T835-600G T850-600G ® HIGH PERFORMANCE TRIAC FEATURES HIGH COMMUTATION PREFORMANCES SNUBBERLESSTM TECHNOLOGY HIGH NOISE IMMUNITY (dV/dt) HIGH ITSM A2 A2 DESCRIPTION G A1 The T835-600G and T850-600G triacs are using high performance SNUBBERLESS technology. They are intended for AC control applications using surface mount tecnology. These devices are perfectly suited where high commutation and surge performances are required. D2PAK ABSOLUTE RATINGS (limiting values) Symbol Parameter Value Unit VDRM VRRM Repetitive peak off-state voltage Tj = 125°C 600 V IT(RMS) RMS on-state current (360° conduction angle) Tc= 110°C 8 A Non repetitive surge peak on-state current (Tj initial = 25°C) tp = 8.3ms 85 A tp = 10 ms 80 I t Value for fusing tp = 10 ms 32 A2s Critical rate of rise of on-state current Repetitive F = 50 Hz 20 A/µs Non Repetitive 100 ITSM 2 I t dI/dt 2 IG = 500 mA Tstg Tj T dIG /dt = 1 A/µs. Storage temperature range Operating junction temperature range Maximum temperature for soldering during 10s May 1998 - Ed: 3A - 40, + 150 - 40, + 125 °C 260 °C 1/5 T835-600G / T850-600G THERMAL RESISTANCES Symbol Parameter Value Unit Rth(j-a) Junction to ambient (S = 1 cm2) 45 °C/W Rth(j-c) Junction to case for DC 2.1 °C/W Rth(j-c) Junction to case for AC 360° conduction angle (F=50Hz) 1.6 °C/W GATE CHARACTERISTICS (maximum values) PG (AV)= 1 W PGM = 10 W (tp = 20 µs) IGM = 4 A (tp = 20 µs) ELECTRICAL CHARACTERISTICS Symbol IGT Test Conditions Quadrant VD=12V (DC) RL=33Ω Tj= 25°C I-II-III T835 MIN MAX T850 2 mA 35 50 VGT VD=12V (DC) RL=33Ω Tj= 25°C I-II-III MAX 1.3 V VGD VD=VDRM RL=3.3kΩ Tj= 125°C I-II-III MIN 0.2 V IH * IT= 100mA Tj= 25°C IL IG = 1.2 IGT Gate open Tj = 25°C MAX 35 50 mA I-III MAX 50 60 mA II MAX 80 100 VTM * ITM= 11A tp= 380µs Tj= 25°C MAX 1.5 V IDRM VD = VDRM Tj= 25°C MAX 5 µA IRRM VR = VRRM Tj= 125°C MAX 2 mA Linear slope up to VD=67%VDRM Gate open Tj= 125°C MIN 500 1000 V/µs Without snubber Tj= 125°C MIN 4.5 7 A/ms dV/dt * (dI/dt)c * * For either polarity of electrode A2 voltage with reference to electrode A1. ORDERING INFORMATION Add "-TR" suffix for Tape & Reel shipment T 8 35 - 600 CURRENT G PACKAGE : G = D2PAK TRIAC 2/5 Unit SENSITIVITY VOLTAGE T835-600G / T850-600G Fig. 1: Maximum power dissipation versus RMS on-state current. Fig. 2: Correlation between maximum power dissipation and maximum allowable temperatures (Tamb and Tcase) for different thermal resistances heatsink+contact. P(W) P(W) 12 12 10 α=120° 8 Rth=0°C/W Rth=2°C/W 110 8 α=90° 6 Rth=5°C/W Rth=8°C/W 10 α=180° Tcase (°C) 115 6 a=60° 4 4 α=30° 2 120 2 α=180° IT(RMS)(A) 0 0 1 2 3 4 5 6 7 8 0 0 20 Tamb(°C) 40 60 80 100 120 140 125 Fig. 3: RMS on-state current versus case temperature. Fig. 4 : Relative variation of thermal impedance versus pulse duration. IT(RMS)(A) K=[Zth/Rth] 10 1.00 α=180° 8 Zth(j-c) 6 Zth(j-a) 0.10 4 2 Tcase(°C) 0 0 25 50 tp(s) 75 100 125 0.01 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 Fig. 5: Relative variation of gate trigger current and holding current versus junction temperature (typical values). Fig. 6: Non repetitive surge peak on-state current versus number of cycles. IGT,IH[Tj]/IGT,IH[Tj=25°C] ITS M(A) 2.5 80 2.0 Tj initial=25°C F=50Hz 70 IGT 60 50 1.5 40 1.0 IH 30 20 0.5 10 Tj(°C) 0.0 -40 -20 0 20 40 60 80 100 120 140 0 Number of cycles 1 10 100 1000 3/5 T835-600G / T850-600G Fig. 7: Non repetitive surge peak on-state current for a sinusoidal pulse with width tp<10ms, and corresponding value of I2t. Fig. 8: On-state characteristics (maximum values). ITM(A) ITSM(A),I²t(A²s) 100 300 Tj max.: Vto=0.83V Rt=56 mΩ Tj initial=25°C ITSM 100 10 I²t Tj=Tj max. Tj=25°C tp(ms) 10 1 2 5 10 Fig. 9: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness: 35µm). VTM(V) 1 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Fig. 10: Typical reflow soldering heat profile, either for mounting on FR4 or metal-backed boards. T (°C) Rth(j-a) (°C/W) 250 80 245°C 215°C 70 200 60 50 150 Epoxy FR4 board 40 100 30 20 10 0 S(Cu) (cm²) 0 4/5 4 8 12 16 20 24 Metal-backed board 50 28 32 36 40 t (s) 0 0 40 80 120 160 200 240 280 320 360 T835-600G / T850-600G PACKAGE MECHANICAL DATA D2PAK DIMENSIONS REF. Millimeters Min. Typ. Max. Min. Typ. Max. A E C2 L2 D L L3 A1 B2 R C B G A2 2.0 MIN. FLAT ZONE V2 A 4.30 4.60 0.169 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 C 1.25 0.45 C2 1.21 1.36 0.047 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.28 0.393 0.405 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 R FOOT PRINT DIMENSIONS (in millimeters) 1.40 0.048 0.055 0.60 0.017 0.024 1.75 0.055 0.40 V2 0° 0.069 0.016 8° 0° 8° MARKING 16.90 10.30 Inches 5.08 TYPE MARKING T835-600G T835 600G T850-600G T850 600G 1.30 PACKING 3.70 8.90 Tube : 50 units Tape and reel : 500 units Information furnished is believed to be accurate and reliable. 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