THS1215 www.ti.com SLAS292A – MARCH 2001 – REVISED MARCH 2004 3.3-V, 12-BIT, 15 MSPS, LOW-POWER ANALOG-TO-DIGITAL CONVERTER WITH POWER DOWN FEATURES • • • • • Input Configurations: – Differential 0.5x Gain – Differential 1x Gain 3.3-V Supply Operation Internal Voltage Reference Out-of-Range Indicator Power-Down Mode APPLICATIONS • • • • • • Camcorders Digital Cameras Copiers Communications Test Instruments Baseband Digitization DW OR PW PACKAGE (TOP VIEW) AGND CON1 CON0 EXTREF AIN+ AIN− AGND AVDD REFT REFB OVRNG D11 D10 D9 1 28 2 27 3 26 4 25 5 24 6 23 7 22 8 21 9 20 10 19 11 18 12 17 13 16 14 15 CLK AVDD OE D0 D1 D2 D3 D4 DVDD DGND D5 D6 D7 D8 DESCRIPTION The THS1215 is a CMOS, low-power, 12-bit, 15 MSPS analog-to-digital converter (ADC) that operates with a 3.3-V supply. The THS1215 gives circuit developers complete flexibility. The analog input to the THS1215 is differential with a gain of 1.0 in Mode 1 and 0.5 in Mode 2. The THS1215 provides a wide selection of voltage references to match the user's design requirements. For more design flexibility, the internal reference can be bypassed to use an external reference to suit the dc accuracy and temperature drift requirements of the application. The out-of-range output is used to monitor any out-of-range condition in the THS1215's input range. The speed, resolution, and single-supply operation of the THS1215 are suited for applications in video, multimedia, high-speed acquisition, and communications. The speed and resolution ideally suit charge-couple device (CCD) input systems such as digital copiers, digital cameras, and camcorders. The wide input voltage range between VREFB and VREFT allows the THS1215 to be designed into multiple systems. The THS1215C is characterized for operation from 0°C to 70°C. The THS1215I is characterized for operation from -40°C to 85°C. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2001–2004, Texas Instruments Incorporated THS1215 www.ti.com SLAS292A – MARCH 2001 – REVISED MARCH 2004 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION (1) PRODUCT PACKAGELEAD PACKAGE DESIGNATOR (1) SPECIFIED TEMPERATURE RANGE PACKAGE MARKING ORDERING NUMBER TRANSPORT MEDIA, QUANTITY THS1215 TSSOP-28 PW 0°C TO 70°C TH1215 THS1215 CPW Tube, 50 THS1215 TSSOP-28 PW 0°C TO 70°C TH1215 THS1215 CPWR Tape and reel, 2000 THS1215 TSSOP-28 PW –40°C TO 85°C TJ1215 THS1215 IPW Tube, 50 THS1215 TSSOP-28 PW –40°C TO 85°C TJ1215 THS1215 IPWR Tape and reel, 2000 THS1215 SOP-28 DW 0°C TO 70°C TH1215 THS1215 CDW Tube, 20 THS1215 SOP-28 DW 0°C TO 70°C TH1215 THS1215 CDWR Tape and reel, 1000 THS1215 SOP-28 DW –40°C TO 85°C TJ1215 THS1215 IDW Tube, 20 THS1215 SOP-28 DW –40°C TO 85°C TJ1215 THS1215 IDWR Tape and reel, 1000 For the most current specifications and package information refer to our Web site at www.ti.com. FUNCTIONAL BLOCK DIAGRAM DVDD CLK Timing Circuitry OVRNG AIN+ AIN− Sample and Hold 3-State Output Buffers 12-Bit ADC D[11:0] OE CON0 CON1 Configuration Control Circuit Internal Reference Circuit EXTREF REFT REFB 2 AVDD AGND DGND THS1215 www.ti.com SLAS292A – MARCH 2001 – REVISED MARCH 2004 TERMINAL FUNCTIONS TERMINAL I/O DESCRIPTION NAME NO. AGND 1, 7 I Analog ground AVDD 8, 27 I Analog supply AIN+ 5 I Positive analog input AIN- 6 I Negative analog input CLK 28 I ADC conversion clock CON1 2 I Configuration input 1 CON0 3 I Configuration input 0 DGND 19 I Digital ground DVDD 