ETC SPT7870

SPT7870
10-BIT, 100 MSPS ECL A/D CONVERTER
FEATURES
APPLICATIONS
•
•
•
•
•
•
•
•
•
•
•
•
•
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10-Bit, 100 MSPS Analog-to-Digital Converter
Monolithic Bipolar
Single-Ended Bipolar Analog Input
-1.0 V to +1.0 V Analog Input Range
Internal Sample-and-Hold
Internal Voltage Reference
Programmable Data Output Formats
Single Ended ECL/PECL Outputs
TTL Version Available as the SPT7871
GENERAL DESCRIPTION
The SPT7870 is a 10-bit, 100 MSPS analog-to-digital converter, with a two stage sub-ranging flash/folder architecture.
The bipolar, single-ended analog input provides an easy
interface for most applications. Programmable data output
formats provide additional ease of implementation and flexibility. The device supports high-speed ECL- and PECL-level
outputs.
Professional Video
HDTV
Communications
Imaging
Digital Oscilloscopes
The resolution and performance of this device makes it well
suited for professional video and HDTV applications. The onchip track-and-hold provides for excellent AC performance
enabling this device to be a converter of choice for RF
communications and digital sampling oscilloscopes. The
SPT7870 is available in a 44L cerquad package in the
industrial temperature range and in die form.
VEE
BLOCK DIAGRAM
Analog Input
VIN
VCC
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T/H
3-Bit
Flash
(MSB)
T/H
3-Bit
DAC
8-Bit Folder
ADC
(LSB)
Error Correction Logic
Output
Latch And
Buffers
Internal
+1.0 V Reference
VT*
VM*
Reference
Ladder
Timing and Control
VB*
Internal
-1.0 V Reference
* Provided for reference decoupling purposes only.
AGND
D10 (Overrange)
D9 (MSB)
D8
D7
D6
D5
D4
D3
D2
D1
D0
MINV
LINV
CLK
NCLK
DGND
Signal Processing Technologies, Inc.
4755 Forge Road, Colorado Springs, Colorado 80907, USA
Phone: (719) 528-2300 FAX: (719) 528-2370 E-Mail: www.spt.com
ABSOLUTE MAXIMUM RATING (Beyond which damage may occur)1
Supply Voltages
VCC ........................................................................... 0 to +6.5 V
VEE ............................................................................. 0 to -6.5 V
Output
Digital Outputs ......................................... +30 to -30 mA
Temperature
Operating Temperature ............................. -40 to + 85 °C
Junction Temperature ........................................ + 175 °C
Lead, Soldering (10 seconds) ............................ + 300 °C
Storage .................................................... -60 to + 150 °C
Input Voltages
Analog Input ............................................. VEE≤VIN≤VCC
LINV/MINV Inputs ......................... -0.5 V to VCC + 0.5 V
CLK/NCLK Inputs ........................................... VEE to 0 V
Note: 1. Operation at any Absolute Maximum Ratings is not implied. See Electrical Specifications for proper nominal applied
conditions in typical applications.
ELECTRICAL SPECIFICATIONS
TA=+25 °C, VCC=+5.0 V, VEE=-5.2 V, VIN=±1.0 V, fClock=80 MHz, 50% clock duty cycle, unless otherwise specified.
