SMD POWER INDUCTOR SPS252010U SERIES 1. PART NO. EXPRESSION : SPS252010U1R0Y (a) (b) (c) (d) (e) (a) Series code (d) Inductance code : 1R0 = 1.0 µH (b) Dimension code (e) Tolerance code : M=± 20% Y=± 30% (c) U : Uncoated B 2. CONFIGURATION & DIMENSIONS : D E D C A Unit:m/m A B C D E 2.50± 0.1 2.20± 0.1 1.0 max. 0.85 ref. 0.80 ref. 3. SCHEMATIC : 4. MATERIALS : a b (a) Core : Ferrite Core (b) Wire : Copper Wire 5. GENERAL SPECIFICATION : a) Isat : Based on inductance change (ƸL/L0 : ̰-30%) @ ambient temp. 25°C b) Irms˖Based on temperature rise ˄ƸT˖40ć.˅ c) Storage temp. : -40° C to +105° C, 50-60%RH (Product without taping) d) Operating temp. : -40° C to +105° C e) Resistance to solder heat : 260± 5° C 10± 0.5secs NOTE : Specifications subject to change without notice. Please check our website for latest information. 01.09.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 SMD POWER INDUCTOR SPS252010U SERIES 6. ELECTRICAL CHARACTERISTICS : Part Number Inductance ( µH ) Tolerance (%) Test Frequency ( Hz ) DCR (ȍ) ± 20% Isat (A) Typ. Isat (A) Typ. SPS252010U1R0Y 1.0 ± 30% 0.1V/1M 0.086 2.60 1.70 SPS252010U1R5Y 1.5 ± 30% 0.1V/1M 0.112 2.20 1.40 SPS252010U2R2M 2.2 ± 20% 0.1V/1M 0.180 1.70 1.10 SPS252010U3R3M 3.3 ± 20% 0.1V/1M 0.256 1.40 1.00 SPS252010U4R7M 4.7 ± 20% 0.1V/1M 0.390 1.10 0.70 SPS252010U6R8M 6.8 ± 20% 0.1V/1M 0.520 0.90 0.60 SPS252010U100M 10 ± 20% 0.1V/1M 0.820 0.80 0.50 7. CHARACTERISTIC CURVES : ˦ˣ˜˅ˈ˅˃˄˃˙ˀ˄˥ˈ SPS252010U1R5Y ˄ ˈ˃ˁ˃ ˃ˁˌ ˇˈˁ˃ ˃ˁˋ ˇ˃ˁ˃ ˄ˁ˅˃ ˇ˃ˁ˃˃ ˃ˁˊ ˆˈˁ˃ ˄ˁ˃˃ ˆˈˁ˃˃ ˃ˁˉ ˆ˃ˁ˃ ˃ˁˈ ˅ˈˁ˃ ˃ˁˇ ˅˃ˁ˃ ˃ˁˆ ˄ˈˁ˃ ˃ˁ˅ ˄˃ˁ˃ ˃ˁ˄ ˈˁ˃ ˃ ˃ˁ˃ ˃ˁ˃˃ ˃ˁ˅˃ ˃ˁˇ˃ ˃ˁˉ˃ ˃ˁˋ˃ ˄ˁ˃˃ ˄ˁ˅˃ ˄ˁˇ˃ ˄ˁˉ˃ ˄ˁˋ˃ ˅ˁ˃˃ ˈ˃ˁ˃˃ ˇˈˁ˃˃ ˆ˃ˁ˃˃ ˃ˁˋ˃ ˅ˈˁ˃˃ ˃ˁˉ˃ ˅˃ˁ˃˃ ˃ˁˇ˃ ˄ˈˁ˃˃ Ϧ˧ʻкʼ ˜́˷̈˶̇˴́˶˸ʻ̈˛ʼ ˄ˁˇ˃ Ϧ˧ʻкʼ ˜́˷̈˶̇˴́˶˸ʻ̈˛ʼ ˦ˣ˜˅ˈ˅˃˄˃˙ˀ˄˥˃ SPS252010U1R0Y ˄˃ˁ˃˃ ˃ˁ˅˃ ˈˁ˃˃ ˃ˁ˃˃ ˃ˁ˃˃ ˃ˁ˃˃ ˃ˁ˄ˈ ˃ˁˆ˃ ˃ˁˇˈ ˃ˁˉ˃ ˃ˁˊˈ ˃ˁˌ˃ ˄ˁ˃ˈ ˄ˁ˅˃ ˄ˁˆˈ ˄ˁˈ˃ ˗˖˶̈̅̅˸́̇ʻ˔ʼ ˗˖˶̈̅̅˸́̇ʻ˔ʼ NOTE : Specifications subject to change without notice. Please check our website for latest information. 01.09.