20 I Digital supply D11 12 O ADC data bit 11 D10 13 O ADC data bit 10 D9 14 O ADC data bit 9 D8 15 O ADC data bit 8 D7 16 O ADC data bit 7 D6 17 O ADC data bit 6 D5 18 O ADC data bit 5 D4 21 O ADC data bit 4 D3 22 O ADC data bit 3 D2 23 O ADC data bit 2 D1 24 O ADC data bit 1 D0 25 O ADC data bit 0 EXTREF 4 I Reference select input (high = external, low = internal) OVRNG 11 O Out of range indicator (high = out of range) OE 26 I Output enable (high = disable, low = enable) REFT 9 I/O Upper ADC reference voltage REFB 10 I/O Lower ADC reference voltage ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) UNIT Supply voltage range AVDD to AGND, DVDD to DGND AGND to DGND –0.3 V to 4 V –0.3 V to 0.3 V Reference voltage input range, REFT, REFB to AGND –0.3 to AVDD + 0.3 V Analog input voltage range, AIN+, AIN– to AGND –0.3 to AVDD + 0.3 V Clock input voltage range, CLK to AGND –0.3 to AVDD + 0.3 V Digital input voltage range, digital input to DGND –0.3 to DVDD + 0.3 V Digital output voltage range, digital output to DGND –0.3 to DVDD + 0.3 V Operating junction temperature range, TJ –40°C to 150°C Storage temperature range, TSTG –65°C to 150°C Lead temperature 1,6 mm (1/16 in) from case for 10 seconds (1) 300°C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 3 THS1215 www.ti.com SLAS292A – MARCH 2001 – REVISED MARCH 2004 RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range, TA (unless otherwise noted) MIN NOM MAX 3.0 3.3 3.6 UNIT POWER SUPPLY Supply voltage AVDD DVDD V ANALOG AND REFERENCE INPUTS Reference input voltage VREFT fCLK = 5 MHz to 15 MHz 2.0 2.15 2.5 VREFB fCLK = 5 MHz to 15 MHz 1.05 1.15 1.3 fCLK = 5 MHz to 15 MHz 0.95 1.0 1.05 V CON1 = 0, CON0 = 1 –1.0 1.0 V CON1 = 1, CON0 = 0 –2.0 2.0 V 10 pF AVDD V Reference voltage differential, VREFT – VREFB Analog input voltage differential, (AIN+) – (AIN–) (1) Analog input capacitance, Ci Clock input (2) 0 V DIGITAL OUTPUTS Minimum digital output load resistance, RL 100 Maximum digital output load capacitance, Ci 0 kΩ 10 15 pF V DIGITAL INPUTS High-level input voltage, VIH Low-level input voltage, VIL Clock frequency, fCLK, See Note (3) Clock pulse duration, tW(CLKL), tW(CLKH) Operating free-air temperature, TA (1) (2) (3) 4 fCLK = 15 MHz 2.4 DVDD DGND 0.8 V 5 30 MHz 36.7 ns TH1215 30 0 33.3 70 °C TJ1215 –40 85 Based on VREFT – VREFB = 1.0 V, varies proportional to the VREFT – VREFB value. AIN+ and AIN– inputs must always be greater than 0 V and less than AVDD. Clock pin is referenced to AGND and powered by AVDD. Clock frequency can be extended to this range without degradation of performance. THS1215 www.ti.com SLAS292A – MARCH 2001 – REVISED MARCH 2004 ELECTRICAL CHARACTERISTICS over recommended operating conditions (AVDD = DVDD = 3.3 V, fs = 15 MHz/50% duty cycle, MODE = 1, 1-V input span, internal reference, Tmin to Tmax) (unless otherwise noted) DIGITAL INPUTS AND OUTPUTS (all supplies = 3.3 V) PARAMETER TEST CONDITION MIN TYP MAX UNIT DIGITAL INPUTS VIH High level input voltage All other inputs 0.8 × DVDD CLK 0.8 × AVDD All other inputs 0.2 × DVDD CLK 0.2 × AVDD VIL Low level input voltage IIH High level input current 1 IIL Low level input current –1 Ci Input capacitance 5 V µA pF DIGITAL OUTPUTS VOH High level output voltage Iload = 50 µA VOL Low level output voltage Iload = –50 µA DVDD–0.4 V High impedance output current tr/tf Rise/fall time CL = 10 pF 0.4 V ±1 µA 4.5 ns