SSL21081T/2T/3T/4T GreenChip drivers for LED lighting Rev. 2 — 6 December 2011 Preliminary data sheet 1. General description The SSL2108X is a range of high-voltage Integrated Circuits (ICs), intended to drive LED lamps in general lighting applications. The main benefits of the product family are: • • • • Small Printed-Circuit Board (PCB) footprint, and compact solution High efficiency (up to 95 %) Ease of integration Low electronic Bill Of Material (BOM) The product family is made of ICs with a range of internal HV switches for easy power scaling. The ICs work as boundary conduction mode converters, typically in buck configuration. The IC range has been designed to start up directly from the HV supply by an internal high-voltage current source. Thereafter, the dV/dt supply is used with capacitive coupling from the drain, or any other auxiliary supply. This functionality provides full flexibility in the application design. The IC consumes 1.3 mA of supply current with an internal clamp limiting the supply voltage. The ICs provide accurate output current control with LED current accuracy within 5%. The ICs can be operated using Pulse-Width Modulation (PWM) dimming and has many protection features including easy LED temperature feedback. 2. Features and benefits LED driver IC family driving strings of LEDs from a rectified mains supply High-efficiency switch mode buck driver product family: Drivers with integrated 300 V (SSL21081 and SSL21082) or 600 V (SSL21083 and SSL21084) power switches Controller with power-efficient boundary conduction mode of operation with: No reverse recovery losses in freewheel diode Zero Current Switching (ZCS) for turn-on of switch Zero voltage or valley switching for turn-on of switch Minimal required inductance value and size Direct PWM dimming possible Fast transient response through cycle-by-cycle current control: Negligible AC mains ripple at LED current and minimal total capacitor value SSL21081T/2T/3T/4T NXP Semiconductors GreenChip drivers for LED lighting No over or undershoots in the LED current No binning on LED forward voltage required Internal Protections: UnderVoltage LockOut (UVLO) Leading-Edge Blanking (LEB) OverCurrent Protection (OCP) Short-Winding Protection (SWP) Internal OverTemperature Protection (OTP) Brownout protection Output Short Protection (OSP) Low component count (see Figure 4) LED driver solution: No Schottky diode required due to ZCS No dim switch and high-side driver required for PWM dimming Easy external temperature protection with a single NTC resistor Option for soft-start function Compatible with wall switches with built-in indication light during standby1 IC lifetime easily matches or surpasses LED lamp lifetime 3. Applications SSL2108X products are intended for compact LED lighting applications with accurate fixed current output for single mains input voltages. Mains input voltages include 100 V, 120 V and 230 V (AC). The output signal can be modulated using a PWM signal. 4. Quick reference data Table 1. Symbol Parameter VCC supply voltage RDSon drain-source on-state resistance fconv 1. Quick reference data Conditions Min Typ Max Unit 8.0 - 15.5 V SSL21083T, SSL21084T, TJ = 25 C 4.0 5.0 6.0 SSL21083T, SSL21084T, TJ = 125 C 6.0 7.5 9.0 SSL21081T, SSL21082T, TJ = 25 C 2.05 2.3 2.55 SSL21081T, SSL21082T, TJ = 125 C 3.05 3.45 3.8 25 - 200 kHz conversion frequency The Hotaru switch is a well known wall switch with built-in light SSL21081T_2T_3T_4T Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 2 of 24 SSL21081T/2T/3T/4T NXP Semiconductors GreenChip drivers for LED lighting Table 1. Quick reference data …continued Symbol Parameter Conditions Min Typ Max Unit IDRAIN current on pin DRAIN SSL21083T, SSL21084T 1 - 1 A SSL21081T, SSL21082T 2 - 2 A SSL21083T, SSL21084T - - 600 V SSL21081T, SSL21082T - - 300 V - - 17.5 s voltage on pin DRAIN VDRAIN ton(high) high on-time 5. Ordering information Table 2. Ordering information Type number SSL21081T Package Name Description Version SO8 plastic small package outline body; 8 leads; body width 3.9 mm SOT96-1 SO12 plastic small package outline body; 12 leads; body width SOT1196-1 3.9 mm