Werte Values SFH 4252 -R SFH 4252 -S Einheit Unit Strahlstärke Radiant intensity IF = 100 mA, tp = 20 ms Ie min Ie max 10 20 16 32 mW/sr mW/sr Strahlstärke Radiant intensity IF = 1 A, tp = 100 µs Ie typ 100 140 mW/sr 1) Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner 2:1) / Only one group in one packing unit (variation lower 2:1) Abstrahlcharakteristik Radiation Characteristics Irel = f (ϕ) 40˚ 30˚ 20˚ 10˚ 0˚ ϕ 50˚ OHL01660 1.0 0.8 0.6 60˚ 0.4 70˚ 0.2 80˚ 0 90˚ 100˚ 1.0 2007-04-25 0.8 0.6 0.4 0˚ 20˚ 40˚ 60˚ 80˚ 4 100˚ 120˚ SFH 4252 Relative Spectral Emission Irel = f (λ) Radiant Intensity Single pulse, tp = 20 µs OHL01714 100 Ie = f (IF) Ie 100 mA OHL01715 101 Ie % 10 OHR00883 120 ΙF I e (100 mA) I rel 80 Max. Permissible Forward Current IF = f (TA), RthJA = 450 K/W mA 100 0 80 5 R thjA = 450 K/W 60 10 60 -1 5 40 40 10-2 20 20 5 0 700 750 800 10-3 0 10 nm 950 850 0 5 10 1 5 10 2 λ Forward Current IF = f (VF) Single pulse, tp = 20 µs IF IF Permissible Pulse Handling Capability IF = f (τ), TA = 25 °C, duty cycle D = parameter OHL01713 0 10 A IF 1.2 A OHF02506 t tP D = TP 1.0 10 -1 IF T D= 0.005 0.01 0.02 0.033 0.05 0.1 0.2 0.5 1 0.8 5 0.6 10 -2 5 0.4 10 -3 5 10 -4 mA 10 3 0.2 0 0.5 1 1.5 2 2.5 V 3 VF 2007-04-25 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 tp 5 0 20 40 60 80 100 ˚C 120 TA SFH 4252 Maßzeichnung Package Outlines 2.1 (0.083) 3.0 (0.118) 2.6 (0.102) 2.3 (0.091) 1.7 (0.067) 0.1 (0.004) (typ.) 3.7 (0.146) 3.3 (0.130) 4˚±1 (2.4) (0.095) 3.4 (0.134) 3.0 (0.118) 2.1 (0.083) 0.9 (0.035) 0.7 (0.028) A Cathode marking 0.5 (0.020) 1.1 (0.043) C 0.18 (0.007) 0.12 (0.005) 0.6 (0.024) 0.4 (0.016) GPLY6724 Maße in mm (inch) / Dimensions in mm (inch). Gehäuse / Package TOPLED®, klarer Verguss / TOPLED®, clear resin Anschlussbelegung Pin configuration siehe Zeichnung see drawing 2007-04-25 6 SFH 4252 Empfohlenes Lötpaddesign Recommended Solder Pad Design 4.5 (0.177) 2.6 (0.102) 1.5 (0.059) 1.5 (0.059) 4.5 (0.177) 2.6 (0.102) Padgeometrie für verbesserte Wärmeableitung Lötstopplack Solder resist Paddesign for improved heat dissipation Cu-Fläche > 16 mm 2 Cu-area > 16 mm 2 OHLPY970 Maße in mm (inch) / Dimensions in mm (inch). 2007-04-25 7 SFH 4252 Lötbedingungen Soldering Conditions Reflow Lötprofil für bleifreies Löten Reflow Soldering Profile for lead free soldering Vorbehandlung nach JEDEC Level 2 Preconditioning acc. to JEDEC Level 2 (nach J-STD-020C) (acc. to J-STD-020C) OHLA0687 300 Maximum Solder Profile Recommended Solder Profile Minimum Solder Profile ˚C 255 ˚C 240 ˚C T 250 ˚C 260 ˚C +0 -5 ˚C 245 ˚C ±5 ˚C ˚C 235 ˚C +5 -0 ˚C 217 ˚C 10 s min 200 30 s max Ramp Down 6 K/s (max) 150 100 s max 120 s max 100 Ramp Up 3 K/s (max) 50 25 ˚C 0 0 50 100 150 200 250 s 300 t Wellenlöten (TTW) TTW Soldering (nach CECC 00802) (acc. to CECC 00802) OHLY0598 300 C T 10 s 250 Normalkurve standard curve 235 C ... 260 C Grenzkurven limit curves 2. Welle 2. wave 200 1. Welle 1. wave 150 ca 200 K/s 2 K/s 5 K/s 100 C ... 130 C 100 2 K/s 50 Zwangskühlung forced cooling 0 0 50 100 150 200 t 2007-04-25 8 s 250 SFH 4252 Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com © All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2007-04-25 9