PHILIPS SSL152X

SSL152x
SMPS ICs for mains LED drivers
Rev. 02 — 10 March 2009
Product data sheet
1. General description
The SSL152x family is a Switched Mode Power Supply (SMPS) controller IC that operates
directly from the rectified universal mains. It is implemented in the high-voltage
EZ-HV SOI process, combined with a low-voltage BiCMOS process. The device includes
a high-voltage power switch and a circuit for start-up directly from the rectified mains
voltage.
A dedicated circuit for valley switching is built in, which makes a very efficient slim-line
electronic concept for solid state lighting applications possible.
The SSL152x can operate in applications with a power range of up to 15 W. For a power
range between 15 W and 25 W the SSL1623PH is the best choice. For LED powers above
25 W the SSL1750 can be used.
In its most basic applications, the SSL152x family acts as a voltage source. Here, no
additional secondary electronics are required. A combined voltage and current source can
be realized with minimum costs for external components. Implementation of the SSL152x
family renders an efficient and low cost power supply system for mains LED drivers.
2. Features
n Designed for mains LED drivers up to 15 W
n Integrated power switch:
u SSL1522T: 12 Ω; 650 V
u SSL1523P: 6.5 Ω; 650 V
n Operates from universal AC mains supplies (80 V to 276 V)
n Adjustable frequency for flexible design
n RC oscillator for load insensitive regulation loop constant
n Valley switching for minimum switch-on loss
n Low standby power (< 100 mW) with frequency reduction at low power outputs
n Adjustable overcurrent protection
n Undervoltage protection
n Temperature protection
n Short circuit winding protection
n Simple application with both primary and secondary (opto) feedback
n Available in DIP8 and SO14 packages
SSL152x
NXP Semiconductors
SMPS ICs for low power systems
3. Applications
n
n
n
n
n
n
Retro fit LED lamps
LED ballasts
Contour lighting
Channel letter lighting
Commercial lighting, e.g. cabinet or freezer lights
Other lighting applications
4. Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VDRAIN
voltage on pin DRAIN
DMOS power transistor; Tj > 0 °C
−0.4
-
+650
V
RDSon
drain-source on-state
resistance
SSL1522T; Isource = −0.25 A
Tj = 25 °C
-
12
13.8
Ω
Tj = 100 °C
-
17
19.6
Ω
Tj = 25 °C
-
6.5
7.5
Ω
Tj = 100 °C
-
9.0
10.0
Ω
−0.4
-
+40
V
10
100
200
kHz
-
1.5
2
mA
SSL1523P; Isource = −0.50 A
VCC
supply voltage
fosc
oscillator frequency
continuous
IDRAIN
current on pin DRAIN
VDRAIN > 60 V
no auxiliary supply
with auxiliary supply
ambient temperature
Tamb
-
30
125
µA
−40
-
+85
°C
5. Ordering information
Table 2.
Ordering information
Type number
Package
Name
Description
Version
SSL1523P
DIP8
plastic dual in-line package; 8 leads (300 mil)
SOT97-1
SSL1522T
SO14
plastic small outline package; 14-leads; body width 3.9 mm
SOT108-1
SSL152X_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 10 March 2009
2 of 17
SSL152x
NXP Semiconductors
SMPS ICs for low power systems
6. Block diagram
VCC
1 (1)
8 (14)
SUPPLY
DRAIN
VALLEY
SSL152x
GND
2 (2, 3, 4,
5, 9, 10)
7 (12, 13)
n.c.
LOGIC
100 mV
stop
RC
3 (6)
OSCILLATOR
THERMAL
SHUTDOWN
PROTECTION
LOGIC
low freq
F
6 (11)
POWER - UP
RESET
1.8
SOURCE
blank
U
overcurrent
4 (7)
2.5 V
10×
0.5 V
5 (8)
REG
AUX
short circuit winding
0.75 V
014aaa563
Pin numbers without parenthesis refer to DIP8 packages and within parenthesis refer to SO14 packages.