SSL21083T SSL21082T SSL21084T 5.1 Ordering options Remark: All voltages unless otherwise specified are in V (AC). Table 3. SSL2108X Input voltage platform variants Internal MOSFET Package characteristics Brownout protection selectable SSL21081T 100 V; 120 V 300 V; 2 SO8 no SSL21082T 100 V; 120 V 300 V; 2 SO12 yes SSL21083T 100 V; 120 V; 230 V 600 V; 5 SO8 no SSL21084T 100 V; 120 V; 230 V 600 V; 5 SO12 yes [1] SSL21081T_2T_3T_4T Preliminary data sheet Ordering options The SO12 package variants have more so called fused leads than the SO8 variants and can be used when higher output power is required. All information provided in this document is subject to legal disclaimers. Rev. 2 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 3 of 24 SSL21081T/2T/3T/4T NXP Semiconductors GreenChip drivers for LED lighting 6. Block diagram 1 (1) HV JFET SUPPLY: INTERNAL REGULATOR AND BANDGAP 3 (4) VCC dV/dT SUPPLY 5 (9) VALLEY DETECTION 8 (12) DVDT DRAIN LOGIC TOFFMAX (8) 4 (5) NTC NTC FUNCTION TONMAX TONMAX LOGIC CONTROL AND PROTECTION THERMAL SHUTDOWN BLANK 2 (3) SOURCE POR 1.5 V 6, 7 (2, 6, 7, 10, 11) GND 0.5 V < >0.25 V 001aan694 Fig 1. Block diagram SSL2108X 7. Pinning information 7.1 Pinning HV 1 8 DRAIN SOURCE 2 7 GND VCC 3 6 GND NTC 4 5 DVDT SSL2108X HV 1 12 DRAIN GND 2 11 GND SOURCE 3 VCC 4 9 DVDT NTC 5 8 TONMAX GND 6 7 GND 001aan702 SSL2108X 10 GND 001aan703 Fig 2. SSL21081T_2T_3T_4T Preliminary data sheet Pin configuration for SSL2108X (SO8) Fig 3. All information provided in this document is subject to legal disclaimers. Rev. 2 — 6 December 2011 Pin configuration for SSL2108X (SO12) © NXP B.V. 2011. All rights reserved. 4 of 24 SSL21081T/2T/3T/4T NXP Semiconductors GreenChip drivers for LED lighting 7.2 Pin description Table 4. Pin description Symbol Pin (SO8) SSL2108X Pin (SO12) SSL2108X Description HV 1 1 high-voltage supply pin SOURCE 2 3 low-side internal switch VCC 3 4 supply voltage NTC 4 5 LED temperature protection input GND 6, 7 2,6,7,10,11 ground DVDT 5 9 AC supply pin TONMAX - 8 brownout protection timer input DRAIN 8 12 high-side internal switch 8. Functional description 8.1 Converter operation The converter in the SSL2108X is a Boundary Conduction Mode (BCM), peak current controlled system. For the basic application diagram see Figure 4, for the waveforms see Figure 5. This converter type operates at the boundary between continuous and discontinuous mode. Energy is stored in inductor L each period that the switch is on. The inductor current IL is zero when the internal MOSFET switch is switched on. Thereafter, the amplitude of the current build-up in L is proportional to VIN VOUT and the time that the internal MOSFET switch is on. When the internal MOSFET switch is switched off, the current continues to flow through the freewheel diode and the output capacitor. The current then falls at a rate proportional to the value of VOUT. The LED current ILED is almost equal to half the peak switch current. A new cycle is started, as soon as the inductor current IL is zero. Rinrush Vsec LEDs L DVDT HV VCC DRAIN 8 5 1 SSL2108X 3 6, 7 GND 4 NTC NTC 2 SOURCE Rsense 001aan693 Fig 4. SSL21081T_2T_3T_4T Preliminary data sheet Basic application diagram SSL2108X (SO8 variant) All information provided in this document is subject to legal disclaimers. Rev. 2 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 5 of 24 SSL21081T/2T/3T/4T NXP Semiconductors GreenChip drivers for LED lighting 8.2 Conversion frequency The conversion frequency must be limited to below 200 kHz. Therefore, select an inductance value so that the conversion frequency is always within limits, given the supply voltage, LED voltage and component spread. 