TOSHIBA SSM3K04FV

SSM3K04FV
TOSHIBA Field Effect Transistor Silicon N Channel MOS Type
SSM3K04FV
High Speed Switching Applications
•
High input impedance
•
Low gate threshold voltage: Vth = 0.7~1.3 V
•
Optimum for high-density mounting in small packages
Absolute Maximum Ratings (Ta = 25°C)
3
Unit
Drain-source voltage
VDS
20
V
Gate-source voltage
VGSS
10
V
ID
100
mA
PD (Note 1)
150
mW
Channel temperature
Tch
150
°C
Storage temperature range
Tstg
−55~150
°C
0.13±0.05
Rating
Drain power dissipation (Ta = 25°C)
1
2
Symbol
DC drain current
0.8±0.05
0.5±0.05
Characteristics
1.2±0.05
0.32±0.05
2.5 V gate drive
0.4
•
0.8±0.05
With built-in gate-source resistor: RGS = 1 MΩ (typ.)
0.4
•
1.2±0.05
0.22±0.05
Unit: mm
1. Gate
2. Source
3. Drain
JEDEC
―
JEITA
―
Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in
TOSHIBA
2-2L1B
temperature, etc.) may cause this product to decrease in the
Weight: 1.5 mg (typ.)
reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the
absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note:
Note 1: Total rating, mounted on FR4 board (25.4 mm × 25.4 mm × 1.6 t)
0.5mm
0.45mm
0.45mm
0.4mm
Marking
Equivalent Circuit
3
3
DC
1
RGS
2
1
2
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SSM3K04FV
Electrical Characteristics (Ta = 25°C)
Characteristics
Gate leakage current
Drain-source breakdown voltage
Drain cut-off current
Symbol
Test Condition
Min
Typ.
Max
Unit
IGSS
VGS = 10 V, VDS = 0
⎯
⎯
15
μA
V (BR) DSS
ID = 100 μA, VGS = 0
20
⎯
⎯
V
IDSS
VDS = 20 V, VGS = 0
⎯
⎯
1
μA
Vth
VDS = 3 V, ID = 0.1 mA
0.7
⎯
1.3
V
Forward transfer admittance
⎪Yfs⎪
VDS = 3 V, ID = 10 mA
25
50
⎯
mS
Drain-source on-resistance
RDS (ON)
ID = 10 mA, VGS = 2.5 V
⎯
4
12
Ω
Gate threshold voltage
Input capacitance
Ciss
VDS = 3 V, VGS = 0, f = 1 MHz
⎯
11.0
⎯
pF
Reverse transfer capacitance
Crss
VDS = 3 V, VGS = 0, f = 1 MHz
⎯
3.3
⎯
pF
Output capacitance
Coss
VDS = 3 V, VGS = 0, f = 1 MHz
⎯
9.3
⎯
pF
Switching time
Turn-on time
ton
VDD = 3 V, ID = 10 mA, VGS = 0~2.5 V
⎯
0.16
⎯
Turn-off time
toff
VDD = 3 V, ID = 10 mA, VGS = 0~2.5 V
⎯
0.19
⎯
VGS = 0~10 V
0.7
1.0
1.3
Gate-source resistor
RGS
μs
MΩ
Switching Time Test Circuit
(a)
Test circuit
(b)
VIN
VGS
(c)
VOUT
VDS
Precaution
Vth can be expressed as the voltage between gate and source when the low operating current value is ID = 100 μA for
this product. For normal switching operation, VGS (on) requires a higher voltage than Vth and VGS (off) requires a lower
voltage than Vth.
(The relationship can be established as follows: VGS (off) < Vth < VGS (on) )
Take this into consideration when using the device.
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PD – Ta
Drain power dissipation PD (mW)
250
200
150
100
50
0
0
20
40
60
80
100
120
140
160
Ambient temperature Ta (°C)
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SSM3K04FV
RESTRICTIONS ON PRODUCT USE
20070701-EN GENERAL
• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his
document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties.
• Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.
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