ANALOG INPUTS Ci Switched input capacitance 6 pF td(ap) Aperture delay time 2 ns Aperture uncertainty (jitter) 2 ns 10 µA DC leakage current (input = ±FS) POWER SUPPLY (CLK = 15 MHz) XVDD Supply voltage (all supplies) 3.3 3.6 V IDD Supply current active - total 3 45 53.5 mA I(analog) Supply current active - analog 34 I(digital) Supply current active - digital II(standby) Standby supply current mA 11 CLK = 0 MHz 1 µF bypass (1) mA 10 µA 770 µs t(PU) Power-up time for references from standby 6.2 ms t(PUconv) Power-up time for valid ADC conversion 1 µF bypass (2) 820 ns 148 Power dissipation Clock = 15 MHz, AIN+ and AIN– at Common Mode or 1.65 V dc Clock = 15 MHz, fin = 3.58 MHz at –1 dBFS 167 PD PD(STBY) Standby power dissipation PSRR Power supply rejection ratio (1) (2) 10 µF bypass (1) 177 mW CLK = 0 MHz 36 ±0.1 µW %FS Time for reference to recover to 1% of its final voltage level. Time for ADC conversions to be accurate to within 0.1% of fullscale. 5 THS1215 www.ti.com SLAS292A – MARCH 2001 – REVISED MARCH 2004 ELECTRICAL CHARACTERISTICS (CONTINUED) over recommended operating conditions (AVDD = DVDD = 3.3 V, fs = 15 MHz/50% duty cycle, MODE = 1, 1-V input span, internal reference, Tmin to Tmax) (unless otherwise noted) REFT, REFB REFERENCE VOLTAGE (all supplies = 3.3 V) PARAMETER TEST CONDITION MIN TYP MAX UNIT INTERNAL REFERENCE (1) VREFT Upper reference voltage 2.15 V VREFB Lower reference voltage VREF Differential reference voltage, VREFT – VREFB 0.95 Differential reference voltage, VREFT – VREFB accuracy –5% 5% Externally applied VREFT reference voltage range 2 2.5 V Externally applied VREFB reference voltage range 1.05 1.3 V Externally applied (VREFT – VREFB) reference voltage range 0.75 1.05 V 1.15 1 V 1.05 V EXTERNAL REFERENCE External mode VREFT to VREFB impedance 9 kΩ INTERNAL EXTERNAL REFERENCE CT VREFT decoupling capacitor value 0.1 µF CB VREFB decoupling capacitor value 0.1 µF CTB Decoupling capacitor VREFT to VREFB 10 µF DC ACCURACY (LINEARITY) Number of missing codes All modes DNL Differential nonlinearity All modes ±0.43 ±0.9 0 codes INL Integral nonlinearity All modes ±0.6 ±2.5 LSB Offset error All modes 1.4 2.2 %FSR Gain error All modes 2.2 3.5 %FSR LSB DYNAMIC PERFORMANCE (all supplies = 3.3 V) ENOB Effective number of bits fi = 3.58 MHz THD Total harmonic distortion fi = 3.58 MHz SNR Signal-to-noise ratio fi = 3.58 MHz 67.4 SINA D Signal-to-noise + distortion fi = 3.58 MHz SFDR Spurious free dynamic range fi = 3.58 MHz G(diff) 10.7 11.1 Bits –81.2 dB 68.9 dB 66 68.6 dB 72 81.7 dB Analog input bandwidth 180 MHz Differential phase, DP 0.12 degree Differential gain 0.01% TIMING (all supplies = 3.3 V) Clock frequency (2) fCLK Clock duty cycle 5 45% 15 50% 55% 6 19 MHz td(O) Output delay time td(PZ) Delay time, output disable to Hi-Z output 3.2 td(EN) Delay time, output enable to output valid 16 19 ns 4 5 cycles Latency (1) (2) 6 The internal reference voltage is not intended for use driving off chip. The clock frequency may be extended down to 5 MHz without degradation in specified performance. ns ns THS1215 www.ti.com SLAS292A – MARCH 2001 – REVISED MARCH 2004 PARAMETER MEASUREMENT INFORMATION TIMING DIAGRAM S1 S2 S3 Analog 1 2 3 4 5 6 7 8 9 10 CLK t PIPELINE t d(O) D[9:0] S1 S2 S3 Figure 1. Analog Input and Data Output Timing OE t d(EN) t d(PZ) Hi−Z Hi−Z D[9:0] Data Data Data Figure 2. Output Enable Timing THS1215 REFT CT 