Fig 1.
Block diagram
SSL152X_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 10 March 2009
3 of 17
SSL152x
NXP Semiconductors
SMPS ICs for low power systems
7. Pinning information
7.1 Pinning
VCC
1
GND
2
8
DRAIN
7
n.c.
6
SOURCE
5
AUX
SSL1523P
RC
3
REG
4
VCC
1
14 DRAIN
GND
2
13 n.c.
GND
3
12 n.c.
GND
4
GND
5
RC
6
REG
7
014aaa340
Fig 2.
SSL1522T
11 SOURCE
10 GND
9
GND
8
AUX
014aaa341
Pin configuration DIP8
Fig 3.
Pin configuration SO14
7.2 Pin description
Table 3.
Symbol
Pin description
Pin
Description
DIP8
SO14
VCC
1
1
supply voltage
GND
2
2
ground
GND
-
3
ground
GND
-
4
ground
GND
-
5
ground
RC
3
6
frequency setting
REG
4
7
regulation input
AUX
5
8
input for voltage from auxiliary winding for timing
(demagnetization)
GND
-
9
ground
GND
-
10
ground
SOURCE
6
11
source of internal MOS switch
n.c.
7
12
not connected
n.c.
-
13
not connected
DRAIN
8
14
drain of internal MOS switch; input for start-up current and
valley sensing
SSL152X_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 10 March 2009
4 of 17
SSL152x
NXP Semiconductors
SMPS ICs for low power systems
8. Functional description
The SSL152x family is the heart of a compact flyback converter, with the IC placed at the
primary side. The auxiliary winding of the transformer can be used for indirect feedback to
control the isolated output. This additional winding also powers the IC. A more accurate
control of the output voltage and/or current can be implemented with an additional
secondary sensing circuit and opto coupler feedback.
The SSL152x family uses voltage mode control. The switching frequency is determined by
the maximum transformer demagnetizing time and the frequency of the oscillator. In the
first case, the converter operates in the Self Oscillating Power Supply (SOPS) mode. In
the latter case, it operates at a constant frequency, which can be adjusted with external
components RRC and CRC. Furthermore, a primary stroke is started only in a valley of the
secondary ringing. This can use constant power or constant current mode to drive LEDs.
The valley switching principle minimizes capacitive switch-on losses.
8.1 Start-up and undervoltage lockout
Initially, the IC is self-supplying from the rectified mains voltage. The IC starts switching as
soon as the voltage on pin VCC passes the VCC(startup) level. The supply is taken over by
the auxiliary winding of the transformer as soon as VCC is high enough and the supply
from the line is stopped for high efficiency operation.
When for some reason the auxiliary supply is not sufficient, the high-voltage supply also
supplies the IC. As soon as the voltage on pin VCC drops below the VCC(stop) level, the IC
stops switching and restarts from the rectified mains voltage.
8.2 Oscillator
The frequency of the oscillator is set by the external resistor and capacitor on pin RC. The
external capacitor is charged rapidly to the VRC(max) level and, starting from a new primary
stroke, it discharges to the VRC(min) level. Because the discharge is exponential, the
relative sensitivity of the duty factor to the regulation voltage at low duty factor is almost
equal to the sensitivity at high duty factors. This results in a more constant gain over the
duty factor range compared to systems with a linear sawtooth oscillator. Stable operation
at low duty factors is easily realized. For high efficiency, the frequency is reduced as soon
as the duty factor drops below its low power threshold. This is accomplished by increasing
the oscillator charge time.
To ensure that the capacitor can be charged within the charge time, the value of the
oscillator capacitor should be limited to approximately 1 nF.