PARAMETERS
DC Performance
Resolution
Differential Linearity
Integral Linearity, Best Fit
No Missing Codes
Analog Input
Input Voltage Range
Input Bias Current
Input Resistance
Input Capacitance
Input Bandwidth
±FS Offset Error
Timing Characteristics
Maximum Conversion Rate
Minimum Conversion Rate
Pipeline Delay (Latency)
Transient Response
Overvoltage Recovery Time
Output Delay (td)
Aperture Delay Time
Aperture Jitter Time
Dynamic Performance
Effective Number of Bits
fIN =10 MHz
fIN = 25 MHz
fIN = 25 MHz
fIN = 50 MHz
fIN = 50 MHz
Signal-To-Noise Ratio
fIN =10 MHz
fIN = 25 MHz
fIN = 25 MHz
fIN = 50 MHz
fIN = 50 MHz
Total Harmonic Distortion1
fIN = 10 MHz
fIN = 25 MHz
fIN = 25 MHz
fIN = 50 MHz
fIN = 50 MHz
SPT
TEST
CONDITIONS
TEST
LEVEL
fClock = 6.4 MHz
fClock = 6.4 MHz
Full Temperature
fClock = 6.4 MHz
I
I
V
I
Full Temperature
V
I
I
V
V
IV
I
Full Power
fClock = 100 MHz
fClock = 100 MHz
fClock = 100 MHz
fClock = 100 MHz
fClock = 100 MHz
fClock = 100 MHz
MIN
-1.0
-100
50
150
IV
V
IV
V
V
V
V
V
100
I
I
V
I
V
8.1
8.1
I
I
V
I
V
52
52
I
I
V
I
V
-56
-55
TYP
10
±0.5
±1.0
±2.5
Guaranteed
±1.0
25
150
100
5
180
±20
MAX
+1.25
±2.0
100
±100
52
-47
Bits
LSB
LSB
LSB
V
µA
kΩ
kΩ
pF
MHz
mV
2
10
10
3
1
5
MSPS
MSPS
Clock
ns
ns
ns
ns
ps (rms)
8.5
8.5
8.0
7.8
7.5
Bits
Bits
Bits
Bits
Bits
55
54
51
54
50
dB
dB
dB
dB
dB
-63
-60
-56
-51
-50
dBc
dBc
dBc
dBc
dBc
2
7.4
UNITS
SPT7870
2
9/8/98
ELECTRICAL SPECIFICATIONS
TA=+25 °C, VCC=+5.0 V, VEE=-5.2 V, VIN=±1.0 V, fClock=80 MHz, 50% clock duty cycle, unless otherwise specified.
PARAMETERS
Dynamic Performance
Signal-to-Noise & Distortion (SINAD)
fIN = 10 MHz
fIN = 25 MHz
fIN = 25 MHz
fIN = 50 MHz
fIN = 50 MHz
Spurious Free Dynamic Range
fIN = 10 MHz
fIN = 25 MHz
fIN = 50 MHz
Two-Tone Intermodulation
Dist. Rejection2
Differential Phase
Differential Gain
Power Supply Requirements
+VCC Supply Voltage
- VEE Supply Voltage
+VCC Supply Current
- VEE Supply Current
Power Dissipation
Power Supply Rejection Ratio
Digital Inputs
LINV, MINV
Clock Inputs
Logic 1 Voltage
Logic 0 Voltage
Maximum Input Current Low
Maximum Input Current HIgh
Pulse Width Low (tpwl)
Pulse Width High (tpwh)
Rise/Fall Time
Digital Outputs
Logic 1 Voltage (ECL)
Logic 0 Voltage (ECL)
Logic 1 Voltage (PECL)
Logic 0 Voltage (PECL)
trise
tfall
TEST
CONDITIONS
TEST
LEVEL
I
I
V
I
V
fClock = 100 MHz
fClock = 100 MHz
MIN
MAX
UNITS
54
53
50
48
47
dB
dB
dB
dB
dB
V
V
V
65
62
52
dB FS
dB FS
dB FS
V
V
V
-65
0.5
1
dBc
Degree
%
IV
IV
VI
VI
VI
IV
51
51
TYP
46.5
4.75
-4.95
V
20% to 80%
VI
VI
VI
VI
IV
IV
IV
50 Ω to -2 V, DGND=0.0 V
50 Ω to -2 V, DGND=0.0 V
50 Ω to +3 V, DGND=+5.0 V
50 Ω to +3 V, DGND=+5.0 V
10% to 90%
10% to 90%
VI
VI
IV
IV
V
V
5.0
-5.2
127
202
1.7
30
5.25
-5.45
151
240
2.0
CMOS/TTL
Logic
-1.1
-1.5
+100
+100
250
250
1.5
-100
-100
4.0
4.0
-1.1
3.9
-0.9
-1.7
4.1
3.3
2.0
2.0
V
V
mA
mA
W
dB
-1.5
3.5
V
V
µA
µA
ns
ns
ns
V
V
V
V
ns
ns
12048 pt FFT using distortion harmonics 2 through 10.