8.3 Valley detection A new cycle is started when the primary switch is switched on (see Figure 5). Following time t1, when the peak current is detected on the SOURCE pin, the switch is turned off and the secondary stroke starts (3). When the secondary stroke is complete and the coil current at t3 equals zero, the drain voltage starts to oscillate around the VIN VOUT level. The amplitude equals VOUT. A special feature, called valley detection is an integrated part of the SSL2108X circuitry. Dedicated built-in circuitry connected to the DRAIN pin, senses when the voltage on the drain of the switch has reached its lowest value. The next cycle is then started and as a result the capacitive switching losses are reduced. A valley is detected and accepted if both the frequency of the oscillations and the voltage swing are within the range specified (fring and ∆Vvrec(min)) for detection. If a valid valley is not detected, the secondary stroke is continued until the maximum off-time (toff(high)) is reached, then the next cycle is started. VGATE internal MOSFET switch VOUT VD VIN valley 0 demagnetization magnetization IL 0 2 1 t0 t1 3 t2 4 t3 t00 T 001aan699 Fig 5. Buck waveforms and valley detection 8.4 Protections The IC has the following protections: • UnderVoltage LockOut (UVLO) • Leading-Edge Blanking (LEB) • OverCurrent Protection (OCP) SSL21081T_2T_3T_4T Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 6 of 24 SSL21081T/2T/3T/4T NXP Semiconductors GreenChip drivers for LED lighting • • • • • Internal OverTemperature Protection (OTP) Brownout protection Short-Winding Protection (SWP) Output Short Protection (OSP) LED overtemperature control and protection The SWP and the OSP are latched protections. These protections cause the IC to halt until a reset (a result of power cycling) is executed. When Vcc drops lower than Vcc(rst), the IC resets the latch protection mode. The internal OTP and LED over temperature protections are safe-restart protections. The IC halts, causing VCC to fall lower than VCC(stop), and instigates start-up. Switching starts only when no fault condition exists. 8.4.1 UnderVoltage LockOut (UVLO) When the voltage on the VCC pin drops lower than Vcc(stop), the IC stops switching. An attempt is then made to restart by supplying VCC from the HV pin voltage. 8.4.2 Leading-Edge Blanking (LEB) To prevent false detection of the short-winding or overcurrent, a blanking time following switch-on is implemented. When the internal MOSFET switch turns on there can be a short current spike due to capacitive discharge of voltage over the drain and source. During the LEB time (tleb), the spike is disregarded. 8.4.3 OverCurrent Protection (OCP) The SSL2108X contains a highly accurate peak current detector. It triggers when the voltage at the SOURCE pin reaches the peak-level Vth(ocp)SOURCE. The current through the switch is sensed using a resistor connected to the SOURCE pin. The sense circuit is activated following LEB time tleb. As the LED current is half the peak current (by design), it automatically provides protection for maximum LED current during operation. There is a propagation delay between overcurrent detection and the actual closure of the switch td(ocp-swoff). Due to the delay, the actual peak current is slightly higher than the OCP level set by the resistor in series to the SOURCE pin. 8.4.4 OverTemperature Protection (OTP) When the internal OTP function is triggered at a certain IC temperature (Tth(act)otp), the converter stops operating. The OTP safe-restart protection and the IC restarts again with switching resuming when the IC temperature drops lower than Tth(rel)otp. 8.4.5 Brownout protection Brownout protection is designed to limit the lamp power when the input voltage drops close to the output voltage level. Since the input power has to remain constant, the input current would otherwise increase to a level that is too large for the input circuitry. For the SSL2108X, there is a maximum limit on the on-time of the switch ton(high). The rate of current rise in the coil during the on-phase is proportional to the difference between input voltage and output voltage. Therefore, the peak current cannot be reached before ton(high) and as a result the average output current to the LEDs is reduced. Using the SO12 package, the ton(high) can be lowered by connecting a capacitor to the TONMAX pin. The external capacitor is charged during the primary stroke with ITONMAX. If VTONMAX level is reached before the ton(high) time, the switch is turned off and the SSL21081T_2T_3T_4T Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 7 of 24 