1.5 V BAND GAP CTB REFB CB Figure 3. Reference Generation 7 THS1215 www.ti.com SLAS292A – MARCH 2001 – REVISED MARCH 2004 TYPICAL CHARACTERISTICS POWER vs TEMPERATURE SIGNAL-TO-NOISE vs TEMPERATURE 152 71 DVDD = AVDD = 3.3 V, AIN+ = AIN− = 1.65 V, fs = 15 MSPS SNR − Signal-to-Noise − dB 151 Power − mW 150 149 148 147 146 70 AVDD = DVDD = 3.3 V, fIN = 3.58 MHz, −1dBFS, fs = 15 MSPS, Mode = 1 69 68 67 145 144 −40 −15 10 35 60 66 −40 85 TA − Temperature − °C SPURIOUS FREE DYNAMIC RANGE vs TEMPERATURE TOTAL HARMONIC DISTORTION vs TEMPERATURE 85 −78 THD − Total Harmonic Distortion − dB SFDR − Spurious Free Dynamic Range − dB 60 Figure 5. 80 78 76 74 AVDD = DVDD = 3.3 V, fIN = 3.58 MHz, −1dBFS fs = 15 MSPS −15 10 35 TA − Temperature − °C Figure 6. 8 35 Figure 4. 82 70 −40 10 TA − Temperature − °C 84 72 −15 60 85 AVDD = DVDD = 3.3 V, fIN = 3.58 MHz, −1dBFS fs = 15 MSPS −80 −82 −84 −86 −88 −40 −15 10 35 TA − Temperature − °C Figure 7. 60 85 THS1215 www.ti.com SLAS292A – MARCH 2001 – REVISED MARCH 2004 TYPICAL CHARACTERISTICS (continued) SIGNAL-TO-NOISE AND DISTORTION vs TEMPERATURE SINAD − Signal-to-Noise and Distortion − dB 69.0 68.5 68.0 67.5 67.0 AVDD = DVDD = 3.3 V, fIN = 3.58 MHz, −1dBFS fs = 15 MSPS 66.5 66.0 −40 −15 10 35 60 85 TA − Temperature − °C Figure 8. DNL − Differential Nonlinearity − LSB DIFFERENTIAL NONLINEARITY (DNL) 1.0 0.8 0.6 0.4 0.2 −0.0 −0.2 −0.4 −0.6 −0.8 −1.0 DVDD = AVDD = 3.3 V, fs = 15 MSPS 0 512 1024 1536 2048 2560 3072 3584 4096 3072 3584 4096 ADC Code Figure 9. INL − Integral Nonlinearity − LSB INTEGRAL NONLINEARITY (INL) 1.5 DVDD = AVDD = 3.3 V, fs = 15 MSPS 1.0 0.5 0.0 −0.5 −1.0 −1.5 0 512 1024 1536 2048 2560 ADC Code Figure 10. 9 THS1215 www.ti.com SLAS292A – MARCH 2001 – REVISED MARCH 2004 TYPICAL CHARACTERISTICS (continued) FAST FOURIER TRANSFORM-MODE 1 0 AVDD = DVDD = 3.3 V, fs = 15 MSPS, fi = 3.58 MHz, −1dBFS Mode 1 Differential Power − dBFS −20 −40 −60 −80 −100 5.73 6.17 6.61 7.05 7.49 5.73 6.17 6.61 7.05 7.49 5.29 4.85 4.41 3.97 3.53 3.08 2.64 2.2 1.76 1.32 0.88 0.44 −140 0 −120 f − Frequency − MHz Figure 11. FAST FOURIER TRANSFORM-MODE 2 0 AVDD = DVDD = 3.3 V, fs = 15 MSPS, fi = 3.58 MHz, −1dBFS Mode 2 Differential Power − dBFS −20 −40 −60 −80 −100 5.29 4.85 4.41 3.97 3.53 3.08 2.64 2.2 1.76 1.32 0.88 0.44 −140 0 −120 f − Frequency − MHz Figure 12. BANDWIDTH 3 0 Amplitude − dB −3 −6 −9 −12 AVDD = DVDD = 3.3 V, fs = 15 MSPS −15 −18 2 20 f − Frequency − MHz Figure 13. 10 200 THS1215 www.ti.com SLAS292A – MARCH 2001 – REVISED MARCH 2004 PRINCIPLES OF OPERATION ANALOG INPUT The analog input AIN is sampled in the sample and hold unit, the output of which feeds the ADC CORE, where the process of analog-to-digital conversion is performed against ADC reference voltages, VREFT and VREFB. Connecting the EXTREF pin to one of two voltages, DGND or DVDD selects one of the two configurations of ADC reference generation. The ADC reference voltages come from either the internal reference buffer or completely external sources. Connect EXTREF to DGND for internal reference generation or to DVDD for external reference generation. CON0 and CON1 as described below, select the input configuration mode or place the device in power-down state. The ADC core drives out through output buffers to the data pins D0 to D11. The output buffers can be disabled by the OE pin. A single, sample-rate clock (15 MHz maximum) is required at pin