8.3 Duty factor control
The duty factor is controlled by the internal regulation voltage and the oscillator signal on
pin RC. The internal regulation voltage is equal to the external regulation voltage (minus
2.5 V) multiplied by the gain of the error amplifier (typically 20 dB).
SSL152X_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 10 March 2009
5 of 17
SSL152x
NXP Semiconductors
SMPS ICs for low power systems
8.4 Valley switching
A new cycle is started when the primary switch is switched on (see Figure 4). After a
certain time (determined by the oscillator voltage RC and the internal regulation level), the
switch is turned off and the secondary stroke starts. The internal regulation level is
determined by the voltage on pin REG.
After the secondary stroke, the drain voltage shows an oscillation with a frequency of
approximately:
1
----------------------------------------------2 × π × (L p × C p)
(1)
where:
Lp = primary self-inductance
Cp = parasitic capacitance on drain node
As soon as the oscillator voltage becomes high again and after the secondary stroke has
ended, the circuit waits for a low drain voltage before starting a new primary stroke.
Figure 4 shows the drain voltage together with the valley signal, the signal indicating the
secondary stroke and the RC voltage.
The primary stroke starts some time before the actual valley at low ringing frequencies,
and some time after the actual valley at high ringing frequencies.
primary
stroke
secondary
stroke
secondary
ringing
drain
valley
secondary
stroke
A
RC
oscillator
regulation level
B
mgt423
A: Start of new cycle with valley switching.
B: Start of new cycle in a classical system.
Fig 4.
Signals for valley switching
SSL152X_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 10 March 2009
6 of 17
SSL152x
NXP Semiconductors
SMPS ICs for low power systems
Figure 5 shows a typical curve for a reflected output voltage N × Vo of 80 V. This voltage is
the output voltage Vo (see Figure 6) transferred to the primary side of the transformer with
the factor N (determined by the turns ratio of the transformer). Figure 5 shows that the
system switches at the minimum drain voltage for ringing frequencies of 480 kHz, thus
reducing the switch-on losses to a minimum. At 200 kHz, the next primary stroke is
started at 33 ° before the valley. The switch-on losses are still reduced significantly.
mgt424
40
phase
(°)
20
0
−20
−40
0
200
400
600
800
f (kHz)
Fig 5.
Typical phase of drain ringing at switch-on (at N × Vo = 80 V)
8.5 Demagnetization
The system operates in discontinuous conduction mode all the time. As long as the
secondary stroke has not ended, the oscillator will not start a new primary stroke. During
the first tsup(xfmr_ring) seconds, demagnetization recognition is suppressed. This
suppression may be necessary in applications where the transformer has a large leakage
inductance and at low output voltages.
8.6 Minimum and maximum duty factor
The minimum duty factor of the switched mode power supply is 0 %. The maximum duty
factor is set to 75 % (typical value at 100 kHz oscillation frequency).
8.7 OverCurrent Protection (OCP)
The cycle-by-cycle peak drain current limit circuit uses the external source resistor RI to
measure the current. The circuit is activated after the leading edge blanking time tleb. The
protection circuit limits the source voltage to VSOURCE(max) and thus limits the primary
peak current.
8.8 Short circuit winding protection
The short circuit winding protection circuit is also activated after the leading edge blanking
time. If the source voltage exceeds the short circuit winding protection voltage Vswp, the IC
stops switching. Only a power-on reset will restart normal operation. The short circuit
winding protection also protects in case of a secondary diode short circuit.
SSL152X_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 10 March 2009
7 of 17
SSL152x
NXP Semiconductors
SMPS ICs for low power systems
8.9 OverTemperature Protection (OTP)
An accurate temperature protection is provided in the device. When the junction
temperature exceeds the thermal shutdown temperature, the IC stops switching. During
thermal protection, the IC current is lowered to the start-up current. The IC continues
normal operation as soon as the overtemperature situation has disappeared.
8.10 OverVoltage Protection (OVP)
Overvoltage protection can be achieved in the application by pulling pin REG above its
normal operation level. The current primary stroke is terminated immediately. No new
primary stroke is started until the voltage on pin REG drops to its normal operation level.