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 SMD POWER INDUCTOR SPS252010U SERIES 7. CHARACTERISTIC CURVES : ˈ˃ˁ˃˃ ˅ˁ˃˃ ˇˈˁ˃˃ ˄ˁˋ˃ ˇ˃ˁ˃˃ ˄ˁ˅˃ ˆ˃ˁ˃˃ ˄ˁ˃˃ ˅ˈˁ˃˃ ˃ˁˋ˃ ˅˃ˁ˃˃ ˃ˁˉ˃ ˄ˈˁ˃˃ ˃ˁˇ˃ ˄˃ˁ˃˃ ˃ˁ˅˃ ˈˁ˃˃ ˜́˷̈˶̇˴́˶˸ʻ̈˛ʼ ˆˈˁ˃˃ ˄ˁˇ˃ Ϧ˧ʻкʼ ˜́˷̈˶̇˴́˶˸ʻ̈˛ʼ ˄ˁˉ˃ ˃ˁ˃˃ ˃ˁ˃˃ ˃ˁ˃˃ ˃ˁ˄ˈ ˃ˁˆ˃ ˃ˁˇˈ ˃ˁˉ˃ ˃ˁˊˈ ˃ˁˌ˃ ˄ˁ˃ˈ ˄ˁ˅˃ ˈ˃ˁ˃˃ ˆˁˆ˃ ˇˈˁ˃˃ ˆˁ˃˃ ˇ˃ˁ˃˃ ˅ˁˊ˃ ˆˈˁ˃˃ ˅ˁˇ˃ ˅ˁ˄˃ ˆ˃ˁ˃˃ ˄ˁˋ˃ ˅ˈˁ˃˃ ˄ˁˈ˃ ˅˃ˁ˃˃ ˄ˁ˅˃ ˄ˈˁ˃˃ ˃ˁˌ˃ ˄˃ˁ˃˃ ˃ˁˉ˃ ˈˁ˃˃ ˃ˁˆ˃ ˃ˁ˃˃ ˃ˁ˃˃ ˃ˁ˃˃ ˃ˁ˄˃ ˃ˁ˅˃ ˃ˁˆ˃ ˃ˁˇ˃ ˃ˁˈ˃ ˃ˁˉ˃ ˃ˁˊ˃ ˃ˁˋ˃ ˃ˁˌ˃ ˄ˁ˃˃ ˄ˁ˄˃ Ϧ˧ʻкʼ ˦ˣ˜˅ˈ˅˃˄˃˙ˀˆ˥ˆ SPS252010U3R3M ˦ˣ˜˅ˈ˅˃˄˃˙ˀ˅˥˅ SPS252010U2R2M ˗˖˶̈̅̅˸́̇ʻ˔ʼ ˗˖˶̈̅̅˸́̇ʻ˔ʼ ˦ˣ˜˅ˈ˄˃˙ˀˇ˥ˊ SPS252010U4R7M ˦ˣ˜˅ˈ˅˃˄˅˙ˀˉ˥ˋ SPS252010U6R8M ˈˁ˃˃ ˈ˃ˁ˃˃ ˉˁ˃˃ ˇˈˁ˃˃ ˇˈˁ˃˃ ˈˁˇ˃ ˆˁˈ˃ ˇ˃ˁ˃˃ ˇ˃ˁ˃˃ ˇˁˋ˃ ˆˁ˃˃ ˆˈˁ˃˃ ˆ˃ˁ˃˃ ˅ˁˈ˃ ˅ˁ˃˃ ˅ˈˁ˃˃ ˄ˁˈ˃ ˅˃ˁ˃˃ ˄ˈˁ˃˃ ˆˈˁ˃˃ ˇˁ˅˃ ˆ˃ˁ˃˃ ˆˁˉ˃ ˅ˈˁ˃˃ ˆˁ˃˃ ˅ˁˇ˃ ˅˃ˁ˃˃ ˄ˁˋ˃ ˄ˈˁ˃˃ ˄˃ˁ˃˃ ˄ˁ˅˃ ˄˃ˁ˃˃ ˃ˁˈ˃ ˈˁ˃˃ ˃ˁˉ˃ ˈˁ˃˃ ˃ˁ˃˃ ˃ˁ˃˃ ˃ˁ˃˃ ˃ˁ˄˃ ˃ˁ˅˃ ˃ˁˆ˃ ˃ˁˇ˃ ˃ˁˈ˃ ˃ˁˉ˃ ˃ˁˊ˃ ˃ˁˋ˃ ˃ˁˌ˃ ˄ˁ˃˃ ˃ˁ˃˃ ˄ˁ˃˃ Ϧ˧ʻкʼ ˜́˷̈˶̇˴́˶˸ʻ̈˛ʼ ˇˁ˃˃ ˜́˷̈˶̇˴́˶˸ʻ̈˛ʼ ˉˁˉ˃ ˈ˃ˁ˃˃ Ϧ˧ʻкʼ ˈˈˁ˃˃ ˇˁˈ˃ ˃ˁ˃˃ ˃ˁ˃˃ ˃ˁ˄˃ ˗˖˶̈̅̅˸́̇ʻ˔ʼ ˃ˁ˅˃ ˃ˁˆ˃ ˃ˁˇ˃ ˃ˁˈ˃ ˃ˁˉ˃ ˃ˁˊ˃ ˃ˁˋ˃ ˗˖˶̈̅̅˸́̇ʻ˔ʼ ˦ˣ˜˅ˈ˅˃˄˃˙ˀ˄˃˃ SPS252010U100M ˄˃ˁ˃˃ ˈˈˁ˃˃ ˈ˃ˁ˃˃ ˇˈˁ˃˃ ˇ˃ˁ˃˃ ˆˈˁ˃˃ ˆ˃ˁ˃˃ ˅ˈˁ˃˃ ˅˃ˁ˃˃ ˄ˈˁ˃˃ ˋˁ˃˃ ˜́˷̈˶̇˴́˶˸ʻ̈˛ʼ ˊˁ˃˃ ˉˁ˃˃ ˈˁ˃˃ ˇˁ˃˃ ˆˁ˃˃ ˅ˁ˃˃ Ϧ˧ʻкʼ ˉ˃ˁ˃˃ ˌˁ˃˃ ˄˃ˁ˃˃ ˈˁ˃˃ ˃ˁ˃˃ ˄ˁ˃˃ ˃ˁ˃˃ ˃ˁ˃˃ ˃ˁ˄˃ ˃ˁ˅˃ ˃ˁˆ˃ ˃ˁˇ˃ ˃ˁˈ˃ ˃ˁˉ˃ ˗˖˶̈̅̅˸́̇ʻ˔ʼ NOTE : Specifications subject to change without notice. Please check our website for latest information. 01.09.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 SMD POWER INDUCTOR SPS252010U SERIES 8. RELIABILITY & TEST CONDITION : ITEM PERFORMANCE TEST CONDITION Operating Temperature -40 to +105° C Storage Temperature -40 to +105° C, 50-60%RH Product without taping Rated Current Base on temp. rise & ƸL/L0A̰30%. Saturation DC current (Isat) will cause L0 to drop approximately ƸL(%) Temperature Rise Test 40°C max. (ǻt) Heat Rated Current (Irms) will cause the coil temperature 1. Applied the allowed DC current 2. Temperature measured by hte digital surface thermometer Solder Heat Resistance Appearance : No significant abnormality Impedance change : Within ± 20% Preheating Dipping 260° C 150° C Solderability 60 seconds