CLK. The analog input signal is sampled on the rising edge of CLK, and corresponding data is output after the fifth following rising edge. The THS1215 can operate in differential Mode 1 or differential Mode 2, controlled by the configuration pins CON0 and CON1 as shown in Table 1. Mode 0 places the THS1215 in power-down or standby state for reduced power consumption. Table 1. Input Modes of Operation MODE CON1 CON0 0 0 0 Device powered down MODE OF OPERATION 1 0 1 Differential mode × 1 2 1 0 Differential mode × 0.5 3 1 1 Not used Modes 1 and 2 are shown in Figure 14. AIN− 1V AIN+ OUTPUT CODE 4095 0 AIN− 2V AIN+ OUTPUT CODE 4095 0 MODE 2, CON[1:0] = 10 MODE 1, CON[1:0] = 01 Figure 14. Input Mode Configurations The gain of the sample and hold changes with the CON1 and the CON0 inputs. Table 2 shows the gain of the sample and hold and the levels applied at the AIN+ and AIN– analog inputs for Mode 1 and Mode 2. The common mode level for the two analog inputs is at AVDD/2. Table 2. Input Mode Switching MODE CON1 CON0 (AIN+) – (AIN-) MIN (AIN+) – (AIN-) MAX S/H GAIN 1 0 1 –1 V 1V ×1 2 1 0 -2 V 2V ×0.5 11 THS1215 www.ti.com SLAS292A – MARCH 2001 – REVISED MARCH 2004 Table 2 assumes that the delta in ADC reference voltages VREFT and VREFB is set to 1 V, i.e., VREFT – VREFB = 1 V. Note that VREFB and VREFT can be set externally, which will scale the numbers given in this table. The user-chosen operating configuration and reference voltages determine what input signal voltage range the THS1215 can handle. The following sections explain both the internal signal flow of the device and how the input signal span is related to the ADC reference voltages, as well as the ways in which the ADC reference voltages can be buffered internally or externally applied. SIGNAL PROCESSING CHAIN (Sample and Hold, ADC) Figure 15 shows the signal flow through the sample and hold unit and the PGA to the ADC core. REFT AIN+ AIN− +1 VP+ SAMPLE AND −1 HOLD ADC CORE VP− REFB Figure 15. Analog Input Signal Flow Sample and Hold The differential sample and hold processes AIN with respect to the voltages applied to the REFT and REFB pins, to give a differential output (VP+) – (VP–) = VP given by: • VP = (AIN+) – ( AIN–) Analog-to-Digital Converter No matter what operating configuration is chosen, VP is digitized against ADC reference voltages VREFT and VREFB. The VREFT and VREFB voltages set the analog input span limits FS+ and FS–, respectively. Any voltages at AIN greater than REFT or less than REFB causes ADC over-range, which is signaled by OVR going high when the conversion result is output. Analog input A first-order approximation for the equivalent analog input circuit of the THS1215 is shown in Figure 16. The equivalent input capacitance CI is 5 pF typical. The input must charge/discharge this capacitance within the sample period of one half of a clock cycle. When a full-scale voltage step is applied, the input source provides the charging current through the switch resistance RSW (200 Ω) of S1 and quickly settles. In this case the input impedance is low. Alternatively, when the source voltage equals the value previously stored on CI, the hold capacitor requires no input current and the equivalent input impedance is high. 12 THS1215 www.ti.com SLAS292A – MARCH 2001 – REVISED MARCH 2004 VS+ VS − VCM RS THS1215 RSW RS RSW CI CI + _ VCM + _ Figure 16. Simplified Equivalent