TOSHIBA SSM3J317T

SSM3J317T
TOSHIBA Field-Effect Transistor Silicon P-Channel MOS Type
SSM3J317T
○ Power Management Switch Applications
○ High-Speed Switching Applications
Unit: mm
1.8-V drive
Low ON-resistance: Ron = 306 mΩ (max) (@VGS = -1.8 V)
: Ron = 144 mΩ (max) (@VGS = -2.8 V)
: Ron = 107 mΩ (max) (@VGS = -4.5 V)
+0.2
2.8-0.3
-20
V
±8
V
VGSS
DC
ID
(Note 1)
-3.6
Pulse
IDP (Note 1)
-7.2
PD (Note 2)
700
Drain power dissipation
t = 5s
A
mW
1400
Channel temperature
Tch
150
°C
Storage temperature range
Tstg
−55 to 150
°C
0.4±0.1
2
3
0.16±0.05
VDSS
1
0.15
Drain current
Unit
0~0.1
Gate-Source voltage
Rating
0.95
Drain-Source voltage
Symbol
0.7±0.05
Characteristics
2.9±0.2
Absolute Maximum Ratings (Ta = 25°C)
1.9±0.2
+0.2
1.6-0.1
0.95
•
•
1: Gate
2: Source
Note: Using continuously under heavy loads (e.g. the application of
TSM
3: Drain
high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e.
JEDEC
―
operating temperature/current/voltage, etc.) are within the
absolute maximum ratings.
JEITA
―
Please design the appropriate reliability upon reviewing the
Toshiba Semiconductor Reliability Handbook (“Handling
TOSHIBA
2-3S1A
Precautions”/“Derating Concept and Methods”) and individual
reliability data (i.e. reliability test report and estimated failure rate,
Weight: 10 mg (typ.)
etc).
Note 1: The junction temperature should not exceed 150°C during use.
Note 2: Mounted on an FR4 board. (25.4 mm × 25.4 mm × 1.6 mm, Cu Pad: 645 mm2)
Electrical Characteristics (Ta = 25°C)
Characteristics
Drain-Source breakdown voltage
Symbol
Test Conditions
Min
Typ.
Max
V (BR) DSS
ID = -1 mA, VGS = 0 V
-20
⎯
⎯
V (BR) DSX
ID = -1 mA, VGS = 8 V
-12
⎯
⎯
Unit
V
Drain cut-off current
IDSS
VDS = -20 V, VGS = 0 V
⎯
⎯
-10
μA
Gate leakage current
IGSS
VGS = ±8 V, VDS = 0 V
⎯
⎯
±1
μA
Gate threshold voltage
Vth
VDS = -3 V, ID = -1 mA
-0.3
⎯
-1.0
V
Forward transfer admittance
|Yfs|
VDS = -3 V, ID = -1.0 A
(Note 3)
2.2
4.4
⎯
S
ID = -1.0 A, VGS = -4.5 V
Drain–source ON-resistance
RDS (ON)
Input capacitance
Ciss
Output capacitance
Coss
Reverse transfer capacitance
(Note 3)
⎯
83
107
ID = -0.75 A, VGS = -2.8 V (Note 3)
⎯
107
144
ID = -0.5 A, VGS = -1.8 V
⎯
170
306
⎯
390
⎯
⎯
67
⎯
⎯
(Note 3)
VDS = -10 V, VGS = -0 V, f = 1 MHz
Crss
⎯
55
Total Gate Charge
Qg
⎯
9.6
⎯
Gate-Source Charge
Qgs
⎯
6.6
⎯
Gate-Drain Charge
Qgd
⎯
3.0
⎯
17
⎯
Switching time
VDS = -10 V, IDS= -3.6 A
VGS = -4 V
Turn-on time
ton
VDD = -10 V, ID = -1.0 A
⎯
Turn-off time
toff
VGS = 0 to -2.5 V, RG = 4.7 Ω
⎯
19.5
⎯
ID = 3.6 A, VGS = 0 V
⎯
0.9
1.2
Drain-Source forward voltage
VDSF
(Note 3)
mΩ
pF
nC
ns
V
Note3: Pulse test
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2008-10-22
SSM3J317T
Switching Time Test Circuit
(a) Test Circuit
0
10%
90%
−2.5 V
RG
10 μs
0V
OUT
IN
−2.5 V
(b) VIN
VDS (ON)
90%
(c) VOUT
VDD = −10 V
RG = 4.7Ω
D.U. ≤ 1%
VIN: tr, tf < 5 ns
Common Source
Ta = 25°C
Marking
VDD
10%
VDD
tr
ton
tf
toff
Equivalent Circuit (top view)
3
3
KDV
1
2
1
2
Usage Considerations
Let Vth be the voltage applied between gate and source that causes the drain current (ID) to below (−1 mA for the Q2
of the SSM3J317T). Then, for normal switching operation, VGS(on) must be higher than Vth, and VGS(off) must be lower
than Vth. This relationship can be expressed as: VGS(off) < Vth < VGS(on).