Pin REG has an internal clamp. The current feed into this pin must be limited.
8.11 Characteristics of complete LED power supply
8.11.1 Input
The input voltage range comprises the universal AC mains from 80 V to 276 V.
8.11.2 Accuracy
The accuracy of the complete converter, functioning as a voltage source with primary
sensing, is approximately 8 % (mainly dependent on the transformer coupling). The
accuracy with secondary sensing is defined by the accuracy of the external components.
For safety requirements in case of opto coupler feedback loss, the primary sensing
remains active when an overvoltage circuit is connected.
8.11.3 Efficiency
An efficiency over 80 % at maximum output power can be achieved for a complete
converter designed for universal mains.
8.11.4 Ripple
A minimum ripple is obtained in a system designed for a maximum duty factor of 50 %
under normal operating conditions and a minimized dead time. The magnitude of the
ripple in the output voltage is determined by the frequency and duty factor of the
converter, the output current level, and the value and ESR of the output capacitor.
8.11.5 Output
The SSL152x family can handle a wide range of output power levels up to 15 W through
the selection of RDson.
SSL152X_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 10 March 2009
8 of 17
SSL152x
NXP Semiconductors
SMPS ICs for low power systems
9. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are measured
with respect to ground; positive currents flow into the device; pins VCC and RC are not allowed to be
current driven and pins REG and AUX are not allowed to be voltage driven.
Symbol
Parameter
Conditions
Min
Max
Unit
VCC
supply voltage
continuous
−0.4
+40
V
VRC
voltage on pin RC
oscillator input
voltage
−0.4
+3
V
VSOURCE
voltage on pin SOURCE
DMOS power
transistor
−0.4
+5
V
VDRAIN
voltage on pin DRAIN
DMOS power
transistor; Tj > 0 °C
−0.4
+650
V
Voltages
Currents
IREG
current on pin REG
-
6
mA
IAUX
current on pin AUX
−10
+5
mA
Isource
source current
SSL1522T
−1
+1
A
SSL1523P
−2
+2
A
SSL1522T
−1
+1
A
SSL1523P
−2
+2
A
DIP8 package;
Tamb < 45 °C
-
1.0
W
SO14 package;
Tamb < 50 °C
-
1.0
W
IDRAIN
current on pin DRAIN
General
total power dissipation
Ptot
Tstg
storage temperature
−55
+150
°C
Tamb
ambient temperature
−40
+85
°C
Tj
junction temperature
Vesd
electrostatic discharge voltage
−40
+145
°C
human body model
[1]
-
±2500
V
machine model
[2]
-
±200
V
[1]
Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor. All pins
are 2500 V maximum, except pin DRAIN, which is 1000 V maximum.
[2]
Machine model: equivalent to discharging a 200 pF capacitor through a 0.75 µH coil and a 10 Ω series
resistor.
10. Thermal characteristics
Table 5.
Thermal characteristics
Symbol
Parameter
Rth(j-a)
Conditions
Unit
DIP8 package
100
K/W
SO14 package
91
K/W
thermal resistance from junction to ambient in free air
SSL152X_2
Product data sheet
Typ
[1]
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 10 March 2009
9 of 17
SSL152x
NXP Semiconductors
SMPS ICs for low power systems
[1]
Thermal resistance Rth(j-a) can be lower when the GND pins are connected to sufficient copper area on the
printed-circuit board. See the SSL152x application notes for details.
11. Characteristics
Table 6.