2Measured as a second order (f1-f2) intermodulation product from a two-tone test, with each input tone at 0 dBm.
TEST LEVEL CODES
All electrical characteristics are subject to the
following conditions:
All parameters having min/max specifications
are guaranteed. The Test Level column indicates the specific device testing actually performed during production and Quality Assurance inspection. Any blank section in the data
column indicates that the specification is not
tested at the specified condition.
SPT
TEST LEVEL
I
II
TEST PROCEDURE
100% production tested at the specified temperature.
III
QA sample tested only at the specified temperatures.
Parameter is guaranteed (but not tested) by design
and characterization data.
IV
100% production tested at TA=25 °C, and sample
tested at the specified temperatures.
V
Parameter is a typical value for information purposes
only.
VI
100% production tested at TA = 25 °C. Parameter is
guaranteed over specified temperature range.
SPT7870
3
9/8/98
Figure 1 - Timing Diagram
A
A
A
A
A
A
N
CLK
OUTPUT
DATA
N-3
A
A
A
A
A
AA
A
A
A
Table I - Data Output Timing Parameters
N+1
tclk
tpwh
A
A
A
A
tpwl
A
A
A
td
N-2
Timing Parameter
Min
Typ
Max
fclock
2 MHz
100 MHz
Clock Pulse Width High (tpwh) 4.0 ns
250 ns
Clock Pulse Width Low (tpwl) 4.0 ns
250 ns
Switching Delay (td)
3 ns
Clock Latency
2 clock cycles
N+2
DATA VALID
N-1
DATA VALID
N
should both be connected to the analog ground plane. All other
-5.2 V requirements of the external digital logic circuit should
be connected to the digital ground plane. Each power supply
pin should be bypassed as closely as possible to the device
with .01 µF and 2.2 µF capacitors as shown in figure 2.
THEORY OF OPERATION
The SPT7870 uses a two stage subranging architecture
incorporating a 3-bit flash MSB conversion stage followed by
an 8-bit interpolating folder conversion stage. Digital error
correction logic combines the results of both stages to produce
a 10-bit data conversion digital output.
The two grounds available on the SPT7870 are AGND and
DGND. DGND is used only for ECL outputs and is to be
referenced to the output pulldown voltage. These grounds
are not tied together internal to the device. The use of ground
planes is recommended to achieve the best performance of
the SPT7870. The AGND and the DGND ground planes
should be separated from each other and only connected
together at the device through an inductance or ferrite bead.
Doing this will minimize the ground noise pickup.
The analog signal is input directly to the 3-bit flash converter
which performs a 3-bit conversion and in turn drives an internal
DAC used to set the second stage voltage reference level. The
3-bit result from the flash conversion is input to the digital error
correction logic and used in calculation of the upper most
significant bits of the data output.
ANALOG INPUT
The analog input is also input directly to an internal track-andhold amplifier. The signal is held and amplified for use in the
second stage conversion. The output of this track-and-hold is
input into a summing junction that takes the difference between
the track-and-hold amplifier and the 3-bit DAC output. The
residual is captured by a second track-and-hold which holds
and amplifies this residual voltage.
The SPT7870 has a single-ended analog input with a bipolar
input range from -1 V to +1 V. The bipolar input allows for
easier interface by external op amps when compared to
unipolar input devices. Because the input common mode is
0 V, the external op amp can operate without a voltage offset
on the output, thereby maximizing op amp head room and
minimizing distortion.
The residual held by the track-and-hold amplifier is input to an 8-bit
interpolating folder stage for data conversion. The 8-bit converted
data from the folder stage is input into the digital error correction logic
and used in calculation of the lower significant bits.