Take this into consideration when using the device.
Handling Precaution
When handling individual devices that are not yet mounted on a circuit board, make sure that the environment is
protected against electrostatic discharge. Operators should wear antistatic clothing, and containers and other objects that
come into direct contact with devices should be made of antistatic materials.
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SSM3J317T
ID – VDS
-3.0V -2.8V
-4.5V
-8V
-6.0
(A)
Common Source
Ta = 25 °C
ID – VGS
-10
-2.5V
ID
-1.8 V
-4.0
Drain current
Drain current
ID
(A)
-8.0
-1.5 V
-2.0
Common Source
VDS = -3 V
-1
Ta = 100 °C
-0.1
− 25 °C
-0.01
25 °C
-0.001
VGS=-1.2 V
0
0
-0.2
-0.4
-0.6
-0.8
Drain–source voltage
VDS
-0.0001
0
-1
-1.0
(V)
Gate–source voltage
RDS (ON) – VGS
-3.0
VGS
(V)
RDS (ON) – ID
500
500
ID =-1.0A
Common Source
Ta = 25°C
Common Source
Ta = 25°C
400
Drain–source ON-resistance
RDS (ON) (mΩ)
Drain–source ON-resistance
RDS (ON) (mΩ)
-2.0
300
200
25 °C
Ta = 100 °C
100
400
300
200
-1.8 V
-2.8 V
100
VGS = -4.5 V
− 25 °C
0
0
-2
-4
-6
Gate–source voltage
VGS
0
-8
0
(V)
-2.0
Drain current
RDS (ON) – Ta
ID
-8.0
(A)
Vth – Ta
Common Source
Vth (V)
Common Source
400
Gate threshold voltage
Drain–source ON-resistance
RDS (ON) (mΩ)
-6.0
-1.0
500
300
-0.75 A / -2.8 V
-0.5A / -1.8 V
200
100
0
−50
-4.0
ID = -1.0 A / VGS = -4.5 V
0
50
Ambient temperature
100
Ta
VDS = -3 V
ID = -1 mA
-0.5
0
−50
150
(°C)
0
50
Ambient temperature
3
100
Ta
150
(°C)
2008-10-22
SSM3J317T
(S)
IDR – VDS
|Yfs| – ID
10
10
Common Source
(A)
⎪Yfs⎪
VDS = -3 V
Ta = 25°C
IDR
Drain reverse current
Forward transfer admittance
3
1
0.3
Common Source
VGS = 0 V
D
1
IDR
G
S
0.1
Ta =100 °C
25 °C
0.01
−25 °C
0.1
-0.01
-1
-0.1
Drain current
ID
0.001
0
-10
(A)
0.4
0.6
Drain–source voltage
C – VDS
1000
0.2
0.8
1.0
VDS
1.2
(V)
t – ID
1000
Common Source
VDD = -10 V
VGS = 0 to -2.5 V
Ta = 25 °C
RG = 4.7Ω
(pF)
500
toff
Ciss
100
tf
t
Capacitance
C
(ns)
300
Switching time
100
Coss
Crss
50
Common Source
Ta = 25°C
f = 1 MHz
VGS = 0 V
30
10
-0.1
-1
-10
Drain–source voltage
tr
1
-0.01
-100
VDS
ton
10
(V)
-0.1
Drain current
-1
ID
-10
(A)
Dynamic Input Characteristic
-8
Gate–source voltage
VGS
(V)
Common Source
ID = -3.6 A
Ta = 25°C
-6
-4
VDD = - 10 V
VDD = - 16 V
-2
0
0
4
8
12
Total Gate Charge
16
Qg
20
(nC)
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2008-10-22
SSM3J317T
rth – tw
PD – Ta
1000
Drain power dissipation PD (mW)
Transient thermal impedance rth (°C/W)
1000
b
100
a
10
1
0.001
a: Mounted on FR4 Board
(25.4 mm × 25.4 mm
× 1.6 mm,
Cu Pad: 645 mm2)
b: Mounted on FR4 Board
(25.4 mm × 25.4 mm
× 1.6 mm,
2
Cu Pad: 0.8 mm ×3)
0.01
0.1
1
Pulse width
10
tw
100
800
a
600
400
(s)
b
200
0
-40
1000
a: Mounted on FR4 Board
(25.4 mm × 25.4 mm
× 1.6 mm,
Cu Pad: 645 mm2)
b: Mounted on FR4 Board
(25.4 mm × 25.4 mm
× 1.6 mm,
Cu Pad: 0.8 mm2×3)
-20
0
20
40
60
80
Ambient temperature
5
100 120 140 160
Ta
(°C)
2008-10-22
SSM3J317T
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must
also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document,
the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA
Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are
solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the
appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any
information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other
referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO
LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.
• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
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applicable laws or regulations.
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infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
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limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
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• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
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