Input Circuit To maintain the frequency performance outlined in the specifications, the total source impedance should be limited to the following equation with fCLK = 15 MHz, CI = 5 pF, RSW = 200 Ω: R S 2f 1 –R C In(256) SW CLK I So, for applications running at a lower fCLK, the total source resistance can increase proportionally. The analog input of the THS1215 is a differential input that can be configured in various ways depending on the signal source and the required level of performance. A fully differential connection (see Figure 17) delivers the best performance from the converter. AVDD 2 R2 VIN+ C1 THS1215 R1 − AIN+ + R2 C2 VIN− C1 R1 − + AIN− C2 REFT REFB Figure 17. AC-Coupled Differential Input The analog input can be dc-coupled (see Figure 18) as long as the inputs are within the analog input common mode voltage range. For example (see Figure 18), VIN+ and VIN- are signals centered on GND with a peak-to-peak voltage of 2 V, and the circuit in Figure 18 is used to interface it with the THS1215. Assume AVDD 13 THS1215 www.ti.com SLAS292A – MARCH 2001 – REVISED MARCH 2004 of the converter is 3 V. Two problems have to be solved. The first is to shift common mode level (CML) from 0 V to 1.5 V (AVDD/2). To do that, a V bias voltage and an adequate ratio of R1 and R2 have to be selected. For instance, if V bias = AVDD = 3 V, then R1 = R2. The second is that the differential voltage has to be reduced from 4 V (2 x 2 V) to 1 V, and for that an attenuation of 4 to1 is needed. The attenuation is determined by the relation: (R3||2R2)/((R3||2R2) + 2R1). One possible solution is R1 = R2 = R3 = 150 Ω. In this case, moreover, the input impedance (2R1 + (R3||2R2)) is 400 Ω. The values can be changed to match any other input impedance. A capacitor, C, connected from AIN+ to AIN- helps filter any high frequency noise on the inputs, also improving performance. Note that the chosen value of capacitor C must take into account the highest frequency component of the analog input signal. VBIAS THS1215 VIN+ R1 R2 AIN+ R3 VIN− R1 AIN− R2 REFT VBIAS REFB Figure 18. DC-Coupled Differential Input Circuit A single-ended source may give better overall system performance when it is converted to a differential signal before driving the THS1215. The configuration in Figure 19 takes a VIN of 1 V and drives the 1:1 transformer ratio so that value of AIN+ and AIN– converts to full-scale value at the ADC digital output. With VIN at –1 V the value at AIN+ and AIN– converts to 0 at the ADC digital outputs. AV DD 2 THS1215 V IN AIN+ AIN− REFT REFB Figure 19. Transformer Coupled Single-Ended Input 14 THS1215 www.ti.com SLAS292A – MARCH 2001 – REVISED MARCH 2004 Digital Outputs The output of THS1215 is in unsigned binary code. The ADC input over-range indicator is output on pin OVRNG. Capacitive loading on the output should be kept as low as possible (a maximum loading of 10 pF is recommended) to ensure best performance. Higher output loading causes higher dynamic output currents and can therefore increase noise coupling into the part's analog front-end. To drive higher loads, the use of an output buffer is recommended. When clocking output data from THS1215, it is important to observe its timing relation to CLK. The pipeline ADC delay is 5 clock cycles to which the maximum output propagation delay needs to be added. THS1215 SN74ALVCH16841 DA11 DA0 12 1D9 1Q9 1D0 1Q0 2D1 