SSL21081T/2T/3T/4T NXP Semiconductors GreenChip drivers for LED lighting secondary stroke starts. When no capacitor is connected to the pin, VTONMAX is reached quickly, shorter than the minimum limit of one microsecond. In this case, or in case the TONMAX pin is grounded, the internal time constant, ton(high) determines the maximum on-time. 8.4.6 Short-Winding Protection (SWP) SWP activates if there is a steep rising current through the MOSFET and thus through the external resistor connected to the SOURCE pin. This current can occur when there is a short from the freewheel diode. Additionally, it occurs due to a small/shorted inductor between the input voltage and the DRAIN pin. If the voltage on the SOURCE pin is greater than 1.5 V, latched protection is triggered following LEB time tleb. In addition, if Vcc drops lower than VCC(rst) the IC resets the latched protection mode. 8.4.7 Output Short Protection (OSP) During the second stroke (switch-of time), if a valley is not detected within the off-time limit (toff(high)), then typically the output voltage is less than the minimum limit allowed in the application. This condition can occur either during starting up or due to a short. A timer is started when toff(high) is detected, and is stopped only if a valid valley-detection occurs in one of the subsequent cycles. If no valley is detected for tdet(sc), it is concluded that a real short-circuit exists and not start-up. The IC enters latched protection. If Vcc drops lower than VCC(rst), the IC resets the latched protection mode. During PWM dimming, the OSP timer is paused during the off-cycle of the PWM signal. 8.5 VCC supply The SSL2108X can be supplied using three methods: • Under normal operation, the voltage swing on the DVDT pin is rectified within the IC providing current towards the VCC pin • At start-up, there is an internal current source connected to the HV pin. The current source provides internal power until either the dV/dt supply or an external current on the VCC pin provides the supply • An external voltage source can be connected to the VCC pin The IC starts up when the voltage at the VCC pin is higher than VCC(startup). The IC locks out (stops switching) when the voltage at the VCC pin is lower than VCC(stop). The hysteresis between the start and stop levels allows the IC to be supplied by a buffer capacitor until the dV/dt supply is settled. The SSL2108X has an internal Vcc clamp, which is an internal active Zener (or shunt regulator). This internal active Zener limits the voltage on the supply VCC pin to the maximum value of Vcc. If the maximum current of the dV/dt supply minus the current consumption of the IC (determined by the load on the gate drivers), is lower than the maximum value of IDD no external Zener diode is needed in the dV/dt supply circuit. 8.6 DVDT supply The DVDT pin is connected to an internal single-sided rectification stage. When an alternating voltage with sufficient amplitude is supplied to the pin, the IC can be powered without any other external power connection. This solution provides an effective method SSL21081T_2T_3T_4T Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 8 of 24 SSL21081T/2T/3T/4T NXP Semiconductors GreenChip drivers for LED lighting to prevent the additional high-power losses, which would result if a regulator were used for continuously powering the IC. Unlike an auxiliary supply, additional inductor windings are not needed. 8.7 VCC regulator During supply dips, the input voltage can drop too low to supply the required IC current through the DVDT pin. Under these conditions, if the VCC voltage drops lower than VCC(swon)reg level, another regulator with a current capability of up to IHVhigh(oper) is started. The job of the regulator is to fill in the required supply current, which the DVDT supply does not deliver, thus preventing the IC going into UVLO. When the VCC voltage is higher than VCC(swon)reg level, the regulator is turned off. 8.8 NTC functionality and PWM dimming The NTC pin can be used as a control method for LED thermal protection. Alternatively, the pin can be used as an input to disable/enable light output using a digital signal (PWM dimming). The pin has an internal current source that generates the current of Ioffset(NTC). An NTC resistor to monitor the LED temperature can be directly connected to the NTC pin. Depending on the resistance value and the corresponding voltage on the NTC pin, the converter reacts as shown in Figure 6. Peak Current Vth(ocp)SOURCE = 250 mV Vdeact(tmr) 1 Fig 6. 