In addition, the 0 V common mode allows for a very simple DC
coupled analog input connection if desired. The current drive
requirements for the analog input are minimal when compared to conventional flash converters due to the SPT7870’s
low input capacitance of only 5 pF and very high input
impedance of 150 kΩ.
The error correction logic incorporates a proprietary scheme
for compensation of any internal offset and gain errors that
might exist to determine the 10-bit conversion result. The
resultant 10 bit data conversion is internally latched and
presented on the data output pins via buffered output drivers.
CLOCK INPUTS
The clock inputs are designed to be driven differentially with
ECL levels. For optimal noise performance, the clock input
rise time should be a maximum of 1.5 ns. Because of this, the
use of fast logic is recommended. The analog input signal is
latched on the rising edge of the CLK.
TYPICAL INTERFACE CIRCUIT
The SPT7870 requires few external components to achieve the
stated operation and performance. Figure 2 shows the typical
interface requirements when using the SPT7870 in normal circuit
operation. The following section provides a description of the pin
functions and outlines critical performance criteria to consider for
achieving the optimal device performance.
The clock may be driven single-ended since the NCLK pin is
internally biased to -1.3 V. NCLK may be left open but a .01
µF bypass capacitor from NCLK to AGND is recommended.
NOTE: System performance may be degraded due to increased clock noise or jitter.
POWER SUPPLIES AND GROUNDING
The SPT7870 requires the use of two supply voltages, VEE and
VCC. Both supplies should be treated as analog supply sources.
This means the VEE and VCC ground returns of the device
SPT
The performance of the SPT7870 is specified and tested with
a 50% clock duty cycle. However, at sample rates greater
SPT7870
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9/8/98
DIGITAL OUTPUT DATA TIMING
than 80 MSPS, additional gains in dynamic performance of
the device may be obtained by adjusting the clock duty cycle.
Typically, operation between 55 to 60% duty cycle will yield
improved results.
The data is presented on the output pins two clock cycles after
the input is sampled with an additional output delay of
typically 3 ns. The data is held valid for one clock cycle. Refer
to the timing diagram shown in figure 1.
INTERNAL VOLTAGE REFERENCE
DIGITAL OUTPUT CONTROL PINS - MINV, LINV
The SPT7870 incorporates an on-chip voltage reference.
The top and bottom reference voltages are each internally
tied to their respective top and bottom of the internal reference ladder. The pins for the voltage references and the
ladder (including the center of the ladder) are brought out to
pins on the device for decoupling purposes only (pins VT, VM,
and VB). A .01 µF capacitor should be used on each pin and
tied to AGND. See the typical interface circuit (figure 2).
Two digital output control pins control the digital output format.
See table III. The MINV pin is a CMOS/TTL-compatible input.
It inverts the most-significant bit (D9) when tied to +5 V. The
MSB (D9) is noninverted when MINV is tied to ground or
floated. The MINV pin is internally pulled down to ground.
The LINV pin is a CMOS/TTL-compatible input. It inverts the
least-significant bits (D8 through D0) when tied to +5 V. The
least-significant bits (D8 through D0) are noninverted when
LINV is tied to ground or floated. The LINV pin is internally
pulled down to ground.
The internal voltage reference and the internal error correction logic eliminate the need for driving externally the voltage
reference ladder. In fact, the voltage reference ladder should
not be driven with an external voltage reference source as the
internal error correction circuitry already compensates for the
internal voltage and no improvement will result.
Table III - Data Output Bits
DIGITAL OUTPUTS
MINV
0V
0V
+5 V
+5 V
DIGITAL OUTPUT DATA FORMAT - D0 - D9
D0 is the least-significant bit for the digital data output, and D9
is the most-significant bit. Four data output formats are
available and are controlled by the MINV and LINV pins.
Table III shows the four possible output formats possible as
a function of MINV and LINV. Table II shows the output coding
data format versus analog input voltage relationship.
VIN
The SPT7870 supports ECL (10K and 100K compatible) and
PECL logic levels. It has single-ended output drive capability.