2Q1 2D0 2Q0 2D7 2Q9 2D2 2Q2 ASIC or DSP 12 LE OE Figure 20. Buffered Output Connection THS1215 FIFO DA11 DA0 CLK 12 DSP D11 1Q15 D0 D15 1Q0 D12 HF flag 16 INTR WRTCLK 15 MHz Clock Figure 21. FIFO Connection Layout, Decoupling, and Grounding Rules Proper grounding and layout of the PCB on which THS1215 is populated is essential to achieve the stated performance. It is advised to use separate analog and digital ground planes that are spliced underneath the IC. THS1215 has digital and analog pins on opposite sides of the package to make this easier. Because there is no connection internally between analog and digital grounds, they have to be joined on the PCB. It is advised to do this at one point in close proximity to THS1215. Because of the high sampling rate and switched-capacitor architecture, THS1215 generates transients on the supply and reference lines. Proper decoupling of these lines is therefore essential. EVM decoupling is recommended as shown in Figure 22. 15 THS1215 www.ti.com SLAS292A – MARCH 2001 – REVISED MARCH 2004 +3.3VA +3.3VD +3.3VD +3.3VA U1 THS1215PW +3.3VD 8 LNK3 LNK4 OEB EXTREF OEB R2 R23 47K 47K AGND DVDD DGND 27 CLKVDD AGND EXTREF D0 ADCCLK 28 OEB 26 ADCCLK OEB CON0 3 CON1 2 EXTREF 4 CON0 CON1 EXTREF +3.3VD AVDD 20 CLK D1 LNK2 CON1 VINP 47K VINM CON0 CON1 R1 47K VINP 5 VINM 6 9 10 LNK5 TP1 25 ADCD00 24 ADCD01 23 ADCD02 CON0 D3 22 ADCD03 CON1 D4 21 ADCD04 EXTREF D5 18 ADCD05 D6 17 ADCD06 D7 16 ADCD07 AIN+ D8 15 ADCD08 AIN− D9 14 ADCD09 13 ADCD10 REFT D11 REFB OVRNG 12 11 TP2 C28 ADCD11 ADCOVRNG ADCD [00:11] VRB + VRT VRT 1 D2 D10 CON0 19 OE +3.3VD R24 7 VRB 10uF 24 AVDD AGND 27 DVDD 14 D0 13 12 ADCDB01 11 ADCDB02 10 D4 ADCDB03 9 D5 ADCDB04 8 ADCDB05 7 ADCDB06 6 ADCDB07 5 ADCDB08 4 ADCDB09 3 ADCDB10 2 ADCDB11 1 DACCLK 28 25 DGND 26 IOUT1 22 IOUT1 IOUT2 21 IOUT2 D2 C26 0.1uF _3.3VA IOUT1 D3 +3.3VD C62 470pF C63 0.1uF C64 470pF C65 0.1uF C66 470pF C67 0.1uF IOUT2 D6 D7 EXTLO +3.3VA 16 D8 +3.3VD D9 REFIO D10 FSADJ 17 C16 C5 0.01uF 0.1uF D12 + C17 C18 0.1uF 0.1uF 10uF R10 2K D13 +3.3VA CLK C15 MODE SLEEP C19 18 D11 COMP1 15 0.1uF C25 0.1uF 20 D1 ADCDB00 DACCLK C27 U3 THS5671AIPW +3.3VD +3.3VA COMP2 ADCDB[00:11] 19 23 0.1uF C6 0.1uF Figure 22. EVM Schematic DEFINITIONS OF SPECIFICATIONS AND TERMINOLOGY Integral Nonlinearity (INL) Integral nonlinearity refers to the deviation of each individual code from a line drawn from zero through full scale. The point used as zero occurs 1/2 LSB before the first code transition. The full-scale point is defined as level 1/2 LSB beyond the last code transition. The deviation is measured from the center of each particular code to the true straight line between these two end-points. Differential Nonlinearity (DNL) An ideal ADC exhibits code transitions that are exactly 1 LSB apart. DNL is the deviation from this ideal value. Therefore, this measure indicates how uniform the transfer function step sizes are. The ideal step size is defined here as the step size for the device under test, i.e., (last transition level - first transition level)/(2n -2). Using this definition for DNL separates the effects of gain and offset error. A minimum DNL better than -1 LSB ensures no missing codes. Offset and Gain Error Offset error (in LSBs) is defined as the average offset for all inputs, and gain error is defined as the maximum error (in LSBs) caused by the angular deviation from the offset corrected