TOSHIBA TC75S58AFE

TC75S58AFE/AFC
TOSHIBA CMOS Linear Integrated Circuit
Silicon Monolithic
TC75S58AFE,TC75S58AFC
Single Comparator (Open-Drain Output)
TC75S58AFE
The TC75S58AFE and TC75S58AFC are CMOS general-purpose
single comparators. The devices can operate from a single supply
voltage and are designed for a lower supply-current than
conventional general-purpose bipolar comparators. The output is
designed for Open-Drain Output and can supply a higher voltage
than the power supply. Therefore, it is possible to pull-up the
voltage to a level higher than that of the power supply. The
Open-Drain Output can be wired-OR with another Open-Drain
Output circuit.
TC75S58AFC
* Output voltage should not exceed the maximum rating.
Feature
•
Low Supply Current: IDD = 10 μA (typ.)
•
Single Power Supply Operation
•
Wide Common Mode Input : VSS to VDD − 0.9 V
•
Open-Drain Output Circuit
•
Low Input Bias Current
•
Small Package
CSON6-P-0.45
Weight
SON5-P-0.50
: 0.003 g (typ.)
CSON6-P-0.45 : 0.002 g (typ.)
Marking (top view)
Pin Assignment (top view)
TC75S58AFE
TC75S58AFE
5
4
VDD
OUT
5
4
TG
1
2
1
IN (−)
3
TC75S58AFC
5
4
TG
1
3
IN (+)
TC75S58AFC
Marking
6
2
VSS
2
VDD
NC
OUT
6
5
4
1
2
3
Monthly Indication
3
IN (-)
1
Vss
IN (+)
2009-01-16
TC75S58AFE/AFC
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Supply Voltage
Differential Input Voltage
Input Voltage
Symbol
Rating
Unit
VDD, VSS
±3.5 or 7
V
DVIN
±7
V
VIN
VSS to VDD
V
Output Current
IO
±35
mA
Output Voltage
VO
VSS to VSS + 7
V
Power Dissipation
PD
Operating Temperature
Topr
−40 to 85
°C
Storage Temperature
Tstg
−55 to 125
°C
TC75S58AFE
100
TC75S58AFC
100 (Note1)
mW
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings and the operating ranges.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note: Due to the CMOS structure, this device may be susceptible to latch-up . To prevent latch-up, please take the
following precautions;
•
Ensure that no Input pin voltage level ever exceeds Vdd or drops below Vss. In addition, check the
power-on timing.
•
Do not subject the device to excessive noise.
(Note 1): FR4 in board implementation:
(25.4mm × 25.4mm × 1.6t, Cu Pad: 0.4mm2)
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TC75S58AFE/AFC
Electrical Characteristics (VDD = 5 V, VSS = GND, Ta = 25°C)
Symbol
Test
Circuit
Test Condition
Min
Typ.
Max
Unit
Input Offset Voltage
VIO
⎯
⎯
⎯
±1
±7
mV
Input Offset Current
IIO
⎯
⎯
⎯
1
⎯
pA
II
⎯
⎯
⎯
1
⎯
pA
Characteristics
Input Bias Current
Common Mode Input Voltage
Supply Current
CMVIN
IDD (Note)
⎯
⎯
0
⎯
4.1
V
⎯
⎯
⎯
11
22
μA
⎯
⎯
94
⎯
dB
Voltage Gain
GV
⎯
Sink Current
Isink
⎯
VOL = 0.5 V
13
25
⎯
mA
Output Leakage Current
ILEAK
⎯
VDD = 5 V , VO = 5 V
⎯
5
⎯
nA
Off-State Leakage Current
IOFF
⎯
VDD = 0 V , VO = 5 V
⎯
5
⎯
nA
Output-Low Voltage
VOL
⎯
Isink = 5.0 mA
⎯
0.1
0.3
V
Operating Supply Voltage Range
VDD
⎯
1.8
⎯
7.0
V
tPLH (1)
⎯
Over Drive = 100 mV
⎯
800
⎯
tPLH (2)
⎯
TTL Step Input
⎯
620
⎯
tPHL (1)
⎯
Over Drive = 100 mV
⎯
230
⎯
tPHL (2)
⎯
TTL Step Input
⎯
350
⎯
tTLH
⎯
Over Drive = 100 mV
⎯
190
⎯
tTHL
⎯
Over Drive = 100 mV
⎯
6
⎯
Propagation Delay
(Turn On)
Propagation Delay
(Turn Off)
Response Time
⎯
ns
ns
ns
Electrical Characteristics (VDD = 3 V, VSS = GND, Ta = 25°C)
Symbol
Test
Circuit
Test Condition
Min
Typ.