Natural cooling 10± 0.5 seconds More than 90% of the terminal electrode should be covered with solder. Preheating Dipping 245° C 150° C Thermal shock 60 seconds Preheat : 150° C, 60sec. Solder : Sn-Cu0.5% Solder Temperature : 260± 5° C Flux for lead free : rosin Dip Time : 10± 0.5sec. Natural cooling Preheat : 150° C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 245± 5° C Flux for lead free : rosin Dip Time : 4± 1sec. 4± 1.0 seconds Appearance: no damage Inductance: within± 20% initial value Phase Temperature (° C) Times (min.) 1 -55 +0/-2° C 15± 1 2 Room temp. 5 3 +85 +2/-0° C 15± 1 4 Room Temp. 5 Condition for 1 cycle Step 1: -55+0/-2° C 15± 1 min. Step 2: Room temperature 5 min. Step 3: +85 +2/-0° C 15± 1min. Step 4: Room temperature 5 min. Number of cycles: 100 Measured : 100 times Humidity Resistance Test Appearance : No damage. Impedance : Within ± 20% of initial value. Humidity : 90~95% RH. Temperature : 40± 2° C Duration : 500 hrs Measured at room temperature after placing for 2 to 3hrs. NOTE : Specifications subject to change without notice. Please check our website for latest information. 01.09.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 SMD POWER INDUCTOR 8. RELIABILITY & TEST CONDITION : ITEM PERFORMANCE TEST CONDITION High Temp. Resistance Test Appearance : No damage. Impedance : Within ± 20% of initial value. Temperature : -40± 2° C Applied current : rated current Duration : 500 hrs Low Temp. Life Test Appearance : No damage. Impedance : Within ± 20% of initial value. Temperature : 105± 2° C Duration : 500 hrs Random Vibration Test Appearance : Cracking, shipping & any other defects harmful to the characteristics should not be allowed. Impedance : Within ± 20% Frequency : 10-55-10Hz for 15 min. Amplitude : 1.52mm Directions & times : X, Y, Z directions for 15 mins. this cycle shall be perfromed 12 times in each of the three mutually perpendicular directions. (Total 9hours). NOTE : Specifications subject to change without notice. Please check our website for latest information. 01.09.