ECL termination resistors of 50 Ω to -2 V are required as
shown in the typical interface circuit in figure 2. To interface
to PECL logic levels, supply +5 V to DGND and terminate the
digital outputs through 50 Ω resistors to +3 V.
D10 D9…D0 (Binary*) D9…D0 (2's Comp*)
1
11 1111 1111
01 1111 1111
(+FS)
0
11 1111 1111
01 1111 1111
+1.0 V -1 LSB
0
11 1111 1110
01 1111 1110
0.0 V
0
10 0000 0000
00 0000 0000
0
01 1111 1111
11 1111 1111
-1.0 V +1 LSB
0
00 0000 0001
10 0000 0001
(-FS)
0
00 0000 0000
10 0000 0000
<-1.0 V
0
00 0000 0000
10 0000 0000
Description of Data
Binary (Noninverted)
Two's Complement (Inverted)
Two's Complement (Noninverted)
Binary (Inverted)
ECL AND PECL DIGITAL OUTPUT LEVELS
Table II - Output Coding Data Format
>+1.0 V
LINV
0V
+5 V
0V
+5 V
THERMAL MANAGEMENT
SPT recommends that a heat sink be used for this device to
ensure rated performance. A heat sink in still air provides
adequate thermal performance under laboratory tests. Air
flow may be required for operation at elevated ambient
temperature. SPT recommends that the junction temperature be maintained under +150 °C.
*Refer to table III for possible output formats.
The thermal impedance values for the cerquad package are
θJC = 3.3 °C/W and θJA = 70 °C/W (junction to ambient in still
air with no heat sink).
OVERRANGE BIT - D10
D10 is the overrange bit which is asserted whenever the
analog input signal exceeds the positive full scale input by
1 LSB. When this condition occurs the D10 bit will be asserted
to logic high and remain high continuously until the overrange
condition is removed from the input.
All other output signals will also stay at their maximum
encoded output throughout this condition. D10 is not asserted for an underscale condition when the input exceeds
the negative full scale.
SPT
SPT7870
5
9/8/98
TYPICAL PERFORMANCE CHARACTERISTICS
70
Power Relative to ADC Full Scale (dB)
Dynamic Performance vs. Input Frequency
Sample Rate = 80 MSPS
65
THD
dB
60
SNR
55
50
SINAD
45
40
0
20
40
60
80
Input Frequency (MHz)
100
Single Tone at 14.9 MHz
Sample Rate = 80 MSPS
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
Dynamic Performance vs. Input Frequency
Sample Rate=100 MSPS, 50% Clock Duty Cycle
0
10
20
Frequency (MHz)
30
40
Dynamic Performance vs. Input Frequency
Sample Rate=100 MSPS, 60% Clock Duty Cycle
60
60
THD
55
55
THD
SNR
SNR
50
SINAD
dB
dB
50
45
45
SINAD
40
35
40
0
20
40
60
80
Input Frequency (MHz)
35
100
Dynamic Performance vs. Sample Rate
Input Frequency = 25MHz
65
0
65
20
40
60
80
Input Frequency (MHz)
100
Dynamic Performance vs. Temperature
Sample Rate = 80 MSPS
Input Frequency = 25 MHz
THD
THD
60
60
dB
dB
55
SNR
50
SNR
55
SINAD
45
40
SINAD
60
SPT
70
80
90
100
Sample Rate (MSPS)
50
-25
110
0
25
50
Temperature (°C)
75
100
SPT7870
6
9/8/98
Figure 2 - Typical Interface Circuit
Figure 3 - SPT7870 Clock Input Equivalent
Circuit
-A5.2
+A5
AVCC
*
*
AGND
(ESD)
VCC AGND VEE
DGND
(ESD)
Analog
Input
VIN
6 kΩ
26 kΩ
NCLK
D10
CLK
.01
52 kΩ
D8
VT
-1.3 V
26 kΩ
D9
(ESD)
(ESD)
D7
.01
VM
D6
.01
Interfacing
Logic
D5
VB
D4
VEE
D3
SPT7870
ECL
Differential
Clock Input
Figure 4 - SPT7870 Digital Outputs
Equivalent Circuit
D2
D1
CLK
CLK MINV LINV D0
AGND
DGND
50 Ω
+A5
(ESD)
-D2 V
+A5
-A5.2
FB1
-D2
-D5.2
10 µF
10 µF
10 µF
10 µF
+
+
+
+
-D5.2
ECL/PECL
OUT
+5 V
AGND
-5.2 V
-2 V
DGND
-5.2 V
Notes:
1)
= Line termination.