2 3 4 Vth(NTC)high Ip / 2 Vact(tmr) Vth(ocp)SOURCE = 500 mV Vth(NTC)low Ip 5 VNTC 001aan700 NTC control curve When the voltage on the NTC pin is higher than Vth(high)NTC see Figure 6 (4), the converter delivers nominal output current. When the voltage is lower than this level, the peak current is gradually reduced until Vth(low)NTC is reached, see Figure 6 (3). The peak current is now half the peak current of nominal operation. When Vact(tmr)NTC is passed, see Figure 6 (2) a timer starts to run to distinguish between the following situations: • If the low-level Vdeact(tmr)NTC is not reached within time tto(deact)NTC, Figure 6 (1) LED overtemperature is detected. The IC stops switching and attempts to restart from the HV pin voltage. Restart takes place when the voltage on NTC pin is higher than Vth(high)NTC, see Figure 6 (4). It is assumed that the reduction in peak current did not result in a lower NTC temperature and LED OTP is activated. SSL21081T_2T_3T_4T Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 9 of 24 SSL21081T/2T/3T/4T NXP Semiconductors GreenChip drivers for LED lighting • If the low-level Vdeact(tmr)NTC is reached within the time tto(deact)NTC, Figure 6 (1) it is assumed that the pin is pulled down externally. The restart function is not triggered. Instead, the output current is reduced to zero. PWM dimming can be implemented this way. The output current rises again when the voltage is higher than Vdeact(tmr)NTC. 8.8.1 Soft-start function The NTC pin can be used to make a soft start function. During switch-on, the level on the NTC pin is low. By connecting a capacitor (in parallel with the NTC resistor), a time constant can be defined. The time constant causes the level on the NTC pin to increase slowly. When passing level Vth(low)NTC Figure 6 (3), the convertor starts with half of the maximum current. The output current slowly increases to maximum when Vth(high)NTC Figure 6 (4) is reached. 8.9 Heat sink For SSL2108X (SO12) applications, the copper of the PCB acts as the heat sink. The SSL2108X (SO12) uses thermal leads (pins 2, 6, 10 and 11) for enhanced heat transfer from die to the PCB copper heat sink. The thermal lead connection can drastically reduce thermal resistance. Equation 1 shows the relation between the maximum allowable power dissipation P and the thermal resistance from junction to ambient. R th j – a = T j max – T amb P (1) Where: Rth(j-a) = thermal resistance from junction to ambient Tj(max) = maximum junction temperature Tamb = ambient temperature P = power dissipation SSL21081T_2T_3T_4T Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 10 of 24 SSL21081T/2T/3T/4T NXP Semiconductors GreenChip drivers for LED lighting 9. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit SR slew rate on pin DRAIN 5 +5 V/ns fconv conversion frequency 25 200 kHz Ptot total power dissipation SO8 package - 0.6 W SO12 package - 1 W General Tamb ambient temperature 40 +125 C Tj junction temperature 40 +150 C Tstg storage temperature 55 +150 C Voltages VCC supply voltage continuous [3] 0.4 +14 V VDRAIN voltage on pin DRAIN 600 V version 0.4 +600 V 300 V version 0.4 +300 V VHV voltage on pin HV current limited 0.4 +600 V VSENSE voltage on pin SENSE current limited 0.4 +5.2 V VNTC voltage on pin NTC current limited 0.4 +5.2 V VTONMAX voltage on pin TONMAX current limited 0.4 +5.2 V IDD supply current at pin VCC [3] - 20 mA IDRAIN current on pin DRAIN 600 V version 1 1 A 300 V version 2 2 A 600 V version 1 1 A 300 V version 2 2 A - 1.3 A 2.0 +2.0 KV -1.0 +1.0 KV 500 +500 V Currents ISOURCE current on pin SOURCE IDVDT current on pin DVDT VESD electrostatic discharge voltage human body model; (for all pins except DRAIN and HV) [1] human body model for DRAIN and HV charged device SSL21081T_2T_3T_4T Preliminary data sheet [2] [1] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor. [2] Charged device model: equivalent to charging the IC up to 1 kV and the subsequent discharging of each pin down to 0 V over a 1 resistor. [3] An internal clamp sets the supply voltage and current limits. All information provided in this document is subject to legal disclaimers. Rev. 2 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 11 of 24 SSL21081T/2T/3T/4T NXP Semiconductors GreenChip drivers for LED lighting 10. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-a) thermal resistance from junction to ambient in free air; SO8 package, PCB: 2 cm 3 cm, 2-layer, 35 m Cu per layer 152 K/W in free air; SO12 package, PCB: 2 cm 3 cm, 2-layer, 35 m Cu per layer 121 K/W 11. Characteristics Table 7. Characteristics Symbol Parameter Conditions Min Typ Max Unit Ileak(DRAIN) leakage current on pin DRAIN VDRAIN = 600 V - - 10 A VDRAIN = 300 V - - 10 A Ileak(HV) leakage current on pin HV VHV = 600 V - - 30 A VHV = 300 V - - 30 A High-voltage Supply VCC(startup) start-up supply voltage 11 12 13 V VCC(stop) stop supply voltage 8 9 10 V VCC(hys) hysteresis of supply voltage 2.0 - - V VCC(rst) reset supply voltage 4.5 5 5.5 V VCC(swon)reg regulator switch-on supply voltage insufficient dV/dt supply 8.75 9.25 9.75 V VCC(swoff)reg regulator switch-off supply voltage insufficient dV/dt supply 9.5 10 10.5 V VCC(reg)hys regulator supply voltage hysteresis VCC(swoff)reg VCC(s 0.3 - - V 0.3 - - V between VCC(startup) and VCC(stop) won)reg VCC(regswon-stop) supply voltage difference between regulator switch-on and stop VCC(swon)reg VCC(st op) Consumption Istb(HV) standby current on pin HV during start-up or in protection; VHV = 100 V 300 350 400 A ICC supply current normal operation - 1.3 - mA SSL21081T_2T_3T_4T Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 12 of 24 SSL21081T/2T/3T/4T NXP Semiconductors GreenChip drivers for LED lighting Table 7. Characteristics …continued Symbol Parameter Conditions Min Typ Max Unit high supply current on pin HV Standby: VHV = 40 V; VCC < VCC(stop) 1 1.3 1.6 mA Regulator On: VHV = 40 V; VCC < 2 2.3 2.6 mA V/t = 0.1 V/s 480 500 520 mV V/t = 0.1 V/s VNTC = 0.325 V 230 250 270 mV Capability Isup(high)HV VCC(swon)reg after start-up Current and SWP Vth(ocp)SOURCE overcurrent protection threshold voltage on pin SOURCE td(ocp-swoff) delay time from overcurrent protection to switch-off V/t = 0.1 V/s - 75 100 ns tleb leading edge blanking time overcurrent protection 260 300 340 ns short-winding protection 210 250 290 ns between tleb for overcurrent protection and short-winding protection 30 50 - ns tleb leading edge blanking time difference Vth(swp)SOURCE short-winding protection threshold voltage on pin SOURCE 1.4 1.5 1.6 V (V/t)vrec valley recognition voltage change on pin DRAIN with time 30 20 10 V/s fring ringing frequency 200 550 1000 kHz Vvrec(min) minimum valley recognition voltage difference 15 20 25 V td(vrec-swon) valley recognition to switch-on delay time - 100 - ns Valley detection voltage drop on pin DRAIN Brownout detection Vth(TONMAX) threshold voltage on pin TONMAX 3.75 4 4.25 V Ioffset(TONMAX) offset current on pin TONMAX 37 43 48 A ton(high) high on-time 12.5 15 17.5 s breakdown voltage on pin DRAIN 600 V version; Tj > 0 C 600 - - V 300 V version; Tj > 0 C 300 - - V MOSFET output stage VBR(DRAIN) SSL21081T_2T_3T_4T Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 13 of 24 SSL21081T/2T/3T/4T NXP Semiconductors GreenChip drivers for LED lighting Table 7. Characteristics …continued Symbol Parameter Conditions Min Typ Max Unit RDSon drain-source on-state resistance 600 V version; Tj = 25 C 4.0 5.0 6.0 600 V version; Tj = 125 C 6.0 7.5 9.0 300 V version; Tj = 25 C 2.05 2.3 2.55 300 V version; Tj = 125 C 3.05 3.45 3.85 - 1.2 - V/ns - 1.5 - V/ns dV/dt(DRAIN) fall rate of change of voltage on pin DRAIN 300 V version; CDRAIN = 150 pF, RSOURCE = 2.2 [1] 600 V version; CDRAIN = 75 pF, RSOURCE = 1.2 NTC functionality Vth(high)NTC high threshold voltage on pin NTC 0.47 0.5 0.53 V Vth(low)NTC low threshold voltage on pin NTC 0.325 0.35 0.375 V Vact(tmr)NTC timer activation