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 SMD POWER INDUCTOR SPS252010U SERIES 9. SOLDERING AND MOUNTING : 9-1. Recommended PC Board Pattern 2.2 2.7 0.8 9-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 9-2.1 Lead Free Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 9-2.2 Soldering Iron (Figure 2) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : d) 1.0mm tip diameter (max) a) Preheat circuit and products to 150° C. e) Use a 20 watt soldering iron with tip diameter of 1.0mm b) 355° C tip temperature (max) f) Limit soldering time to 4-5 secs. c) Never contact the ceramic with the iron tip Soldering Natural cooling 20~40s TP(260° C/40s max.) 217 200 150 60~150s 60~180s 25 480s max. Preheating TEMPERATURE ° C TEMPERATURE ° C Preheating Soldering within 4-5s Natural cooling 350 150 Time(sec.) Figure 1. Re-flow Soldering Over 1min. Time(sec.) Gradual Cooling Figure 2. Hand Soldering NOTE : Specifications subject to change without notice. Please check our website for latest information. 01.09.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 SMD POWER INDUCTOR SPS252010U SERIES 10. PACKAGING INFORMATION : 10-1. Reel Dimension D B C A Type A(mm) B(mm) 7" x 8mm 8.4± 1.0 50 min C(mm) D(mm) 13.0± 0.8 178.0± 2.0 7" x 8mm 10-2 Tape Dimension / 8mm P2:2± 0.05 Po:4± 0.1 t P A Ao Bo W:8.0± 0.1 A Series Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm) SPS 252010 2.74± 0.1 2.27± 0.1 1.18± 0.1 4.0± 0.1 0.23± 0.05 none Ko Section A-A 10-3. Packaging Quantity Chip Size 252010 Chip / Reel 2000 10-4. Tearing Off Force The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. F 165° to 180° Top cover tape Room Temp. (° C) Room Humidity (%) Room atm (hPa) Tearing Speed (mm/min) 5~35 45~85 860~1060 300 Base tape Application Notice 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : -10 ~ 40° C and 30 ~ 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. NOTE : Specifications subject to change without notice. Please check our website for latest information. 01.09.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 7