Max
Unit
Input Offset Voltage
VIO
⎯
⎯
⎯
±1
±7
mV
Input Offset Current
IIO
⎯
⎯
⎯
1
⎯
pA
II
⎯
⎯
⎯
1
⎯
pA
CMVIN
⎯
⎯
0
⎯
2.1
V
⎯
⎯
⎯
10
20
μA
Characteristics
Input Bias Current
Common Mode Input Voltage
Supply Current
IDD (Note)
Isink
⎯
VOL = 0.5 V
6
18
⎯
mA
Output Leakage Current
ILEAK
⎯
VDD = 3 V , VO = 3 V
⎯
5
⎯
nA
Off-State Leakage Current
IOFF
⎯
VDD = 0 V , VO = 3 V
⎯
5
⎯
nA
Output-Low Voltage
VOL
⎯
Isink = 5.0 mA
⎯
0.15
0.35
V
Propagation Delay (Turn On)
tPLH
⎯
Over Drive = 100 mV
⎯
590
⎯
ns
Propagation Delay (Turn Off)
tPHL
⎯
Over Drive = 100 mV
⎯
230
⎯
ns
tTLH
⎯
Over Drive = 100 mV
⎯
170
⎯
tTHL
⎯
Over Drive = 100 mV
⎯
5
⎯
Sink Current
Response Time
ns
Note: The current consumption of this device increases as its operating frequency increases. Note that the power
dissipation should not exceed the allowable power.
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TC75S58AFE/AFC
IDD – f
1000
VDD = 3 V
Supply Current
IDD
(μA)
VSS = GND
Ta = 25°C
100
10
1
0.001
0.01
0.1
1
Frequency f
10
100
1000
10
100
1000
(kHz)
IDD – f
1000
VDD = 5 V
Supply Current
IDD
(μA)
VSS = GND
Ta = 25°C
100
10
1
0.001
0.01
0.1
1
Frequency f
4
(kHz)
2009-01-16
TC75S58AFE/AFC
VOL – Isink
VOL – Isink
5.0
VOL (V)
VDD = 3 V
2.5
VSS = GND
Ta = 25°C
2.0
Output-Low Voltage
Output-Low Voltage
VOL (V)
3.0
1.5
1.0
0.5
0.0
0
5
10
15
25
20
Sink Current
35
30
Isink
4.5
4.0
(mA)
VSS = GND
Ta = 25°C
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0
40
VDD = 5 V
5
10
15
Sink Current
20
25
Isink
30
35
40
(mA)
PD – Ta
300
This
(mW)
PD
Power Dissipation
data
was
obtained
from
an
unmounted standalone IC. If the IC is
mounted
on
a
PCB,
dissipation will be greater.
depending
200
on
the
its
power
Note that,
PCB’s
thermal
characteristics, the curves may differ
substantially from those shown.
100
0
−40
0
40
Ambient Temperature
80
Ta
120
(°C)
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2009-01-16
TC75S58AFE/AFC
Package Dimension
Weight: 0.003 g (typ.)
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TC75S58AFE/AFC
Package Dimension
CSON6-P-0.45
Weight: 0.002 g (typ.)
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2009-01-16
TC75S58AFE/AFC
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR
APPLICATIONS.
• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
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applicable laws or regulations.
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infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
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technology products (mass destruction weapons). Product and related software and technology may be controlled under the
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• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
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