Characteristics
Measurement data valid at Tamb = 25 °C; no overtemperature; all voltages are measured with respect to ground; currents are
positive when flowing into the IC; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
ICC(oper)
operating supply current
normal operation
-
1.3
1.9
mA
ICC(startup)
start-up supply current
start-up
-
180
400
µA
ICC
supply current
VDRAIN > 60 V
−6
−4
−3
mA
VCC(startup)
start-up supply voltage
9
9.5
10
V
VCC(stop)
stop supply voltage
undervoltage lockout
7.0
7.5
8.0
V
IDRAIN
current on pin DRAIN
VDRAIN > 60 V
no auxiliary supply
-
1.5
2
mA
with auxiliary supply
-
30
125
µA
-
0
-
%
-
75
-
%
Supply
Pulse width modulator
δmin
minimum duty factor
δmax
maximum duty cycle
f = 100 kHz
SOPS
Vdet(demag)
demagnetization detection voltage
50
100
150
mV
tsup(xfmr_ring)
transformer ringing suppression
time
1.0
1.5
2.0
µs
VRC(min)
minimum voltage on pin RC
60
75
90
mV
VRC(max)
maximum voltage on pin RC
2.4
2.5
2.6
V
tch
charge time
-
1
-
µs
fosc
oscillator frequency
10
100
200
kHz
2.4
2.5
2.6
V
RC oscillator
Duty factor regulator: pin REG
VREG
voltage on pin REG
Gv
voltage gain
Vclamp(REG)
clamp voltage on pin REG
IREG = 6 mA
-
20
-
dB
-
-
7.5
V
−102
-
+102
V/µs
200
550
800
kHz
-
150
-
ns
0.47
0.50
0.53
V
Valley switching
(∆V/∆t)vrec
valley recognition voltage change
with time
fring
ringing frequency
td(vrec-swon)
valley recognition to switch-on
delay time
N × Vo = 100 V
Current and short-circuit winding protection
VSOURCE(max)
maximum voltage on pin SOURCE ∆V/∆t = 0.1 V/µs
td
delay time
∆V/∆t = 0.5 V/µs
-
160
185
ns
Vswp
short-winding protection voltage
∆V/∆t = 0.5 V/µs
0.7
0.75
0.8
V
tleb
leading edge blanking time
250
350
450
ns
SSL152X_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 10 March 2009
10 of 17
SSL152x
NXP Semiconductors
SMPS ICs for low power systems
Table 6.
Characteristics …continued
Measurement data valid at Tamb = 25 °C; no overtemperature; all voltages are measured with respect to ground; currents are
positive when flowing into the IC; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
FET output stage
IL(DRAIN)
leakage current on pin DRAIN
VDRAIN = 650 V
-
-
125
µA
VBR(DRAIN)
breakdown voltage on pin DRAIN
Tj > 0 °C
650
-
-
V
RDSon
drain-source on-state resistance
SSL1522T; Isource = −0.25 A
Tj = 25 °C
-
12
13.8
Ω
Tj = 100 °C
-
17
19.6
Ω
Tj = 25 °C
-
6.5
7.5
Ω
Tj = 100 °C
-
9.0
10.0
Ω
-
75
-
ns
SSL1523P; Isource = −0.50 A
tf(DRAIN)
fall time on pin DRAIN
Vi = 300 V; no external
capacitor at drain
Temperature protection
Tprot
protection temperature
150
160
170
°C
Tprot(hys)
hysteresis of protection
temperature
-
2
-
°C
SSL152X_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 10 March 2009
11 of 17
SSL152x
NXP Semiconductors
SMPS ICs for low power systems
12. Application information
LF
D5
Z1
CF1
C5
D1
CF2
mains
R1
R2
D2
CVCC
RRC
R4
CRC
1
8
2
7
C6 − Ycap
n.c.
SSL1523P
3
6
4
5
RI
RAUX
R3
014aaa562
Fig 6.