2)
(ESD)
* = 0.01 µF chip capacitor in parallel with 2.2 µF Tantalum capacitor.
3) Immediate output buffer is highly recommended to optimize the
performance due to reflection.
VEE
PACKAGE OUTLINE
44L Cerquad
44
C
1
A
D
B
INCHES
SYMBOL
MIN
A
0.550 typ
MILLIMETERS
MAX
MIN
B
0.685
0.709
17.40
18.00
C
0.037
0.041
0.94
1.04
D
0.016 typ
E
0.008 typ
F
0.027
G
0.006 typ
H
0.080
0.41 typ
0.20 typ
0.051
0.69
1.30
0.15 typ
0.150
0 - 5°
2.03
3.81
H
A
G
E
B
SPT
MAX
13.97 typ
F
SPT7870
7
9/8/98
AGND
VCC
VCC
35
34
AGND
37
36
VEE
VEE
39
38
LINV
N/C
42
40
N/C
43
PIN FUNCTIONS
41
DGND
DGND
44
PIN ASSIGNMENTS
NAME
I/O
DESCRIPTION
VIN
I
Analog Input
D0-D9
O
Digital Output Data (D0 = LSB)
D10
O
Overflow
DØ
1
33
D1
D2
2
32
VB
N/C
3
31
N/C
CLK
I
Clock (Internal Pull-Down to Ground)
D3
4
30
D4
D5
5
VM
N/C
NCLK
I
Inverted Clock
D6
7
27
VIN
N/C
D7
D8
8
26
N/C
9
25
D9
10
24
VT
VCC
D1Ø
11
23
29
44L Cerquad
21
22
AGND
AGND
17
NCLK
N/C
19
16
CLK
20
15
VEE
14
MINV
N/C
28
VEE
13
DGND
18
12
DGND
6
(Internal Pull-Down to -1.3 V)
LINV
I
MINV
I
VCC
VT
N/A
Invert Least Significant Bits (D0-D8);
CMOS/TTL Level; Invert=+5 V;
Internal Pull-Down to Ground
Invert MSB (D9);
CMOS/TTL Level; Invert=+5 V;
Internal Pull-Down to Ground
Internal Top Reference Decoupling
(+1 V typical)
VM
N/A
Internal Mid-Point Reference Decoupling
(0 V typical)
VB
N/A
Internal Bottom Reference Decoupling
(-1 V typical)
VCC
I
+5 V Analog Supply
VEE
I
-5.2 V Supply
N/C
-
Not Connected
AGND
I
Analog Ground
DGND
I
Digital Ground
ORDERING INFORMATION
PART NUMBER
SPT7870SIQ
SPT7870SCU
TEMPERATURE RANGE
-40 to +85 °C
+25 °C
PACKAGE
44L Cerquad
Die*
*Please see the die specification for guaranteed electrical performance.
Signal Processing Technologies, Inc. reserves the right to change products and specifications without notice. Permission is hereby expressly
granted to copy this literature for informational purposes only. Copying this material for any other use is strictly prohibited.
WARNING - LIFE SUPPORT APPLICATIONS POLICY - SPT products should not be used within Life Support Systems without the specific
written consent of SPT. A Life Support System is a product or system intended to support or sustain life which, if it fails, can be reasonably
expected to result in significant personal injury or death.
Signal Processing Technologies believes that ultrasonic cleaning of its products may damage the wire bonding, leading to device
failure. It is therefore not recommended, and exposure of a device to such a process will void the product warranty.
SPT
SPT7870
8
9/8/98