voltage on pin NTC 0.27 0.3 0.325 V Vdeact(tmr)NTC timer deactivation voltage on pin NTC 0.15 0.2 0.25 V tto(deact)NTC deactivation time-out time on pin NTC 32 44 56 s Ioffset(NTC) offset current on pin NTC 47 A tdet(sc) short-circuit detection time 16 20 24 ms toff(high) high off-time 30 36 42 s OSP Temperature protections Tth(act)otp overtemperature protection activation threshold temperature 160 170 180 C Tth(rel)otp overtemperature protection release threshold temperature 90 100 110 C [1] This parameter is not tested during production, by design it is guaranteed. SSL21081T_2T_3T_4T Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 14 of 24 SSL21081T/2T/3T/4T NXP Semiconductors GreenChip drivers for LED lighting 12. SSL2108X buck configuration L1 fused resistor LED+ L1 10 Ω to mains D1 C1 RGND C2 C3 LED1...n D2 D3 N LEDL2 IC1 HV R1 1 SOURCE 2 SSL21081 7 VCC DRAIN GND C4 GND 3 SSL21083 6 NTC C5 8 4 5 DVDT RT1 NTC C6 RGND 001aan696 Fig 7. Buck configuration for SSL21081/SSL21083 L1 fused resistor LED+ L1 10 Ω to mains D1 C1 RGND C2 C3 LED1...n D3 D2 N LEDL2 IC1 HV GND R1 SOURCE VCC NTC C5 C6 RT1 NTC GND 1 12 2 11 3 SSL21082 10 DRAIN GND GND C4 DVDT 4 SSL21084 9 5 8 6 7 TONMAX GND C7 RGND 001aan697 Fig 8. Buck configuration for SSL21082/SSL21084 Further application information can be found in the SSL2108X application note. SSL21081T_2T_3T_4T Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 15 of 24 SSL21081T/2T/3T/4T NXP Semiconductors GreenChip drivers for LED lighting 13. Package outline SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 inches 0.069 0.010 0.057 0.004 0.049 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 0.05 0.01 0.01 0.004 0.028 0.012 0.244 0.039 0.028 0.041 0.228 0.016 0.024 θ 8o o 0 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. Fig 9. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03 MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 Package outline SOT96-1 (SOT8) SSL21081T_2T_3T_4T Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 16 of 24 SSL21081T/2T/3T/4T NXP Semiconductors GreenChip drivers for LED lighting SO12: plastic small outline package; 12 leads; body width 3.9 mm SOT1196-1 D E A X c HE y v A Z 12 7 A2 A A3 A1 pin 1 index θ Lp 1 L 6 e1 e2 w detail X bp 0 1 2 Dimensions D(1) E(1) max 1.75 0.25 1.45 0.49 0.25 8.75 nom 0.18 1.35 0.25 0.43 0.22 8.65 min 0.10 1.25 0.36 0.10 8.55 4.0 3.9 3.8 Unit mm 3 4 5 mm scale A A1 A2 A3 bp c e1 e2 2.54 1.27 HE L Lp 6.2 6.0 5.8 1.05 1.0 0.7 0.4 Q v w 0.70 0.65 0.25 0.25 0.60 y Z(2) θ 0.1 0.7 0.5 0.3 8° 4° 0° Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. References Outline version IEC JEDEC JEITA SOT1196-1 --- MS-012 Compliant --- sot1196-1_po European projection Issue date 11-02-15 11-02-16 Fig 10. Package outline SOT1196-1 (SOT12) SSL21081T_2T_3T_4T Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 17 of 24 SSL21081T/2T/3T/4T NXP Semiconductors GreenChip drivers for LED lighting 14. Abbreviations Table 8. Abbreviations Acronym Description BCM Boundary Conduction Mode BOM Bill Of Materials LED Light Emitting Diode LEB Leading-Edge Blanking MOSFET Metal-Oxide Semiconductor Field-Effect Transistor OCP OverCurrent Protection OSP Output Short Protection OTP OverTemperature Protection PCB Printed-Circuit Board PWM Pulse-Width Modulation SWP Short-Winding Protection UVLO UnderVoltage LockOut ZCS Zero Current Switching 15. References [1] SSL21081T_2T_3T_4T Preliminary data sheet SSL2108X — Drivers for LED lighting - application note All information provided in this document is subject to legal disclaimers. Rev. 2 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 18 of 24 SSL21081T/2T/3T/4T NXP Semiconductors GreenChip drivers for LED lighting 16. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes SSL21081T_2T_3T_4T v.2 20111206 Preliminary data sheet - SSL2108X v.1 SSL21081T_2T_3T_4T Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 19 of 24 SSL21081T/2T/3T/4T NXP Semiconductors GreenChip drivers for LED lighting 17. Legal information 17.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 17.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 17.