straight line. 16 THS1215 www.ti.com SLAS292A – MARCH 2001 – REVISED MARCH 2004 Analog Input Bandwidth The analog input bandwidth is defined as the maximum frequency of a 1-dBFS input sine wave that can be applied to the device for which an extra 3-dB attenuation is observed in the reconstructed output signal. Output Timing Output timing td(O) is measured from the 50% level of the CLK input falling edge to the 10%/90% level of the digital output. The digital output load is not higher than 10 pF. Output hold time th(O) is measured from the 50% level of the CLK input falling edge to the10%/90% level of the digital output. The digital output load is not less than 2 pF. Aperture delay td(A) is measured from the 50% level of the CLK input to the actual sampling instant. The OE signal is asynchronous. OE timing td(PZ) is measured from the VIH(min) level of OE to the high-impedance state of the output data. The digital output load is not higher than 10 pF. OE timing td(EN) is measured from the VIL(max) level of OE to the instant when the output data reaches VOH(min) or VOL(max) output levels. The digital output load is not higher than 10 pF. Signal-to-Noise Ratio + Distortion (SINAD) SINAD is the ratio of the rms value of the measured input signal to the rms sum of all other spectral components below the Nyquist frequency, including harmonics but excluding dc. The value for SINAD is expressed in decibels. Effective Number of Bits (ENOB) For a sine wave, SINAD can be expressed in terms of the number of bits. Using the following formula, • N = (SINAD – 1.76)/6.02 it is possible to get a measure of performance expressed as N, the effective number of bits. Thus, effective number of bits for a device for sine wave inputs at a given input frequency can be calculated directly from its measured SINAD. Total Harmonic Distortion (THD) THD is the ratio of the rms sum of the first six harmonic components to the rms value of the measured input signal and is expressed as a percentage or in decibels. Spurious Free Dynamic Range (SFDR) SFDR is the difference in dB between the rms amplitude of the input signal and the peak spurious signal. 17 PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty THS1215CDW ACTIVE SOIC DW 28 THS1215CDWR ACTIVE SOIC DW THS1215CDWRG4 ACTIVE SOIC THS1215CPW ACTIVE THS1215CPWR 20 Lead/Ball Finish MSL Peak Temp (3) Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 28 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM DW 28 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TSSOP PW 28 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE TSSOP PW 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS1215CPWRG4 ACTIVE TSSOP PW 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS1215IDW ACTIVE SOIC DW 28 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS1215IDWR ACTIVE SOIC DW 28 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS1215IDWRG4 ACTIVE SOIC DW 28 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS1215IPW ACTIVE TSSOP PW 28 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS1215IPWR ACTIVE TSSOP PW 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS1215IPWRG4 ACTIVE TSSOP PW 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 50 20 50 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2006 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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