Typical configuration of SSL152x - primary sensing
SSL152X_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 10 March 2009
12 of 17
SSL152x
NXP Semiconductors
SMPS ICs for low power systems
13. Package outline
DIP8: plastic dual in-line package; 8 leads (300 mil)
SOT97-1
ME
seating plane
D
A2
A
A1
L
c
Z
w M
b1
e
(e 1)
b
MH
b2
5
8
pin 1 index
E
1
4
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
b2
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73
1.14
0.53
0.38
1.07
0.89
0.36
0.23
9.8
9.2
6.48
6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
1.15
inches
0.17
0.02
0.13
0.068
0.045
0.021
0.015
0.042
0.035
0.014
0.009
0.39
0.36
0.26
0.24
0.1
0.3
0.14
0.12
0.32
0.31
0.39
0.33
0.01
0.045
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
Fig 7.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT97-1
050G01
MO-001
SC-504-8
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-13
Package outline SOT97-1 (DIP8)
SSL152X_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 10 March 2009
13 of 17
SSL152x
NXP Semiconductors
SMPS ICs for low power systems
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A
X
c
y
HE
v M A
Z
8
14
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
7
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.01
0.019 0.0100 0.35
0.014 0.0075 0.34
0.16
0.15
0.010 0.057
inches 0.069
0.004 0.049
0.05
0.244
0.039
0.041
0.228
0.016
0.028
0.024
0.01
0.01
0.028
0.004
0.012
θ
o
8
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
Fig 8.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT108-1
076E06
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Package outline SOT108-1 (SO14)
SSL152X_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 10 March 2009
14 of 17
SSL152x
NXP Semiconductors
SMPS ICs for low power systems
14. Abbreviations
Table 7.
Abbreviations
Acronym
Description
BiCMOS
Bipolar Complementary Metal Oxide Semiconductor
DMOS
Diffusion Metal Oxide Semiconductor
ESR
Equivalent Series Resistance
EZ-HV SOI
Easy High Voltage Silicon-On-Insulator
FET
Field-Effect Transistor
SMPS
Switched Mode Power Supply
SOPS
Self Oscillating Power Supply
15. Revision history
Table 8.
Revision history
Document ID
Release date
Data sheet status
Change notice Doc. number
Supersedes
SSL152X_2
20090310
Product data sheet
-
SSL152X_1
Modifications:
SSL152X_1
•
•
The minimum value of Tamb has changed in Table 1 and Table 4.
The minimum value of Tj has changed in Table 4.
20080915
Product data sheet
-
SSL152X_2
Product data sheet
-
-
-
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 10 March 2009
15 of 17
SSL152x
NXP Semiconductors
SMPS ICs for low power systems
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
16.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
SSL152X_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 10 March 2009
16 of 17
SSL152x
NXP Semiconductors
SMPS ICs for low power systems
18. Contents
1
2
3
4
5
6
7
7.1
7.2
8
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
8.9
8.10
8.11
8.11.1
8.11.2
8.11.3
8.11.4
8.11.5
9
10
11
12
13
14
15
16
16.1
16.2
16.3
16.4
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Start-up and undervoltage lockout . . . . . . . . . . 5
Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Duty factor control. . . . . . . . . . . . . . . . . . . . . . . 5
Valley switching. . . . . . . . . . . . . . . . . . . . . . . . . 6
Demagnetization. . . . . . . . . . . . . . . . . . . . . . . . 7
Minimum and maximum duty factor . . . . . . . . . 7
OverCurrent Protection (OCP) . . . . . . . . . . . . . 7
Short circuit winding protection. . . . . . . . . . . . . 7
OverTemperature Protection (OTP) . . . . . . . . . 8
OverVoltage Protection (OVP) . . . . . . . . . . . . . 8
Characteristics of complete LED power supply 8
Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Ripple . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9
Thermal characteristics. . . . . . . . . . . . . . . . . . . 9
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 10
Application information. . . . . . . . . . . . . . . . . . 12
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15
Legal information. . . . . . . . . . . . . . . . . . . . . . . 16
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Contact information. . . . . . . . . . . . . . . . . . . . . 16
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 10 March 2009
Document identifier: SSL152X_2