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. SSL21081T_2T_3T_4T Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 20 of 24 SSL21081T/2T/3T/4T NXP Semiconductors GreenChip drivers for LED lighting Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 17.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 18. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] SSL21081T_2T_3T_4T Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 21 of 24 SSL21081T/2T/3T/4T NXP Semiconductors GreenChip drivers for LED lighting 19. Tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Quick reference data . . . . . . . . . . . . . . . . . . . . .2 Ordering information . . . . . . . . . . . . . . . . . . . . .3 Ordering options . . . . . . . . . . . . . . . . . . . . . . . .3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .5 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 11 Thermal characteristics . . . . . . . . . . . . . . . . . .12 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .12 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .18 Revision history . . . . . . . . . . . . . . . . . . . . . . . .19 continued >> SSL21081T_2T_3T_4T Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 22 of 24 SSL21081T/2T/3T/4T NXP Semiconductors GreenChip drivers for LED lighting 20. Figures Fig 1. Fig 2. Fig 3. Fig 4. Block diagram SSL2108X . . . . . . . . . . . . . . . . . . .4 Pin configuration for SSL2108X (SO8) . . . . . . . . .4 Pin configuration for SSL2108X (SO12) . . . . . . . .4 Basic application diagram SSL2108X (SO8 variant) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 Fig 5. Buck waveforms and valley detection . . . . . . . . . .6 Fig 6. NTC control curve . . . . . . . . . . . . . . . . . . . . . . . . .9 Fig 7. Buck configuration for SSL21081/SSL21083 . . .15 Fig 8. Buck configuration for SSL21082/SSL21084 . . .15 Fig 9. Package outline SOT96-1 (SOT8) . . . . . . . . . . . .16 Fig 10. Package outline SOT1196-1 (SOT12) . . . . . . . . .17 continued >> SSL21081T_2T_3T_4T Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 6 December 2011 © NXP B.V. 2011. All rights reserved. 23 of 24 SSL21081T/2T/3T/4T NXP Semiconductors GreenChip drivers for LED lighting 21. Contents 1 2 3 4 5 5.1 6 7 7.1 7.2 8 8.1 8.2 8.3 8.4 8.4.1 8.4.2 8.4.3 8.4.4 8.4.5 8.4.6 8.4.7 8.5 8.6 8.7 8.8 8.8.1 8.9 9 10 11 12 13 14 15 16 17 17.1 17.2 17.3 17.4 18 19 20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 Functional description . . . . . . . . . . . . . . . . . . . 5 Converter operation . . . . . . . . . . . . . . . . . . . . . 5 Conversion frequency. . . . . . . . . . . . . . . . . . . . 6 Valley detection. . . . . . . . . . . . . . . . . . . . . . . . . 6 Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 UnderVoltage LockOut (UVLO) . . . . . . . . . . . . 7 Leading-Edge Blanking (LEB) . . . . . . . . . . . . . 7 OverCurrent Protection (OCP) . . . . . . . . . . . . . 7 OverTemperature Protection (OTP) . . . . . . . . . 7 Brownout protection . . . . . . . . . . . . . . . . . . . . . 7 Short-Winding Protection (SWP) . . . . . . . . . . . 8 Output Short Protection (OSP) . . . . . . . . . . . . . 8 VCC supply. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 DVDT supply . . . . . . . . . . . . . . . . . . . . . . . . . . 8 VCC regulator . . . . . . . . . . . . . . . . . . . . . . . . . . 9 NTC functionality and PWM dimming . . . . . . . . 9 Soft-start function . . . . . . . . . . . . . . . . . . . . . . 10 Heat sink. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 11 Thermal characteristics . . . . . . . . . . . . . . . . . 12 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 12 SSL2108X buck configuration . . . . . . . . . . . . 15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 18 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 19 Legal information. . . . . . . . . . . . . . . . . . . . . . . 20 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Contact information. . . . . . . . . . . . . . . . . . . . . 21 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 21 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 6 December 2011 Document identifier: SSL21081T_2T_3T_4T